CN203241909U - Structure device capable of enhancing CPU heat dissipating capacity - Google Patents
Structure device capable of enhancing CPU heat dissipating capacity Download PDFInfo
- Publication number
- CN203241909U CN203241909U CN 201320273321 CN201320273321U CN203241909U CN 203241909 U CN203241909 U CN 203241909U CN 201320273321 CN201320273321 CN 201320273321 CN 201320273321 U CN201320273321 U CN 201320273321U CN 203241909 U CN203241909 U CN 203241909U
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- Prior art keywords
- fan
- fans
- cpu
- preposition
- wind
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000002708 enhancing effect Effects 0.000 title claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 230000005855 radiation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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Abstract
The utility model discloses a structure device capable of enhancing CPU heat dissipating capacity. The structure device comprises two pre-positioned fans, a wind guide hood, and two post-positioned fans. The front-positioned fans are arranged on the front portion of a main board, the front end of the wind guide hood is connected with the pre-positioned fans and the back end of the wind guide hood is connected with the post-positioned fans to form a wind channel, the post-positioned fans are arranged on the back portion of the main board, the pre-positioned fans and the post-positioned fans are the same in wind direction and face towards the back portion of the main board. Due to the fact that the structure device is added, wind blown by the fans can directly reach the surface of a CPU and the heat dissipating requirement of the CPU is achieved. The structure device capable of enhancing the CPU heat dissipating capacity is simple in structure, ingenious in design and convenient to use, and has good popularization and application value.
Description
Technical field
The utility model relates to field of computer technology, is specifically related to a kind of constructional device of the CPU of enhancing heat-sinking capability.
Background technology
In cabinet mainboard original structure, the mainboard rear portion is fixed two fans and is dispelled the heat to CPU, and the wind direction of these two fans backward.Because the arrangement space of rear panel is limited, it has been the limit that such two fans are installed, and such radiating mode can not be realized the reasonable heat radiation of CPU.Therefore for this situation, the heat dissipation technology of CPU remains to further develop and improve.
The utility model content
The utility model discloses a kind of constructional device of the CPU of enhancing heat-sinking capability for the weak point that prior art exists.
The constructional device of enhancing CPU heat-sinking capability disclosed in the utility model, it is as follows to solve the technical scheme that above-mentioned CPU heat dissipation problem adopts: comprise two preposition fans, wind scooper and two rearmounted fans, described preposition fan is arranged on the mainboard front portion, rearmounted fan is arranged on the mainboard rear portion, the wind direction of preposition fan and rearmounted fan is identical towards the mainboard rear, join rear end and rearmounted fan of described wind scooper front end and preposition fan joins the common heat dissipation wind channel that forms of preposition like this fan, wind scooper and rearmounted fan.
Further, the setting of described wind scooper upper surface is three sections, and the leading portion setting is low dip plane behind the front height, and the stage casing is horizontal structure, and the back segment setting is low early and high after dip plane.
The beneficial effect that the constructional device of enhancing CPU heat-sinking capability disclosed in the utility model has is: by increasing this constructional device, can realize that the wind that fan blows out directly arrives on the CPU surface, reached the heat radiation requirement of CPU, and it is simple in structure, design is ingenious, easy to use, has preferably popularizing value.
Description of drawings
Accompanying drawing 1 is the vertical view of constructional device described in the utility model;
Accompanying drawing 2 is the side view of wind scooper described in the utility model;
Accompanying drawing marking explanation: 1, preposition fan; 2, wind scooper; 3, rearmounted fan; 4, mainboard; 5, internal memory.
Embodiment
Below in conjunction with accompanying drawing, the constructional device that strengthens the CPU heat-sinking capability disclosed in the utility model is described in further details.
The constructional device of enhancing CPU heat-sinking capability disclosed in the utility model, its structure as shown in Figure 1, comprise two preposition fans 1, wind scooper 2 and two rearmounted fans 3, described preposition fan 1 is arranged on mainboard 4 front portions for newly-increased fan, described wind scooper 2 front ends connect preposition fan 1 its rear end and connect rearmounted fan 3, form like this a CPU heat dissipation wind channel, described rearmounted fan 3 is arranged on mainboard 1 rear portion for the original fan of system, and preposition fan 1 is consistent with the wind direction of rearmounted fan 3 all to the mainboard rear; And wind scooper 3 upper surface settings are three sections, and the leading portion setting is low dip plane behind the front height, and the stage casing is horizontal structure, and the back segment setting is low early and high after dip plane.
This strengthens the constructional device of CPU heat-sinking capability, increases by two preposition fans of installation by increasing structural member at cabinet inside, and wind direction and original fan are consistent; At last, by fixing wind scooper the front and back fan is coupled together and to form the heat dissipation wind channel cover and cover CPU, and the surface structure of wind scooper has the gradient, can realize directly wind to CPU, having strengthened the radiating effect of CPU.
Except technical characterictic described in the utility model, be the known technology of those skilled in the art.
Claims (2)
1. constructional device that strengthens the CPU heat-sinking capability, it is characterized in that, comprise two preposition fans, wind scooper and two rearmounted fans, described preposition fan is arranged on the mainboard front portion, rearmounted fan is arranged on the mainboard rear portion, the wind direction of preposition fan and rearmounted fan is identical, and join rear end and rearmounted fan of described wind scooper front end and preposition fan joins the common heat dissipation wind channel that forms of preposition fan, wind scooper and rearmounted fan.
2. the constructional device of enhancing according to claim 1 CPU heat-sinking capability is characterized in that the setting of described wind scooper upper surface is three sections, and the leading portion setting is low dip plane behind the front height, and the stage casing is horizontal structure, and the back segment setting is low early and high after dip plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320273321 CN203241909U (en) | 2013-05-20 | 2013-05-20 | Structure device capable of enhancing CPU heat dissipating capacity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320273321 CN203241909U (en) | 2013-05-20 | 2013-05-20 | Structure device capable of enhancing CPU heat dissipating capacity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203241909U true CN203241909U (en) | 2013-10-16 |
Family
ID=49319183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320273321 Expired - Fee Related CN203241909U (en) | 2013-05-20 | 2013-05-20 | Structure device capable of enhancing CPU heat dissipating capacity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203241909U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105259998A (en) * | 2015-10-29 | 2016-01-20 | 浪潮电子信息产业股份有限公司 | Wind guide shield device easy to maintain |
| CN115033064A (en) * | 2022-06-30 | 2022-09-09 | 西安易朴通讯技术有限公司 | Wind-guiding structure, GPU subassembly and server |
-
2013
- 2013-05-20 CN CN 201320273321 patent/CN203241909U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105259998A (en) * | 2015-10-29 | 2016-01-20 | 浪潮电子信息产业股份有限公司 | Wind guide shield device easy to maintain |
| CN115033064A (en) * | 2022-06-30 | 2022-09-09 | 西安易朴通讯技术有限公司 | Wind-guiding structure, GPU subassembly and server |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131016 Termination date: 20160520 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |