CN203241906U - Heat radiating system of lower-power cloud computer case - Google Patents
Heat radiating system of lower-power cloud computer case Download PDFInfo
- Publication number
- CN203241906U CN203241906U CN2013201869195U CN201320186919U CN203241906U CN 203241906 U CN203241906 U CN 203241906U CN 2013201869195 U CN2013201869195 U CN 2013201869195U CN 201320186919 U CN201320186919 U CN 201320186919U CN 203241906 U CN203241906 U CN 203241906U
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- China
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- chipset
- processing unit
- central processing
- conduction connector
- heat conduction
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses the heat radiating system of a lower-power cloud computer case and relates to the field of computer radiating technology, which comprises a metallic case bottom board, a main board, a central processor and a chipset. The main board is arranged on the metallic case bottom board. The central processor and the chipset are arranged on the main board and are positioned at the back surface of the main board. A central processor heat-conduction connector and a chipset heat-conduction connector are arranged between the back surface of the main board and the metallic case bottom board. The central processor heat-conduction connector and the central processor are in contacted cooperation with each other. The chipset heat-conduction connector and the chipset are in contacted cooperation with each other. According to the technical scheme of the utility model, due to the adoption of the heat radiating system, the cloud computer case is small in size and good in heat radiating effect. Due to the adoption of a 5V low-power solid hard disk, the power consumption of the entire cloud computer is only 20W and is saved by 90% compared with that of a conventional computer.
Description
Technical field
The utility model relates to a kind of computer to dissipate heat field, relates in particular to a kind of low-power consumption cloud computing machine enclosure cooling system.
Background technology
The heating radiator of the central processor CPU of desk-top computer generally adopts the air cooling way heat radiation.Heating radiator is comprised of fan, metal fin, fastener and heat-conducting medium.By heat radiator the heat of CPU is conducted diffusion during work, by fan heat is forced to take in the air to reach the purpose of heat radiation.This radiating mode is unsatisfactory, after at first the outer cold air of cabinet enters cabinet, distinguished and admirable do not enter fan before, by electronic component preheating or part preheating, the wind regime that makes fan blow to heat radiator becomes the air that had been heated in the cabinet; Secondly, in time all do not discharged cabinets with the air of amount of heat after being blowed to metal fin by fan, some is sucked by fan again because of turbulent flow.The air themperature that is used in other words cooling off CPU is higher than the outer air themperature of cabinet, and exists a part of sinuous flow by fan repeatedly " utilization ", has reduced the effect of fan, makes the CPU radiating effect undesirable.Change this situation, means commonly used are to adopt larger heating radiator.But larger heating radiator not only will increase investment and will take larger mainboard position.Therefore, be necessary prior art is improved.
Summary of the invention
The purpose of this utility model is to propose a kind of low-power consumption cloud computing machine enclosure cooling system in order to overcome that prior art computer cabinet volume is large and radiating effect is not good, the little and good heat dissipation effect of this device volume.
In order to achieve the above object, the technical scheme that adopts of the utility model is as follows:
A kind of low-power consumption cloud computing machine enclosure cooling system, comprise metal chassis base plate, mainboard, central processing unit and chipset, described mainboard is installed on the metal chassis base plate, described central processing unit and chipset are installed on the mainboard, described central processing unit and chipset are installed in the mainboard reverse side, are provided with central processing unit heat conduction connector and chipset heat conduction connector between described mainboard reverse side and the metal chassis base plate; Wherein, cooperations that contact with central processing unit of central processing unit heat conduction connector, chipset is warm to conduct the connector cooperation that contacts with chipset.
Above-mentioned central processing unit heat conduction connector and central processing unit surface of contact scribble silica gel; Described chipset heat conduction connector and chipset surface of contact scribble silica gel.
Above-mentioned central processing unit heat conduction connector and chipset heat conduction connector are the metal heat-conducting bar of global formation.
Above-mentioned central processing unit heat conduction connector and chipset heat conduction connector are bonded on the metal chassis base plate by tackifier respectively.
Above-mentioned mainboard is screwed in chassis backplane, and mainboard and chassis backplane spacing are 3～5cm.
Above-mentioned metal chassis base plate is the Aluminum Alloy Chassis base plate.
The beneficial effects of the utility model: cabinet volume of the present utility model is little, good heat dissipation, and when adopting the low-power consumption solid state hard disc of 5V, can make Overall Power Consumption is 20W, than common computer energy-conservation 90%.
