CN203240389U - Side light type LED integration module - Google Patents

Side light type LED integration module Download PDF

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Publication number
CN203240389U
CN203240389U CN 201220607394 CN201220607394U CN203240389U CN 203240389 U CN203240389 U CN 203240389U CN 201220607394 CN201220607394 CN 201220607394 CN 201220607394 U CN201220607394 U CN 201220607394U CN 203240389 U CN203240389 U CN 203240389U
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CN
China
Prior art keywords
light
substrate
integration module
led
type led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220607394
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Chinese (zh)
Inventor
李丰
钟正根
杨立梅
马慧军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen Li Fu Electronics Co., Ltd.
Original Assignee
SUZHOU JINFU NEW MATERIAL CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUZHOU JINFU NEW MATERIAL CO Ltd filed Critical SUZHOU JINFU NEW MATERIAL CO Ltd
Priority to CN 201220607394 priority Critical patent/CN203240389U/en
Application granted granted Critical
Publication of CN203240389U publication Critical patent/CN203240389U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a side light type LED integration module. The side light type LED integration module comprises a light-emitting assembly. The light-emitting assembly is mainly composed of a substrate and a plurality of LED light-emitting bodies arranged on the substrate. A heat dissipation plate is arranged on the back side of the substrate. The side light type LED integration module is characterized in that a light guide plate is arranged, the light-emitting assembly is arranged on the side edge of the light guide plate, the top ends of the light-emitting bodies face the light guide plate, and a dodging assembly is arranged between the light-emitting assembly and the side edge of the light guide plate. According to the side light type LED integration module, the LED light-emitting bodies are packaged on the substrate in advance and then integrated with a PCB, the light guide plate is used for transmitting emitted light, so that the LED light-emitting bodies need to be sorted simply, the requirement and the cost for testing and sorting of the LED light-emitting bodies are lowered, the light mixing effect can be guaranteed, the heat dissipation effect is improved, and therefore the lighting cost is lowered. The LED light-emitting bodies are packaged on the substrate by adopting the COB or SMT packaging way, packaging is reliable, and the light-emitting efficiency is improved.

Description

Side-light type LED integration module
Technical field
The utility model relates to a kind of lighting module, is specifically related to a kind of side-light type LED integration module.
Background technology
Led light source is applied in the various illuminators more and more as a kind of effective energy-conservation green product.In existing LED illuminator, normally first the LED illuminator is packaged into single individual LED luminous tube, and then a plurality of LED luminous tubes are integrated on the pcb board.
There is following shortcoming in this class illuminator: it is low that the work calories of LED illuminator is derived efficient, and LED illuminator temperature easily sharply rises, thereby cause the LED light efficiency to reduce the lost of life.Simultaneously, because human eye is very responsive to color and the brightness of light, if want the visual effect that reaches desirable, will guarantee the uniformity of the characterisitic parameters such as LED luminous flux, this just must carry out strict test and sorting to every LEDs illuminator, otherwise wavelength is inhomogeneous or the inhomogeneous of brightness all can allow the people produce uncomfortable sensation.In order to guarantee the good uniformity of characterisitic parameter such as LED wavelength, the sorting after from chip testing to encapsulation all will be satisfied certain requirement, and test will improve greatly with the cost of sorting, and namely the cost of the Lights section increases greatly in the illuminator.
For above-mentioned reasons, the test of LED illuminator and sorting become the operation of necessity of LED supplier, have become at present the production capacity bottleneck of many LED illuminators manufacturer, also are important composition parts of LED illuminator cost simultaneously.Before the uniformity of epitaxial wafer was controlled, more effective method was to reduce test and the sorting cost of chip.
Therefore, by the architecture advances to the LED light emitting module, with test, the sorting requirement of reduction to LED, thereby reducing LED illuminator sorting cost, is the approach that reduces LED light emitting module cost.
Summary of the invention
Goal of the invention of the present utility model provides a kind of side-light type LED integration module, by the improvement of structure, reduce to the LED illuminator test, requirement and the cost of sorting, guarantee simultaneously light mixing effect, improve radiating effect, to reduce illumination cost.
To achieve the above object of the invention, the technical solution adopted in the utility model is: a kind of side-light type LED integration module, comprise luminescence component, described luminescence component mainly is made of substrate and a plurality of LED illuminators that are arranged on the substrate, the dorsal part of substrate is provided with heat sink, is provided with LGP, and described luminescence component is arranged at the side of LGP, the illuminator top is provided with even optical assembly towards LGP between the side of luminescence component and LGP.
In the technique scheme, when described LED illuminator was the white light LEDs illuminator, described even optical assembly was formed by even tabula rasa and folded the establishing of astigmatism plate.
Perhaps, when described LED illuminator is the blue-ray LED illuminator, described even optical assembly by even tabula rasa, layer of silica gel and the phosphor powder film layer that is arranged on the plane that of layer of silica gel is parallel to the LGP side consist of.
In the technique scheme, be provided with reflecting plate between the substrate of described luminescence component and the described even optical assembly, described reflecting plate is provided with the through hole structure, and the through hole of described reflecting plate is passed through towards LGP side incidence surface in described LED illuminator top.
In the technique scheme, described LED illuminator is packaged on the described substrate by transparent silica gel, namely adopts the COB packaged type.
Perhaps, described LED illuminator is packaged on the described substrate by surface mounting structure, namely adopts the SMT packaged type.
Above, described substrate can be arbitrary shape, to satisfy different occasion illumination needs.
Because technique scheme is used, the utility model compared with prior art has following advantages:
1. the utility model is packaged in a plurality of LED illuminators on the substrate in advance, and then be integrated on the pcb board, transmit luminous by LGP, so only need the LED illuminator is carried out simple sorting, the test of LED illuminator, requirement and the cost of sorting have been reduced, can also guarantee light mixing effect, improve radiating effect, thereby reduce illumination cost.
2. when LED illuminator of the present utility model is the blue-ray LED illuminator, cover one deck plane silica gel fluorescent powder film above module, the upper surface of plane silica gel fluorescent powder film is exiting surface, and the light that the LED integration module is sent is white light.
3. the utility model adopts the packaged types such as COB or SMT that the LED illuminator is packaged on the substrate, and encapsulation is reliable, improves luminous efficiency.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment one;
Fig. 2 is the top view of Fig. 1;
Fig. 3 is the structural representation of the utility model embodiment two;
Fig. 4 is the top view of Fig. 3.
Wherein: 1, even optical assembly; 2, reflecting plate; 3, substrate; 4, white light LEDs illuminator; 5, heat sink; 6, LGP; 7, the even optical assembly of band fluorescent powder film; 8, blue-ray LED illuminator.
The specific embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment one: shown in Fig. 1 and 2, a kind of side-light type LED integration module, comprise luminescence component, described luminescence component mainly is made of substrate 3 and a plurality of white light LEDs illuminators 4 that are encapsulated on the substrate 3, the dorsal part of substrate 3 is provided with heat sink 5, is provided with LGP 6, and described luminescence component is arranged at the side of LGP 6, illuminator 4 tops are provided with even optical assembly 1 towards LGP 6 between the side of luminescence component and LGP 6.
Described even optical assembly 1 is formed by even tabula rasa and folded the establishing of astigmatism plate.Be provided with reflecting plate 2 between the substrate 3 of described luminescence component and the described even optical assembly 1, described reflecting plate 2 is provided with the through hole structure, and the through hole of described reflecting plate 2 is passed through towards LGP 6 side incidence surfaces in described LED illuminator top.
When the described LED illuminator of the present embodiment is white light LEDs illuminator 4, from LGP 6 single side face light entrance structures thereof modes, transmit luminous from top outgoing by LGP 6.
Described LED illuminator is packaged on the described substrate 3 by transparent silica gel, namely adopts the COB packaged type.
Embodiment two: shown in Fig. 3 and 4, the present embodiment two is basic identical with the structure of embodiment one, and difference is:
Be provided with two groups of luminescence components, two groups of luminescence components are symmetricly set on two relative side edge of described LGP 6.
Described LED illuminator is packaged on the described substrate 3 by surface mounting structure, namely adopts the SMT packaged type.
When described LED illuminator is blue-ray LED illuminator 8, described even optical assembly 7 by even tabula rasa, layer of silica gel and the phosphor powder film layer that is arranged on the plane that of layer of silica gel is parallel to the LGP side consist of.By said structure, the blue light that blue-ray LED illuminator 8 sends converts white light to through plane silica gel fluorescent powder film.
When the described LED illuminator of the present embodiment is blue-ray LED illuminator 8, from two relative side incident frame modes of LGP 6, transmit luminous from top outgoing by LGP 6.

