CN203259470U - Monolithic integrated miniature infrared gas sensor - Google Patents
Monolithic integrated miniature infrared gas sensor Download PDFInfo
- Publication number
- CN203259470U CN203259470U CN 201320269323 CN201320269323U CN203259470U CN 203259470 U CN203259470 U CN 203259470U CN 201320269323 CN201320269323 CN 201320269323 CN 201320269323 U CN201320269323 U CN 201320269323U CN 203259470 U CN203259470 U CN 203259470U
- Authority
- CN
- China
- Prior art keywords
- infrared
- upper substrate
- pit
- infrared light
- lower substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
The utility model provides a monolithic integrated miniature infrared gas sensor comprising an upper substrate with a pit, and a lower substrate with a pit, wherein a hollow air chamber is formed among the upper substrate, the lower substrate and a bonding dummy wafer which are combined together; the depression of the pit in the upper substrate is provided with an infrared light source, the side wall of the pit in the upper substrate is provided with opposite slopes on which reflective micromirrors are arranged; the depression of the pit in the lower substrate is provided with one or more grating structures and infrared probes same as the grating structures in number; the positions and the inclination angles of the infrared light source on the upper substrate, the grating structures on the lower substrate and the infrared probes are matched with those of the reflective micromirrors on the slope of the pit of the upper substrate, so that infrared light emitted by the infrared light source is split through the grating structures, then emitted towards the reflective micromirrors together with narrow-band infrared light in a wave band corresponding to the characteristic absorption peak of detected gas, and accurately emitted into the infrared probes after being reflected by the reflective micromirrors.
Description
Technical field
The utility model relates to a kind of sensor, especially a kind of infrared gas sensor.
Background technology
Along with the quickening of process of industrialization and the development of Internet of Things industry, the exploitation of Intelligent environment monitoring system becomes one of current research focus, and gas detector is as the core of this system, and therefore, the gas detector of development high-performance, high integration then becomes the current most important thing.About the integrated gas detector of modularization, some research institutions have done relevant research for a long time, and produce the model machine blank, such as: 2008, Northcentral University has designed a kind of absorption optical spectral pattern gas infrared sensor, and has proposed a kind of Integration Design scheme of device level.Adopt MEMS technique that infrared two-way sensitive element and optical filter are made into detecting head, then by micropackaging and small integrated technology detecting head, infrared light supply, screen pack are integrated in the air chamber.Britain Cranfield University university is integrated in infrared emanator, narrow band filter slice, pyroelectric sensor in the cylindrical shell, and the shell wall is carried out special optical design and process, make more infrared radiation arrive the window of infrared eye, improve greatly the sensitivity (up to 3500V/W) of device, made low-cost and high efficiency carbon dioxide NDIR sensor.It is integrated that above-mentioned two schemes only is confined to the modularization of device, really do not solve the various errors of bringing in the module assembled process, even the Problem of Failure of device, therefore, can't realize that high reliability and microminiaturized gas detect the micro sensing structure.
Along with the further innovation of technology, these are device even be integrated on the same substrate independently, so that device volume is very little, integrated level is higher.At " the MEMS technology is used for infrared device and a makes " literary composition, the Micromachined Electron Tunneling infrared eye was once successfully developed in the JPL laboratory.This detector adopts the MEMS(MEMS (micro electro mechanical system)) technology realizes the pneumatic infrared acquisition principle of traditional boxlike, and make the tunnel detection architecture and replace original complicated optical detection structure, on silicon chip, process the air chamber microcavity with methods of micro-mechanics.By detecting the film deformation that causes owing to the infrared absorption effect, realize the measurement of infrared radiation.The method has realized the Integration Design of Micromachined Electron Tunneling formula detector and air chamber light path, for certain basis has been established in the research of integrated, microminiaturized gas-detecting device.Wuhan country photo-electronics lab successfully is integrated in heat radiation infrared light supply and detecting structure on the same substrate, and utilizes the shell air chamber to make infrared CO2 sensor.The shortcoming of this sensor is only to can be used in surveys CO2 gas, surveys other multiple gases such as need, also need use other sensing system, and therefore, integrated level is poor.Although realized integrated at aspects such as infrared eye and air chamber structure, infrared light supply and detectors, but the mini type gas sensor that up to now, yet there are no the Highgrade integration of the multiple MEMS structure assemblies such as infrared eye, infrared light supply, micro mirror to the one chip is reported to some extent.Therefore, it is very considerable to research and develop such integrated micro-nano structure application prospect.
