CN203277331U - Leading wire support plate used for diode production - Google Patents

Leading wire support plate used for diode production Download PDF

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Publication number
CN203277331U
CN203277331U CN 201320270367 CN201320270367U CN203277331U CN 203277331 U CN203277331 U CN 203277331U CN 201320270367 CN201320270367 CN 201320270367 CN 201320270367 U CN201320270367 U CN 201320270367U CN 203277331 U CN203277331 U CN 203277331U
Authority
CN
China
Prior art keywords
support plate
leading wire
diode production
wire support
handrail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201320270367
Other languages
Chinese (zh)
Inventor
黄钦
王平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU GUANGDA ELECTRONICS Co Ltd
Original Assignee
CHANGZHOU GUANGDA ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU GUANGDA ELECTRONICS Co Ltd filed Critical CHANGZHOU GUANGDA ELECTRONICS Co Ltd
Priority to CN 201320270367 priority Critical patent/CN203277331U/en
Application granted granted Critical
Publication of CN203277331U publication Critical patent/CN203277331U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Steps, Ramps, And Handrails (AREA)

Abstract

The utility model discloses a leading wire support plate used for diode production. The leading wire support plate used for the diode production comprises a support plate body made of a solid or hollow plate material, one end of the support plate is equipped with a handrail, and the support plate body and the handrail are an integrated structure. The structure of the leading wire support plate is simple, compact and reasonable. The leading wire support plate supports a graphite plate in which a leading wire is arranged, and after the graphite plate is welded with the other one graphite plate, the leading wire support plate is drawn out, so that the two graphite plates can be in seamless welding together. The leading wire support plate used for the diode production is low in manufacture cost, and enables the production efficiency to be improved imperceptibly.

Description

A kind of diode production lead-in wire supporting plate
Technical field
The utility model relates to a kind of diode processing production equipment, especially relates to a kind of diode production lead-in wire supporting plate.
Background technology
Stamp-mounting-paper diode claims again crystal diode, and it is a kind of electronic device with unidirectional conduction current.In semiconductor diode inside, two lead terminals of a PN junction are arranged, this electronic device possesses the conductibility of unidirectional current according to the direction of applied voltage.In general, the surface mounting crystal diode is a P-N junction interface that is formed by the capable semiconductor of P and N type semiconductor sintering.Its characteristic is a kind of device with two electrodes, only allows electric current to be flow through by single direction, and we are commonly referred to " rectification " function the sense of current that most of stamp-mounting-paper diode possesses.The most general function of stamp-mounting-paper diode is exactly only to allow electric current to be passed through by single direction, blocking-up in the time of oppositely.Yet in processing welding diode process, one group of end that goes between is welded together by weld tabs-chip-weld tabs manufacturing procedure.But such manufacturing procedure easily cause a graphite plate that is assembled with lead-in wire in the inversion process because the self gravitation reason hangs down, and be difficult for two package leads are welded together.
The utility model content
The purpose of this utility model is the problem that solves above-mentioned existence, and a kind of a kind of diode production simple in structure, easy to use lead-in wire supporting plate is provided.
The purpose of this utility model realizes as follows: a kind of diode production has poppet body solid or that hollow board material is made with the lead-in wire supporting plate, and an end of described poppet body is provided with handrail, and described poppet body and handrail are structure as a whole.
Above-mentioned a kind of diode production lead-in wire supporting plate, the thickness of its described poppet body is at least 1mm.
Above-mentioned a kind of diode production is with the lead-in wire supporting plate, its described handrail be arc structure, the angle of described poppet body and handrail is 30 ° to 120 °.
Above-mentioned a kind of diode production lead-in wire supporting plate, the bottom of its described poppet body is provided with reinforcement.
Above-mentioned a kind of diode production lead-in wire supporting plate is characterized in that: described reinforcement is made bearing diagonal, the perpendicular support or horizontal support.
Advantage of the present utility model: lead-in wire support board structure of the present utility model is simple, compact, reasonable; Described lead-in wire supporting plate is extracted the lead-in wire supporting plate out after holding one of them graphite plate that lead-in wire is housed and the welding of another graphite plate, just can be with two graphite plate seamless weldings together.Its cost of manufacture is low, virtually improved production efficiency.
Description of drawings
Content of the present utility model is easier to be expressly understood in order to make, and the below is described in further detail the utility model, wherein according to specific embodiment also by reference to the accompanying drawings
Fig. 1 is structural representation of the present utility model;
Reference numeral: 1, body, 2, handrail.
Embodiment:
As shown in Figure 1, a kind of diode production has poppet body 1 solid or that hollow board material is made with the lead-in wire supporting plate, and an end of described poppet body 1 is provided with handrail 2, and described poppet body 1 and handrail 2 are structure as a whole.The thickness of described poppet body 1 is at least 1mm.Described handrail 2 be arc structure, described poppet body 1 is 30 ° to 120 ° with the angle of handrail 2.The bottom of described poppet body 1 is provided with reinforcement, and described reinforcement is made bearing diagonal, the perpendicular support or horizontal support.
Above-described specific embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; institute is understood that; the above is only specific embodiment of the utility model; be not limited to the utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.

Claims (5)

1. a diode production is with the lead-in wire supporting plate, and it is characterized in that: have poppet body (1) solid or that hollow board material is made, an end of described poppet body (1) is provided with handrail (2), and described poppet body (1) and handrail (2) are structure as a whole.
2. a kind of diode production according to claim 1 is with the lead-in wire supporting plate, and it is characterized in that: the thickness of described poppet body (1) is at least 1mm.
3. a kind of diode production according to claim 2 with the lead-in wire supporting plate, is characterized in that: described handrail (2) be arc structure, described poppet body (1) is 30 ° to 120 ° with the angle of handrail (2).
4. a kind of diode production according to claim 3 is with the lead-in wire supporting plate, and it is characterized in that: the bottom of described poppet body (1) is provided with reinforcement.
5. according to claim 1 or 4 described a kind of diode production are with the lead-in wire supporting plates, and it is characterized in that: described reinforcement is made bearing diagonal, the perpendicular support or horizontal support.
CN 201320270367 2013-05-15 2013-05-15 Leading wire support plate used for diode production Expired - Fee Related CN203277331U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320270367 CN203277331U (en) 2013-05-15 2013-05-15 Leading wire support plate used for diode production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320270367 CN203277331U (en) 2013-05-15 2013-05-15 Leading wire support plate used for diode production

Publications (1)

Publication Number Publication Date
CN203277331U true CN203277331U (en) 2013-11-06

Family

ID=49507685

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320270367 Expired - Fee Related CN203277331U (en) 2013-05-15 2013-05-15 Leading wire support plate used for diode production

Country Status (1)

Country Link
CN (1) CN203277331U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131106

Termination date: 20200515