CN203273424U - Semiconductor chip combination light emitting lamp - Google Patents
Semiconductor chip combination light emitting lamp Download PDFInfo
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- CN203273424U CN203273424U CN2013202886874U CN201320288687U CN203273424U CN 203273424 U CN203273424 U CN 203273424U CN 2013202886874 U CN2013202886874 U CN 2013202886874U CN 201320288687 U CN201320288687 U CN 201320288687U CN 203273424 U CN203273424 U CN 203273424U
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Abstract
The utility model discloses a semiconductor chip combination light emitting lamp, and belongs to the technical field of lamp lighting. According to the semiconductor chip combination light emitting lamp, an OGC light source is adopted, the OGC light source is a combination body of oil or solid-state wax, a glass container or a ceramic container and a chip, the combination body is named as the OGC light source in short, and the semiconductor chip combination light emitting lamp is a revolutionary change in the semiconductor chip light emitting lighting age. The semiconductor chip combination light emitting lamp comprises a power interface and an outer shell, wherein the power interface is connected with the outer shell. The semiconductor chip combination light emitting lamp is characterized in that a driving power source is arranged inside the power interface, heat dissipation materials are packaged inside the outer shell, the surface of the bottom of the outer shell is fixedly connected with the chip, a lens is arranged at the lower end of the outer shell, the chip is located inside the lens, and the driving power source is connected with the chip. The semiconductor chip combination light emitting lamp is good in heat dissipation effect, the service life of the chip is long, the luminous flux is high, and the light use ratio is high.
Description
Technical field
The utility model belongs to the lamp lighting technical field, relates to a kind of semiconductor chip illuminated in combination light fixture.
Background technology
In recent years, the arriving in luminous epoch of semiconductor chip, the great power LED development is very fast, and larger improvement is arranged on structure and performance, and output rises, prices; Also developing single power is the super high power white light LEDs of 100W.With several years ago compare, significant progress is arranged on luminous efficiency.For example, Edison company 20W white light LEDs several years ago, its luminous flux is 700lm, luminous efficiency is 35lm/W.The 100W white light LEDs of exploitation in 2007, its luminous flux is 6000lm, luminous efficiency is 60lm/W.The new cold white light LEDs of XLamp XR～E of releasing of Cree company, its maximum brightness gear QS luminous flux when 350mA can reach 107～114lm.These well behaved great power LEDs have created condition for exploitation LED white-light illuminating light fixture.
LED is photoelectric device, only has 15%～25% electric energy to convert luminous energy in its course of work, and remaining electric energy is energy transform into heat energy nearly all, and the temperature of LED is raise.In great power LED, heat radiation is a large problem.For example, if 1 its photoelectric transformation efficiency of 10W white light LEDs is 20%, the electric energy energy transform into heat energy that 8W is arranged, if do not add cooling measure, the device core temperature of great power LED can rise rapidly, when its junction temperature (TJ) rises over maximum allowable temperature (being generally 150 ℃), great power LED can damage because of overheated.Therefore in the high-power LED lamp design, topmost design work is exactly designing and developing of heat radiation and the brightness that improves it.
The heat sink conception of existing high-powered LED lamp is as follows: when the LED chip aluminium base linked the power that is combined into the design needs, the mode of encapsulation was routinely carried out the wire bonds point of packaging protection LED chip.When working, LED chip can produce high temperature; temperature descends when not working; at this moment protecting the glue of LED chip solder joint can produce physical phenomenon expands with heat and contract with cold; glue constantly pulls the pad of LED chip wire at the breathing circulation time, will break the wire solder joint of LED chip or draw the life-span of untwisting bundle LED chip through long effect.And the heat dissipating method of traditional high-powered LED lamp is to dispel the heat by the mode of aluminium with heat-conducting mode, and this mode heat dispersion is poor and bulky expensive.Many new heat dissipation metal modes are arranged, and can solve its heat dissipation problem is exactly to solve the brightness that improves it, and the cost compare of heat dissipation metal is expensive.
Summary of the invention
For the deficiency that exists in background technology, the purpose of this utility model is to provide a kind of semiconductor chip illuminated in combination light fixture, adopt the OGC light source, the OGC light source is a kind of assembly by liquid oils or solid state wax (oil), glass container or ceramic vessel (glass container), chip (chip).
For achieving the above object, the utility model provides following technical scheme: a kind of semiconductor chip illuminated in combination light fixture, comprise power interface and shell, power interface is connected with shell, described power interface inside is provided with driving power, and described enclosure is packaged with heat sink material, the affixed chip of the lower surface of shell, the lower end of shell is provided with lens, and this chip is positioned at the inside of lens; Described driving power is connected with chip.
Above-mentioned power interface comprises screw socket positive source and screw socket power cathode, and this screw socket power cathode is connected with shell by lamp body connecting piece.
The upper surface of above-mentioned shell offers opening, and adaptive on opening seal is arranged.
Above-mentioned shell is glass container or ceramic vessel.
Above-mentioned heat sink material is that liquid oils or solid are cured.
The material of above-mentioned lens is glass or plastics.
The utility model beneficial effect compared to existing technology: the utility model utilizes secondary heat radiation, good heat dissipation effect; The chip long service life; Luminous flux is high, and the utilization rate of light is high.
Description of drawings
Fig. 1 is the structural representation that employing liquid oils of the present utility model is done heat sink material;
Fig. 2 is the cured structural representation of doing heat sink material of employing solid of the present utility model.