Summary of the invention
The purpose of this utility model mainly is the traditional modular combination of breakthrough, pieces together mode, the Miniature infrared gas sensor of exploitation Highgrade integration, this sensor mainly be with infrared light supply, micro mirror, grating, that infrared eye carries out monolithic is integrated, by infrared detector array and optical grating construction array are set, can realize detection of gas with multiple constituents.The technical solution adopted in the utility model is:
A kind of monolithic integrated miniature infrared gas sensor comprises:
Upper substrate and the lower substrate with pit with pit, and the false sheet of the bonding between upper substrate and lower substrate, the false sheet of upper substrate, lower substrate and bonding combines, the middle air chamber that forms hollow;
The recess of upper substrate pit is provided with infrared light supply, and the sidewall of upper substrate pit has relative inclined-plane, is provided with the reflection micro mirror on relative inclined-plane; Infrared light supply is electrically connected the electrode of upper substrate appearance;
The recess of lower substrate pit is distributed with one or more optical grating constructions, and the infrared eye consistent with optical grating construction quantity; Infrared eye is electrically connected the electrode of lower substrate appearance;
Match in position and the angle of inclination of reflecting micro mirror on the position that optical grating construction on the position of infrared light supply, the lower substrate, infrared eye distribute on the upper substrate and the upper substrate pit inclined-plane, so that after the light splitting of the infrared light that infrared light supply sends process optical grating construction, with the arrowband infrared light directive reflection micro mirror of the corresponding wave band of tested gas characteristic infrared absorption peak, and after the reflection of reflection micro mirror, accurately be incident to infrared eye;
Have air hole with extraneous exchanging gas at upper substrate, lower substrate or the false sheet of bonding.
Further, described infrared light supply is electrically connected with the electrode of upper substrate appearance by the TSV through hole.
Further, described infrared eye is electrically connected with the electrode of lower substrate appearance by the TSV through hole.
Further, described infrared light supply adopts Vacuum Package.
Further, described infrared eye adopts Vacuum Package.
Further, the pit of upper substrate is the truncated rectangular pyramids shape.
Further, the false sheet of bonding is that the single or multiple lift material forms, and the material of the false sheet of bonding comprises silicon, monox, silicon nitride.
Further, described infrared light supply and reflection micro mirror all adopt the MEMS processes to be made.
Further, described infrared eye and optical grating construction all adopt the MEMS processes to be made.
Further, the false sheet of upper substrate, lower substrate and bonding is bonded together by bonding techniques.
Principle of the present utility model is, the stronger absorption that tested gas has for the infrared light of specific wavelength, and along with the difference of tested gas concentration, the infrared light intensity that arrives infrared eye also can change, the electrical signal of infrared eye output changes, according to the variation of electrical signal, thereby can record the concentration of tested gas.The effect of optical grating construction is to replace traditional optical filter, utilize the grating beam splitting technology, by grating space reasonable in design and width, the degree of depth, so that the broadband infrared light that infrared light supply sends becomes arrowband window light source, like this so that the reflection micro mirror corresponding with the arrowband infrared light ability directive of the corresponding wave band of tested gas characteristic infrared absorption peak.The reflection micro mirror designs in order to increase ultrared light path, can make tested gas more abundant to the absorptance of infrared light.The false sheet of bonding can make air chamber have suitable height, thereby also can adjust the light path of gas absorption.The position that optical grating construction and infrared eye distribute on the position of infrared light supply, the lower substrate will accurately be controlled with position and the angle of inclination of reflection micro mirror, cooperatively interact, after guaranteeing that infrared light that infrared light supply sends is through the optical grating construction light splitting, just in time incide again the infrared absorption district of infrared eye behind the Multi reflection through the reflection micro mirror.