Claims (7)

1. side-light type LED integration module, comprise luminescence component, described luminescence component mainly is made of substrate and a plurality of LED illuminators that are arranged on the substrate, the dorsal part of substrate is provided with heat sink, it is characterized in that: be provided with LGP, described luminescence component is arranged at the side of LGP, and the illuminator top is provided with even optical assembly towards LGP between the side of luminescence component and LGP.
2. side-light type LED integration module according to claim 1 is characterized in that: described even optical assembly is formed by even tabula rasa and folded the establishing of astigmatism plate.
3. side-light type LED integration module according to claim 1 is characterized in that: described even optical assembly by even tabula rasa, layer of silica gel and the phosphor powder film layer that is arranged on the plane that of layer of silica gel is parallel to the LGP side consist of.
4. side-light type LED integration module according to claim 1 is characterized in that: be provided with reflecting plate between the substrate of described luminescence component and the described even optical assembly.
5. side-light type LED integration module according to claim 4, it is characterized in that: described reflecting plate is provided with the through hole structure, and the through hole of described LED illuminator top by described reflecting plate is towards LGP side incidence surface.
6. side-light type LED integration module according to claim 1, it is characterized in that: described LED illuminator is packaged on the described substrate by transparent silica gel.
7. side-light type LED integration module according to claim 1, it is characterized in that: described LED illuminator is packaged on the described substrate by surface mounting structure.
CN 201220607394 2012-11-16 2012-11-16 Side light type LED integration module Expired - Fee Related CN203240389U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220607394 CN203240389U (en) 2012-11-16 2012-11-16 Side light type LED integration module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220607394 CN203240389U (en) 2012-11-16 2012-11-16 Side light type LED integration module

Publications (1)

Publication Number Publication Date
CN203240389U true CN203240389U (en) 2013-10-16

Family

ID=49317685

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220607394 Expired - Fee Related CN203240389U (en) 2012-11-16 2012-11-16 Side light type LED integration module

Country Status (1)

Country Link
CN (1) CN203240389U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 215126 No. 39, Jiangpu Road, Suzhou Industrial Park, Jiangsu Province

Patentee after: Suzhou Jin Fu technology Limited by Share Ltd

Address before: 215126, Jiangpu Road, Suzhou Industrial Park, Jiangsu, Suzhou, 39

Patentee before: Suzhou Jinfu New Material Co., Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20180302

Address after: 361000 Fujian Province, Xiamen torch hi tech Zone (Xiangan) Industrial Zone Xiang Road No. 307 (No. 3 building) first, second, third

Patentee after: Xiamen Li Fu Electronics Co., Ltd.

Address before: 215126 No. 39, Jiangpu Road, Suzhou Industrial Park, Jiangsu Province

Patentee before: Suzhou Jin Fu technology Limited by Share Ltd

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131016

Termination date: 20191116