CN203245520U - Micropore laser machining device - Google Patents
Micropore laser machining device Download PDFInfo
- Publication number
- CN203245520U CN203245520U CN 201320230778 CN201320230778U CN203245520U CN 203245520 U CN203245520 U CN 203245520U CN 201320230778 CN201320230778 CN 201320230778 CN 201320230778 U CN201320230778 U CN 201320230778U CN 203245520 U CN203245520 U CN 203245520U
- Authority
- CN
- China
- Prior art keywords
- laser
- cutting
- inverted
- micropore
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model provides a micropore laser machining device. The micropore laser machining device comprises a laser device and a cutting assembly connected with the laser device. The cutting assembly comprises an inverted laser cutting head and a coaxial blowing device, and the coaxial blowing device is arranged on the inverted laser cutting head. According to the micropore laser machining device, the cutting head is arranged in an inverted mode, lasers act on the lower surface of a workpiece, the lasers are used for cutting so that materials can be gasified and fused, gasifying matter and fusing matter of the materials are cooled through protective gas and then are ejected to two perforated sides, the gasifying matter and the fusing matter fall off under the action of gravity and are condensed on the two sides of a small hole, and therefore the problem that perforation quality is influenced for the reason that splashing matter caused by perforation is attached to the surface of the workpiece in the prior art is solved.
Description
Technical field
The utility model relates to field of laser devices, relates in particular to a kind of micropore laser processing device.
Background technology
Laser boring is a kind of laser processing of indispensable in the present aperture processing and extensive use, and in recent years, along with the raising to the capillary processing quality requirement, traditional capillary processing method can not satisfy the requirement of capillary processing aspect ratio.And Laser Processing can be satisfied the specific (special) requirements of many processing, so it has become in the aperture processing processing method that people the most pay attention to.Efficient is high, cost hangs down advantages such as reaching the complex art remarkable in economical benefits because the pulse laser punching has, and therefore has been widely used in IT member, Aero-Space etc. industrial.Laser beam be a kind of in time with the space on the photon a fluid stream of high concentration, its angle of divergence is minimum, poly-functional, adopt optical focusing system, laser beam can be converged in the very low range of micron dimension, power density can reach 108-1015W/cm2, under the irradiation of superlaser, the evaporation of material and fusing are two basic processes that laser boring is shaped.Temperature sharply raises behind the material stimulated radiation, and the part material reaches boiling point gasification, the part material formation fused mass that then is liquefied, and under the effect of protective gas, the fused mass squit hole forms splash outward and is attached on the surface of the work.Splash is a kind of major defect of laser boring, has affected the quality of punching, present this defective of laser drilling ubiquity.
The utility model content
The technical problems to be solved in the utility model is, for the deficiencies in the prior art, and provides a kind of micropore processing device, and this device can overcome in the prior art to be invested surface of the work and affect the problem of drilling quality because punching causes splash.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of micropore laser processing device is provided, comprise laser instrument, and the cutting assembly that is connected with laser instrument, wherein: described cutting assembly comprises is inverted cutting head and coaxial blowning installation, and this coaxial blowning installation is arranged to be inverted on the laser head.
The utility model further preferred version is: described cutting assembly also comprises a cutting head interface, and described inversion cutting head comprises head and afterbody, and the cutting head interface is connected with the afterbody of being inverted cutting head.
The utility model further preferred version is: described laser instrument is optical fiber laser, and this optical fiber laser is connected with the cutting interface by Transmission Fibers.
The utility model further preferred version is: described coaxial blowning installation is arranged at the head of being inverted laser head.
Implement the technical solution of the utility model; has following beneficial effect: by with the inverted method of blowing coaxial air blowing of cutting head; when laser action in the workpiece lower surface; make the material gasification and melting with laser cutting; the vapour of material and melt spray through the backward both sides of punching of the protective gas cooling of coaxial blowning installation; fall and be condensed in the aperture both sides through Action of Gravity Field, invest surface of the work and affect the problem of drilling quality thereby overcome in the prior art because punching causes splash.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the structural representation of the utility model embodiment micropore laser processing device.