In order to realize to survey the infrared sensor of multicomponent gas, can make polytype optical grating construction at lower substrate, and make the infrared detector array of correspondence position structure at lower substrate.Finally can realize single light source to the combination of multidetector, also can realize multiple light courcess to the combination of multidetector, according to user's demand with to the requirement of volume, carry out the coupling design of high integration.
Advantage of the present utility model:
(1) utilizes the grating beam splitting technology, the infrared-gas device of a kind of full monolithic high integration free of light filter of the proposition of novelty.
(2) propose a kind of cleverly air chamber light channel structure, finally realize the air chamber structure that microminiaturization can be integrated in conjunction with gordian techniquies such as wafer scale low-temperature bondings.
(3) design multiple optical grating construction, make detector array, realize the multicomponent gas detection.
Description of drawings
Fig. 1 is basic composition and the light path design synoptic diagram of single component infrared gas sensor.
Fig. 2 is basic composition and the light path design synoptic diagram of bi-component infrared gas sensor.
Fig. 3 is embodiment two perspective view.
Fig. 4 is the optical grating construction synoptic diagram of bi-component infrared gas sensor.
Fig. 5 is basic composition and the light path design synoptic diagram of polycomponent (greater than 3 kinds) infrared gas sensor.
Fig. 6 is the optical grating construction synoptic diagram of polycomponent infrared gas sensor.
Embodiment
The utility model is described in further detail below in conjunction with concrete drawings and Examples.
Embodiment one, is a kind of single component infrared gas sensor.
As shown in Figure 1: this infrared gas sensor comprises the upper substrate 101 with pit and the lower substrate 108 with pit, and the false sheet 103 of the bonding between upper substrate 101 and lower substrate 108.The false sheet 103 of upper substrate 101, lower substrate 108 and bonding is combined by the low-temperature bonding technical key, the middle air chamber 107 that forms hollow.The false sheet 103 of bonding can form for the single or multiple lift material, and in order to realize and the compatibility of CMOS technique that the false sheet 103 of bonding can be selected the materials such as silicon, monox, silicon nitride, the thickness of the false sheet 103 of bonding can be adjusted according to the light path of gas absorption.The pit of upper substrate 101 is the truncated rectangular pyramids shape.
Have air hole (not drawing among Fig. 1) with extraneous exchanging gas at upper substrate 101, as tested gas access way.This air hole also can be opened on lower substrate 108 or the false sheet 103 of bonding.
Recess at upper substrate 101 pits is processed with MEMS infrared light supply 102, and the sidewall of upper substrate 101 pits has the relative inclined-plane of special angle, is processed with MEMS reflection micro mirror 1041,1042 on relative inclined-plane.Infrared light supply 102 is the MEMS device, processes by Surface-Micromachining and body processing technology, and infrared light supply 102 adopts Vacuum Package, to reduce heat transmission, thermal convection; 101 of infrared light supply 102 and upper substrates are carried out the isolation of certain heat in addition, can reduce and upper substrate 101 between thermal diffusion, to increase infrared radiation efficient.Infrared light supply 102 is electrically connected with the electrode 1091 of upper substrate appearance by TSV through hole 1101, powers for infrared light supply 102 by electrode 1091.Reflection micro mirror 1041, the 1042nd designs in order to increase ultrared light path.