Number in the figure implication: 1. screw socket positive source; 2. screw socket power cathode; 3. lamp body connecting piece; 4. shell; 5. chip; 6. lens; 7. liquid oils; 8. seal; 9. driving power; 10. solid is cured.
The specific embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present utility model is described in detail as preferred.Following examples are used for explanation the utility model, but are not used for limiting scope of the present utility model.
As Fig. 1-shown in Figure 2, a kind of semiconductor chip illuminated in combination light fixture, comprise power interface and shell 4, power interface is connected with shell 4, described power interface inside is provided with driving power 9, and described shell 4 inside are packaged with heat sink material, the affixed chip 5 of the lower surface of shell 4, the lower end of shell 4 is provided with lens 6, and this chip 5 is positioned at the inside of lens 6; Described driving power 9 is connected with chip 5.
As preferably, above-mentioned power interface comprises screw socket positive source 1 and screw socket power cathode 2, and this screw socket power cathode 2 is connected with shell 4 by lamp body connecting piece 3.
As preferably, the upper surface of above-mentioned shell 4 offers opening, and adaptive on opening seal 8 is arranged.
As preferably, above-mentioned shell 4 is glass container or ceramic vessel.
As preferably, above-mentioned heat sink material is liquid oils 7 or solid cured 10.
As preferably, the material of above-mentioned lens 6 is glass or plastics.
OGC light source described in the utility model is a kind of assembly by liquid oils or solid state wax (oil), glass container or ceramic vessel (glasscontainer), chip (chip), utilize the abbreviation of the initial of three kinds of material English words to be called for short called after OGC light source, in the semiconductor chip luminous lighting epoch, it is the change of revolution.
Encapsulation: first filled with fluid oil 7 or solid are cured 10 in glass container, then carry out encapsulation process with seal 8.
Secondary radiating principle: do shell 4 with glass container or ceramic vessel, the effect that is mainly used in dispelling the heat for the first time; As heat sink material, be used for the effect of secondary heat radiation with liquid oils 7 or solid cured 10.
Operation principle of the present utility model: begin luminous after chip 5 energisings of the present utility model, can produce a large amount of heat energy during opto-electronic conversion, the bottom of heat by glass container is delivered to 10 li of liquid oils 7 or solid state wax, the end, fall in the heat that produces when luminous chip 5 by liquid oils 7 or solid state wax 10, improves luminous efficient.
The caloric value of chip 5 is left automatically by glass container, liquid oils or solid state wax, and temperature remaining on (45 °-55 °)+outer border temperature, is the temperature of chip 5 luminous the bests, and extends the service life of chip.
Make the substrate of chip 5 of glass, substrate is the lower surface of glass, has so just improved the luminance 30%-50% of chip 5.Due to the illuminator of chip 5 be 360 ° luminous, they are opaque to make substrate with metal or pottery, and the brightness of chip 5 has been blocked 180 ° of luminous fluxes that just reduce chip 5, make substrate with glass, how many luminous of chip 5 is not blocked, and has naturally just improved luminous flux.Use clean oil in glass container, make glass and oil form an integral body, the light transmission reverse side of chip 5 is just to have reduced the cross section, has improved again the utilization rate of light simultaneously.
The above is only preferred embodiment of the present utility model; should be understood that; for those skilled in the art, under the prerequisite that does not break away from the utility model know-why, make some improvement and modification and also should be considered as protection domain of the present utility model.
Claims (6)
1. semiconductor chip illuminated in combination light fixture, comprise power interface and shell, power interface is connected with shell, it is characterized in that: described power interface inside is provided with driving power, described enclosure is packaged with heat sink material, the affixed chip of the lower surface of shell, the lower end of shell is provided with lens, and this chip is positioned at the inside of lens; Described driving power is connected with chip.
2. semiconductor chip illuminated in combination light fixture according to claim 1, it is characterized in that: described power interface comprises screw socket positive source and screw socket power cathode, this screw socket power cathode is connected with shell by lamp body connecting piece.
3. semiconductor chip illuminated in combination light fixture according to claim 2, it is characterized in that: the upper surface of described shell offers opening, and adaptive on opening seal is arranged.
4. according to claim 1 and 2 or 3 described semiconductor chip illuminated in combination light fixtures, it is characterized in that: described shell is glass container or ceramic vessel.
5. semiconductor chip illuminated in combination light fixture according to claim 1, it is characterized in that: described heat sink material is that liquid oils or solid are cured.
6. semiconductor chip illuminated in combination light fixture according to claim 1, it is characterized in that: the material of described lens is glass or plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202886874U CN203273424U (en) | 2013-05-23 | 2013-05-23 | Semiconductor chip combination light emitting lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202886874U CN203273424U (en) | 2013-05-23 | 2013-05-23 | Semiconductor chip combination light emitting lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203273424U true CN203273424U (en) | 2013-11-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202886874U Expired - Fee Related CN203273424U (en) | 2013-05-23 | 2013-05-23 | Semiconductor chip combination light emitting lamp |
Country Status (1)
| Country | Link |
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| CN (1) | CN203273424U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104180204A (en) * | 2013-05-23 | 2014-12-03 | 范文昌 | Semiconductor chip combined illuminating lamp |
-
2013
- 2013-05-23 CN CN2013202886874U patent/CN203273424U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104180204A (en) * | 2013-05-23 | 2014-12-03 | 范文昌 | Semiconductor chip combined illuminating lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131106 Termination date: 20160523 |