CN203052594U

CN203052594U - High-power light-emitting diode (LED) lamp heat-dissipating component

Info

Publication number: CN203052594U
Application number: CN2012207549321U
Authority: CN
Inventors: 范文昌
Original assignee: Individual
Current assignee: Individual
Priority date: 2012-12-24
Filing date: 2012-12-24
Publication date: 2013-07-10
Anticipated expiration: 2022-12-24

Abstract

A high-power light-emitting diode (LED) lamp heat-dissipating component comprises an outer shell, a power interface, an LED driving power source, an LED chip and an LED chip substrate. The LED chip is fixedly connected with the LED chip substrate. The LED chip and the LED chip substrate are wrapped with solid wax, or the LED chip and the LED chip substrate are soaked in liquid oil, and the solid wax or the liquid oil is encapsulated by the outer shell. After the technology is adopted, the service life of the LED chip can be prolonged by multiple times. The solid wax or the liquid oil is used as a heat-dissipating material so that the heat-dissipating capacity of an LED lamp is greatly improved, temperature can be reduced by 10-30 DEG C more compared with the temperature achieved through a common heat-dissipating method, and the service life of the high-power LED lamp is prolonged.

Description

The high-power LED lamp radiating subassembly

Technical field:

The utility model relates to a kind of LED light fixture, particularly a kind of high-power LED lamp radiating subassembly.

Background technology:

In recent years, the great power LED development is very fast, and bigger improvement is arranged on structure and performance, and output rises, price descends; Also developing single power is the super high power white light LEDs of 100W.With several years ago compare, in luminous efficiency significant progress is arranged.For example, Edison company 20W white light LEDs several years ago, its luminous flux is 700lm, luminous efficiency is 35lm/W.The 100W white light LEDs of exploitation in 2007, its luminous flux is 6000lm, luminous efficiency is 60lm/W.The new cold white light LEDs of releasing of XLamp XR～E of Cree company, its maximum brightness retaining QS luminous flux when 350mA can reach 107～114lm.These well behaved great power LEDs have created condition for exploitation LED white-light illuminating light fixture.

LED is photoelectric device, has only 15%～25% electric energy to convert luminous energy in its course of work, and remaining electric energy nearly all converts heat energy to, and the temperature of LED is raise.In great power LED, heat radiation is a big problem.For example, 1 10W white light LEDs is if its photoelectric transformation efficiency is 20%, then there is the electric energy of 8W to convert heat energy to, if do not add cooling measure, then the device core temperature of great power LED can rise rapidly, when its junction temperature (TJ) rises above maximum allowable temperature (generally being 150 ℃), great power LED can damage because of overheated.Therefore in the high-power LED lamp design, topmost design work is exactly heat dissipation design.

The heat sink conception of existing high-powered LED lamp is as follows: when the led chip aluminium base linked the power that is combined into the design needs, the mode of encapsulation was routinely carried out the wire bonds point of packaging protection led chip.When working, led chip can produce high temperature; temperature descends when not working; at this moment protecting the glue of led chip solder joint can produce physical phenomenon expands with heat and contract with cold; glue constantly spurs the pad of led chip lead at the breathing circulation time, the life-span that will break the lead solder joint of led chip or draw untwisting bundle led chip through long effect.And the heat dissipating method of traditional high-powered LED lamp is to dispel the heat by the mode of aluminium with heat-conducting mode, this mode heat dispersion difference and bulky expensive.

The utility model content:

In order to address the above problem, the utility model provides a kind of radiating subassembly of high-power LED lamp.

For achieving the above object, the utility model is by the following technical solutions:

A kind of high-power LED lamp radiating subassembly comprises shell, power interface, LED driving power, led chip and led chip substrate, and led chip and led chip substrate are affixed.Described led chip and led chip substrate wrap up with solid state wax, or with described led chip and led chip substrate immersion in fluid oil, described solid state wax or fluid oil are encapsulated by shell.

After the utility model adopts above-mentioned technology, can make prolong several times the service life of led chip.As heat sink material, the heat dispersion of high-powered LED lamp is significantly improved with solid state wax or liquid oils, can make temperature than conventional radiating mode decline 10-30 degree, the service life of having improved high-powered LED lamp.

Description of drawings:

Fig. 1 is the structural representation of a preferred forms of the present utility model;

Fig. 2 is the structural representation of another preferred forms of the present utility model.

Reference numeral among the figure: 1. screw socket positive source; 2. screw socket power cathode; 3.LED driving power; 4. solid state wax; 5.LED chip substrate; 6. fluid oil; 7. interior lampshade; 8. lampshade

The specific embodiment:

Figure 1 illustrates a kind of high-power LED lamp and radiating subassembly thereof, screw socket positive source 1 and screw socket power cathode 2 are formed the power interface of light fixture, and led drive circuit 3 is arranged on described power interface inside.Led chip and led chip substrate 5 are fixed together, and at led chip and led chip substrate 5 external application solid state wax 4 parcels, described solid state wax 4 is by interior lampshade 7 encapsulation.Solid state wax 4 is used for to led chip and 5 heat radiations of led chip substrate.Lampshade 8 constitutes the lamp body shell.

A kind of high-power LED lamp and radiating subassembly screw socket positive source 1 thereof and screw socket power cathode 2 are formed the power interface of light fixture shown in figure 2, and led drive circuit 3 is arranged on described power interface inside.Led chip and led chip substrate 5 are fixed together, and led chip and led chip base stage 5 are immersed in the fluid oil 6, and described fluid oil 6 is by interior lampshade 7 encapsulation.Fluid oil 6 is that fluid oil 6 produces convection current in the portion space in the enclosure, will be dispersed in the external environment condition from the heat of led chip and led chip substrate receiving the heat that led chip and led chip substrate pass to.Lampshade 8 constitutes the lamp body shell.

Though, the preferred specific embodiment of the present utility model has been described above, but, the various fleshes and bloods that illustrate not utility model are construed as limiting, the person of an ordinary skill in the technical field after having read specification can to before the described specific embodiment make an amendment and be out of shape, and do not deviate from essence and the scope of utility model.Therefore the utility model is not to be limited by top specific descriptions, but is defined by the claims.

Claims

1. high-power LED lamp radiating subassembly, comprise shell, power interface, LED driving power, led chip and led chip substrate, led chip and led chip substrate are affixed, it is characterized in that, described led chip and led chip substrate wrap up with solid state wax, or with described led chip and led chip substrate immersion in fluid oil, described solid state wax or fluid oil are encapsulated by shell.