Recess at lower substrate 108 pits is processed with an optical grating construction 106 and an infrared eye 105.Infrared eye 105 and optical grating construction 106 are the MEMS device, process by Surface-Micromachining and body processing technology, wherein infrared eye 105 needs Vacuum Package, to improve the infrared absorption district to the absorption of infrared energy, reduce the thermal convection effect, improve detector sensitivity and precision.Optical grating construction 106 according to tested gas characteristic infrared absorption peak, designs corresponding grating space and width, the degree of depth as the band selection window, and the material of making optical grating construction 106 can be Au, Ag, Al and TiN etc.The effect of optical grating construction 106 is to replace traditional optical filter, utilizes the grating beam splitting technology, by grating space reasonable in design and width, the degree of depth, so that the broadband infrared light that infrared light supply sends becomes arrowband window light source.Infrared eye 105 is electrically connected with the electrode 1092 of lower substrate appearance by TSV through hole 1102, thereby realization is drawn the electric signal of infrared eye 105 and powered.
Reflection micro mirror 1041 on the position that optical grating construction 106 and infrared eye 105 distributes on the position of infrared light supply 102, the lower substrate on the upper substrate and the upper substrate pit inclined-plane, 1042 position, angle of inclination needs accurately cooperate, so that after 106 light splitting of the infrared light that infrared light supply 102 sends process optical grating construction, arrowband infrared light directive reflection micro mirror 1041 with the corresponding wave band of tested gas characteristic infrared absorption peak, through behind reflection micro mirror 1041,1042 the first back reflection, just in time incide the infrared absorption district of infrared eye 105 again.
Embodiment two, are a kind of bi-component infrared gas sensors.
Such as Fig. 2, shown in Figure 3: being that with the key distinction of embodiment one below of infrared light supply 102 is designed with two optical grating constructions 1061,1062 arranged side by side, is respectively infrared eye 1051 and 1052 at optical grating construction 1061, the right and left of 1062.The direction of arrow is depicted as the transmission direction of the corresponding surface plasma-wave of each grating among Fig. 4.
The light path design of bi-component infrared gas sensor shown in each arrow line among Fig. 2,
After infrared light process optical grating construction 1061 light splitting that infrared light supply 102 sends, arrowband infrared light directive reflection micro mirror 1042 with the corresponding wave band of the first tested gas characteristic infrared absorption peak, through behind reflection micro mirror 1042,1041 the first back reflection, just in time incide the infrared absorption district of infrared eye 1052 again.
After infrared light process optical grating construction 1062 light splitting that infrared light supply 102 sends, arrowband infrared light directive reflection micro mirror 1041 with the corresponding wave band of the second tested gas characteristic infrared absorption peak, through behind reflection micro mirror 1041,1042 the first back reflection, just in time incide the infrared absorption district of infrared eye 1051 again.
By detecting the electrical signal of two infrared eyes, thereby analyze two kinds of tested gas concentrations.
Embodiment two remaining designs are with embodiment one.
Embodiment three, are a kind of polycomponent infrared gas sensors.
As shown in Figure 5: be that with the key distinction of embodiment one below of infrared light supply 102 is designed with four kinds of optical grating constructions 1063,1064,1065,1066, become substantially matrix pattern to distribute, formed the optical grating construction array.The direction of arrow is depicted as the transmission direction of the corresponding surface plasma-wave of each grating among Fig. 6.At above-mentioned optical grating construction array all around is respectively infrared eye 1056,1054,1055,1053.The pit of upper substrate 101 is the truncated rectangular pyramids shape, all is processed with MEMS reflection micro mirror on the inclined-plane of four sidewalls of pit, is respectively reflection micro mirror 1041,1042,1043,1044.
The light path design of polycomponent infrared gas sensor shown in each arrow line among Fig. 5,
After infrared light process optical grating construction 1063 light splitting that infrared light supply 102 sends, arrowband infrared light directive reflection micro mirror 1042 with the corresponding wave band of the first tested gas characteristic infrared absorption peak, through behind reflection micro mirror 1042,1041 the first back reflection, just in time incide the infrared absorption district of infrared eye 1053 again.
After infrared light process optical grating construction 1064 light splitting that infrared light supply 102 sends, arrowband infrared light directive reflection micro mirror 1043 with the corresponding wave band of the second tested gas characteristic infrared absorption peak, through behind reflection micro mirror 1043,1044 the first back reflection, just in time incide the infrared absorption district of infrared eye 1054 again.