Description of drawings
Fig. 1 is the schematic side view of the utility model low-power consumption cloud computing machine enclosure;
Fig. 2 is the schematic side view of the utility model low-power consumption cloud computing machine enclosure.
Embodiment
In order to make technical problem to be solved in the utility model, technical scheme and beneficial effect clearer, below in conjunction with drawings and Examples, the utility model is further described in detail.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
A kind of low-power consumption cloud computing machine enclosure cooling system as depicted in figs. 1 and 2, comprise metal chassis base plate 1, mainboard 2, central processing unit 3 and chipset 4, described mainboard 2 is installed on the metal chassis base plate 1, described central processing unit 3 and chipset 4 are installed on the mainboard 2, described central processing unit 3 and chipset 4 are installed in mainboard 2 reverse side, are provided with central processing unit heat conduction connector 5 and chipset heat conduction connector 5 between described mainboard 2 reverse side and the metal chassis base plate 1; Wherein, cooperations that contact with central processing unit 3 of central processing unit heat conduction connector 5, chipset is warm to conduct connector 5 cooperation that contacts with chipset 4.Central processing unit heat conduction connector 5 scribbles silica gel with central processing unit 3 surface of contact; Chipset heat conduction connector 5 scribbles silica gel 6 with chipset 4 surface of contact.Central processing unit heat conduction connector 5 and chipset heat conduction connector 5 are the metal heat-conducting bar of global formation.Central processing unit heat conduction connector 5 and chipset heat conduction connector 5 are bonded on the metal chassis base plate 1 by tackifier 7 respectively.Mainboard 2 is fixed in chassis backplane 1 by screw 8, and mainboard 2 is 3～5cm with chassis backplane 1 spacing.Metal chassis base plate 1 is the Aluminum Alloy Chassis base plate.
The above only is a preferred implementation of the present utility model.What deserves to be explained is; for the person of ordinary skill of the art; under the prerequisite that does not break away from the utility model principle; can also make some distortion or improvement to the utility model; therefore all equivalences of doing according to the described structure of the utility model patent claim, feature and principle change or modify, these features all belong to the scope of the utility model patented claim protection.
Claims (6)
1. low-power consumption cloud computing machine enclosure cooling system, comprise metal chassis base plate, mainboard, central processing unit and chipset, described mainboard is installed on the metal chassis base plate, described central processing unit and chipset are installed on the mainboard, it is characterized in that: described central processing unit and chipset are installed in the mainboard reverse side, are provided with central processing unit heat conduction connector and chipset heat conduction connector between described mainboard reverse side and the metal chassis base plate; Wherein, cooperations that contact with central processing unit of central processing unit heat conduction connector, chipset is warm to conduct the connector cooperation that contacts with chipset.
2. low-power consumption cloud computing machine enclosure cooling system as claimed in claim 1 is characterized in that: described central processing unit heat conduction connector and central processing unit surface of contact scribble silica gel; Described chipset heat conduction connector and chipset surface of contact scribble silica gel.
3. low-power consumption cloud computing machine enclosure cooling system as claimed in claim 1 is characterized in that: described central processing unit heat conduction connector and chipset heat conduction connector are the metal heat-conducting bar of global formation.
4. low-power consumption cloud computing machine enclosure cooling system as claimed in claim 1 is characterized in that: described central processing unit heat conduction connector and chipset heat conduction connector are bonded on the metal chassis base plate by tackifier respectively.
5. low-power consumption cloud computing machine enclosure cooling system as claimed in claim 1, it is characterized in that: described mainboard is screwed in chassis backplane, and mainboard and chassis backplane spacing are 3～5cm.
6. low-power consumption cloud computing machine enclosure cooling system as claimed in claim 1, it is characterized in that: described metal chassis base plate is the Aluminum Alloy Chassis base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201869195U CN203241906U (en) | 2013-04-15 | 2013-04-15 | Heat radiating system of lower-power cloud computer case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201869195U CN203241906U (en) | 2013-04-15 | 2013-04-15 | Heat radiating system of lower-power cloud computer case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203241906U true CN203241906U (en) | 2013-10-16 |
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ID=49319180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013201869195U Expired - Fee Related CN203241906U (en) | 2013-04-15 | 2013-04-15 | Heat radiating system of lower-power cloud computer case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203241906U (en) |
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2013
- 2013-04-15 CN CN2013201869195U patent/CN203241906U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131016 Termination date: 20150415 |
|
| EXPY | Termination of patent right or utility model |