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
As shown in Figure 1, the utility model embodiment provides a kind of micropore laser processing device, comprise laser instrument 6, and the cutting assembly 3 that is connected with laser instrument 6, this cutting assembly 3 comprises is inverted cutting head 30 and coaxial blowning installation 33, this coaxial blowning installation 33 is arranged to be inverted on the cutting head 30, described cutting assembly 3 also comprises cutting head interface 4, this inversion cutting head 30 comprises head 31 and afterbody 32, cutting head interface 4 is connected with the afterbody 32 of being inverted cutting head 30, and described coaxial blowning installation 33 is arranged on the head 31 of being inverted laser head 30.
As shown in Figure 1, the described laser instrument 6 of the utility model embodiment is optical fiber laser, and this optical fiber laser is connected with cutting interface 4 by Transmission Fibers 5.
The method of operating of using micropore processing device of the present utility model to process is as follows:
At first, workpiece 1 is positioned over the top of being inverted cutting head 30, adjusts the position to the laser spot height and position;
Secondly, the debugging optical fiber laser instrument arranges optical fiber laser to adaptive parameter;
At last, open coaxial blowning installation, this coaxial blowning installation blow gas 2, punching by laser adds again.
The method that the utility model embodiment adopts cutting head to be inverted and to blow coaxial shielding gas; can effectively improve the problem of surface spray slag; laser action is in the lower surface of workpiece; because the effect of superlaser makes the material gasification and melting, under traditional laser boring method condition; the vapour of material and melt spray through the backward both sides of punching of protective gas cooling; fall and be condensed in the aperture both sides through Action of Gravity Field, so material surface can not form the spray slag, improved the drilling quality problem that the spray slag produces.
The above is preferred embodiment of the present utility model only, is not limited to the utility model, and for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., all should be included within the claim scope of the present utility model.
Claims (4)
1. a micropore laser processing device comprises laser instrument, and the cutting assembly that is connected with laser instrument, it is characterized in that: described cutting assembly comprises is inverted cutting head and coaxial blowning installation, and this coaxial blowning installation is arranged to be inverted on the laser head.
2. micropore laser processing device according to claim 1 is characterized in that, described cutting assembly also comprises a cutting head interface, and described inversion cutting head comprises head and afterbody, and the cutting head interface is connected with the afterbody of being inverted cutting head.
3. micropore laser processing device according to claim 2, it is characterized in that: described laser instrument is optical fiber laser, this optical fiber laser is connected with the cutting interface by Transmission Fibers.
4. micropore laser processing device according to claim 1 is characterized in that: described coaxial blowning installation is arranged at the head of being inverted laser head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320230778 CN203245520U (en) | 2013-04-28 | 2013-04-28 | Micropore laser machining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320230778 CN203245520U (en) | 2013-04-28 | 2013-04-28 | Micropore laser machining device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203245520U true CN203245520U (en) | 2013-10-23 |
Family
ID=49371981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320230778 Expired - Fee Related CN203245520U (en) | 2013-04-28 | 2013-04-28 | Micropore laser machining device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203245520U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104043904A (en) * | 2014-06-09 | 2014-09-17 | 江苏大学 | Back side-blown gas-assisted laser cutting method and device |