After infrared light process optical grating construction 1065 light splitting that infrared light supply 102 sends, arrowband infrared light directive reflection micro mirror 1041 with the corresponding wave band of the 3rd tested gas characteristic infrared absorption peak, through behind reflection micro mirror 1041,1042 the first back reflection, just in time incide the infrared absorption district of infrared eye 1055 again.
After infrared light process optical grating construction 1066 light splitting that infrared light supply 102 sends, arrowband infrared light directive reflection micro mirror 1044 with the corresponding wave band of the 4th tested gas characteristic infrared absorption peak, through behind reflection micro mirror 1044,1043 the first back reflection, just in time incide the infrared absorption district of infrared eye 1056 again.
By detecting the electrical signal of above-mentioned four infrared eyes, thereby can analyze four kinds of tested gas concentrations.
Embodiment three remaining designs are with embodiment one.
Above-described embodiment can be used for structure of the present utility model and manufacture process are described, but enforcement of the present utility model never only limits to above-described embodiment.In the scope that does not break away from the utility model and appended claim, various replacements, variation and modification all are possible.Therefore, protection domain of the present utility model is not limited to embodiment and the disclosed content of accompanying drawing.
Claims (8)
1. a monolithic integrated miniature infrared gas sensor is characterized in that, comprising:
Upper substrate and the lower substrate with pit with pit, and the false sheet of the bonding between upper substrate and lower substrate, the false sheet of upper substrate, lower substrate and bonding combines, the middle air chamber that forms hollow;
The recess of upper substrate pit is provided with infrared light supply, and the sidewall of upper substrate pit has relative inclined-plane, is provided with the reflection micro mirror on relative inclined-plane; Infrared light supply is electrically connected the electrode of upper substrate appearance;
The recess of lower substrate pit is distributed with one or more optical grating constructions, and the infrared eye consistent with optical grating construction quantity; Infrared eye is electrically connected the electrode of lower substrate appearance;
Match in position and the angle of inclination of reflecting micro mirror on the position that optical grating construction on the position of infrared light supply, the lower substrate, infrared eye distribute on the upper substrate and the upper substrate pit inclined-plane, so that after the light splitting of the infrared light that infrared light supply sends process optical grating construction, with the arrowband infrared light directive reflection micro mirror of the corresponding wave band of tested gas characteristic infrared absorption peak, and after the reflection of reflection micro mirror, accurately be incident to infrared eye;
Have air hole with extraneous exchanging gas at upper substrate, lower substrate or the false sheet of bonding.
2. monolithic integrated miniature infrared gas sensor as claimed in claim 1 is characterized in that: described infrared light supply is electrically connected with the electrode of upper substrate appearance by the TSV through hole.
3. monolithic integrated miniature infrared gas sensor as claimed in claim 1 is characterized in that: described infrared eye is electrically connected with the electrode of lower substrate appearance by the TSV through hole.
4. monolithic integrated miniature infrared gas sensor as claimed in claim 1 is characterized in that: described infrared light supply employing Vacuum Package.
5. monolithic integrated miniature infrared gas sensor as claimed in claim 1 is characterized in that: described infrared eye employing Vacuum Package.
6. monolithic integrated miniature infrared gas sensor as claimed in claim 1 is characterized in that: the pit of upper substrate is the truncated rectangular pyramids shape.
7. monolithic integrated miniature infrared gas sensor as claimed in claim 1 is characterized in that: the false sheet of bonding is that the single or multiple lift material forms, and the material of the false sheet of bonding comprises silicon, monox, silicon nitride.
8. monolithic integrated miniature infrared gas sensor as claimed in claim 1 is characterized in that: go up the false sheet of substrate, lower substrate and bonding and be bonded together by bonding techniques.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320269323 CN203259470U (en) | 2013-05-16 | 2013-05-16 | Monolithic integrated miniature infrared gas sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320269323 CN203259470U (en) | 2013-05-16 | 2013-05-16 | Monolithic integrated miniature infrared gas sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203259470U true CN203259470U (en) | 2013-10-30 |
Family
ID=49472022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320269323 Expired - Lifetime CN203259470U (en) | 2013-05-16 | 2013-05-16 | Monolithic integrated miniature infrared gas sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203259470U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103245634A (en) * | 2013-05-16 | 2013-08-14 | 江苏物联网研究发展中心 | Miniature single-chip integrated infrared gas sensor |
| CN106986298A (en) * | 2015-10-27 | 2017-07-28 | 日月光半导体制造股份有限公司 | Semiconductor device packages and its manufacture method |
| US9816920B2 (en) | 2014-01-15 | 2017-11-14 | Robert Bosch Gmbh | Method for producing an integrated micromechanical fluid sensor component, integrated micromechanical fluid sensor component and method for detecting a fluid by means of an integrated micromechanical fluid sensor component |
-
2013
- 2013-05-16 CN CN 201320269323 patent/CN203259470U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103245634A (en) * | 2013-05-16 | 2013-08-14 | 江苏物联网研究发展中心 | Miniature single-chip integrated infrared gas sensor |
| US9816920B2 (en) | 2014-01-15 | 2017-11-14 | Robert Bosch Gmbh | Method for producing an integrated micromechanical fluid sensor component, integrated micromechanical fluid sensor component and method for detecting a fluid by means of an integrated micromechanical fluid sensor component |
| CN106986298A (en) * | 2015-10-27 | 2017-07-28 | 日月光半导体制造股份有限公司 | Semiconductor device packages and its manufacture method |
| CN106986298B (en) * | 2015-10-27 | 2019-06-21 | 日月光半导体制造股份有限公司 | Semiconductor device packages and its manufacturing method |
| US10526200B2 (en) | 2015-10-27 | 2020-01-07 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package including cover including tilted inner sidewall |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103245634B (en) | Miniature single-chip integrated infrared gas sensor | |
| US7652767B2 (en) | Optical sensor with chemically reactive surface | |
| CN109313079A (en) | The single sensor of thermopile IR for measuring temperature and detection gas | |
| CN203259470U (en) | Monolithic integrated miniature infrared gas sensor | |
| CN109839364A (en) | A kind of gas sensor probe and detection device based on multiple spot reflecting helix optical path | |
| CN101592601B (en) | High-efficiency infrared gas sensor with small volume | |
| WO2021212931A1 (en) | Two-dimensional, multi-point-reflection, long-optical-distance gas sensor probe, and gas sensor | |
| WO2002099372A3 (en) | Advanced high speed, multi-level uncooled bolometer and method for fabricating same | |
| CN108885137A (en) | A kind of IR detector array equipment | |
| CN103528957B (en) | A kind of infrared gas sensor of air chamber encapsulation integration | |
| US7602496B2 (en) | Optical sensor with biologically reactive surface | |
| EP3359934B1 (en) | Gas detector with a golay cell and method of detecting a gas using a golay cell | |
| GB2391309A (en) | Optical gas sensor | |
| CN107037019B (en) | Lamination structure fluorescence light sensor | |
| CN103792201A (en) | Optical pressure sensor for detecting multi-component gas and detection method thereof | |
| WO2020146792A1 (en) | On-board radiation sensing apparatus | |
| CN106442411A (en) | Graphene surface wave based high-sensitivity ultrafast refractive index detecting device and method | |
| US7545500B2 (en) | Surface plasmon resonance phenomenon measuring equipment | |
| CN101592599A (en) | Absorbing cavity of infrared gas sensor with wide spectrum light source | |
| CN110907385A (en) | NDIR infrared gas sensor | |
| CN109521376B (en) | Atomic magnetometer based on miniature atomic air chamber | |
| CN106932104A (en) | Double-element flame detection sensor | |
| CN108088815A (en) | Highly sensitive multiple beam refractive index detection device and method based on graphene surface ripple | |
| CN101907567A (en) | Infrared gas detection method based on vacuum tunnel current detection and detection device thereof | |
| CN114486796A (en) | NDIR multi-component gas detection module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131030 |