| CN105855383A (en) * | 2016-04-06 | 2016-08-17 | 湖南大学 | Connection method and hole punching and flanging die for carbon fibers and light alloy |
| CN106735878A (en) * | 2016-12-30 | 2017-05-31 | 苏州德龙激光股份有限公司 | The laser process equipment and its method of cell phone rear cover and frame |
| CN107414322A (en) * | 2017-08-10 | 2017-12-01 | 江苏大学 | One kind reduces re cast layer device and method caused by laser micropore processing |
| CN108031991A (en) * | 2017-12-18 | 2018-05-15 | 中国科学院西安光学精密机械研究所 | A kind of ultrafast laser air film hole high-efficiency machining method and device |
| CN114918558A (en) * | 2022-05-27 | 2022-08-19 | 武汉新芯集成电路制造有限公司 | Laser dicing apparatus and wafer dicing method |
-
2013
- 2013-04-28 CN CN 201320230778 patent/CN203245520U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104043904A (en) * | 2014-06-09 | 2014-09-17 | 江苏大学 | Back side-blown gas-assisted laser cutting method and device |
| CN105855383A (en) * | 2016-04-06 | 2016-08-17 | 湖南大学 | Connection method and hole punching and flanging die for carbon fibers and light alloy |
| CN106735878A (en) * | 2016-12-30 | 2017-05-31 | 苏州德龙激光股份有限公司 | The laser process equipment and its method of cell phone rear cover and frame |
| CN107414322A (en) * | 2017-08-10 | 2017-12-01 | 江苏大学 | One kind reduces re cast layer device and method caused by laser micropore processing |
| CN108031991A (en) * | 2017-12-18 | 2018-05-15 | 中国科学院西安光学精密机械研究所 | A kind of ultrafast laser air film hole high-efficiency machining method and device |
| CN108031991B (en) * | 2017-12-18 | 2023-11-24 | 西安中科微精光子科技股份有限公司 | Efficient processing method and device for ultrafast laser film hole |
| CN114918558A (en) * | 2022-05-27 | 2022-08-19 | 武汉新芯集成电路制造有限公司 | Laser dicing apparatus and wafer dicing method |
| CN114918558B (en) * | 2022-05-27 | 2023-11-24 | 武汉新芯集成电路制造有限公司 | Laser dicing apparatus and wafer dicing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203245520U (en) | Micropore laser machining device | |
| CN204818431U (en) | Laser welding device who contains dust removal structure | |
| CN102092931B (en) | Method and device for preparing microchannel in glass material | |
| CN105980100B (en) | By the method and apparatus for the workpiece that the laser pulse spot welding of green wavelength is especially made of copper, copper alloy, gold or jewellery material | |
| JP2012086230A (en) | Laser cutting device and laser cutting method | |
| CN107971632B (en) | A kind of method for laser welding eliminating the back side and splashing | |
| CN104227242B (en) | Central negative pressure plasma arc laser coaxial composite welding apparatus and method | |
| CN204524546U (en) | A kind of laser three-D cutting head | |
| CN103286456A (en) | Laser cutting device and cutting method | |
| CN103056520A (en) | Laser drilling method | |
| CN104439715A (en) | Laser cutting device for transparent materials and laser cutting process applied to laser cutting device | |
| CN204893212U (en) | A vaporization resectoscopic laser equipment for metal cutting | |
| CN201483161U (en) | Automatic focusing device | |
| CN104551391A (en) | Laser-enhanced underwater GMAW droplet transfer control method | |
| CN207629424U (en) | A kind of ultrafast laser air film hole highly-efficient processing device | |
| CN103464897A (en) | Inert gas protecting device for laser welding machine | |
| CN203003347U (en) | Pulse laser perforation device | |
| US20140008337A1 (en) | Method for Hybrid Machining Colored Glass | |
| CN103464896B (en) | Optical element protecting device for laser welding machine | |
| CN214769670U (en) | Laser welding machine with dust removal cooling body | |
| CN202804480U (en) | Flushing and immersion cooling laser cutting device | |
| CN204893224U (en) | Laser equipment based on carbon dioxide technique of cutting | |
| CN204913069U (en) | Laser cutting head | |
| CN203900737U (en) | Laser-indication welding shielding gas device | |
| CN114083150A (en) | Method for cutting pipe body by laser composite cutting and cutting system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131023 Termination date: 20200428 |