CN203206578U - Printed circuit board and semi-finished product used for producing same - Google Patents
Printed circuit board and semi-finished product used for producing same Download PDFInfo
- Publication number
- CN203206578U CN203206578U CN 201320146810 CN201320146810U CN203206578U CN 203206578 U CN203206578 U CN 203206578U CN 201320146810 CN201320146810 CN 201320146810 CN 201320146810 U CN201320146810 U CN 201320146810U CN 203206578 U CN203206578 U CN 203206578U
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- Prior art keywords
- circuit board
- printed circuit
- semi
- finished product
- insulating barrier
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Abstract
In a printed circuit board (11) comprising multiple insulating layers (5) and electric conduction layers (2, 7), the multiple insulating layers (5) and electric conduction layers (2, 7) are arranged alternately, the printed circuit board (11) is provided with at least two hard areas and at least one soft area, the insulating layers (5) and the electric conduction layers (2, 7) are arranged alternately and are different in number, and the soft area is arranged between the hard areas. In a semi-finished product used for producing the printed circuit board (11), the semi-finished product comprises the multiple insulating layers (5) and electric conduction layers (2, 7), the multiple insulating layers (5) and electric conduction layers (2, 7) are arranged alternately, at least two separated hard areas are formed, the semi-finished product further comprises a central soft layer (1) which is arranged between a pair of central insulating layers (2) of the separated hard areas, and a stripping layer (9) is arranged between one of the electric conduction layers (2, 7) and one insulating layer (5) in at least one separated hard area.
Description
Technical field
The utility model relates to printed circuit board and for the production of the semi-finished product of printed circuit board.
Background technology
Printed circuit board also is called as printed wiring board, for band just like transistor and fellow's electronic component and panel that they are electrically connected, and therefore form the pith of electronic product.The structure of printed circuit board depends on concrete application and complicated more or less.Generally speaking, printed circuit board comprises a plurality of conductive layer and insulating barriers that alternately arrange, and by combining with some fiberglass panel sclerosis of organic resin dipping, described panel forms insulating barrier.This in the field of business being loosely referred to as of panel " prepreg " (pre-impregnated fiber) of in producing printed circuit board, using, at organic resin uncured and with thus the state of thickness under pay and process.After solidifying, this organic resin will produce actual insulating barrier.Those insulating barriers are with the conductive layer that for example forms with Copper Foil, and those conductive layers are properly handled to form circuit, to be electrically connected those electronic components.Modern printed circuit board permission electronic component and its corresponding wiring can be highly integrated.
Yet in the electronics industry, in order to provide electronic equipment and device day by day small and exquisite but with better function to consumer and professional person, must be constantly further microminiaturized, and this must install to more electronic component in the less space.The conductive layer and the insulating barrier that form printed circuit board can't be done thinlyyer easily, this is because the combination of those layers connects one deck stratum by one deck often and compresses into capable, for fear of those the layer of combination rise and fall or even under the mechanical stress that produces during the lamination, tear, certain mechanical stability need be arranged.In addition, when the thickness of those layers is lower than certain limit, because material meeting flexing, so the processing of very thin material is become further crucial.
Summary of the invention
In order more effectively to use the free space in electronic device, therefore direction of the present utility model is to have avoided the printed circuit board of above-mentioned restriction and shortcoming and for the production of the semi-finished product of printed circuit board.
Specifically, the printed circuit board of the innovation comprises a plurality of insulating barrier and conductive layers that alternately arrange, this printed circuit board is with at least two rigid zones, the quantity of its insulating barrier that alternately arranges and conductive layer is different, and with at least one soft zone, it is arranged between the described rigid zone.Therefore, the thickness of the printed circuit board of the innovation in zones of different can be as required and different, so that this printed circuit board can be blocked in the space in the electronic device necessarily.In addition, because this at least one soft zone being arranged, this printed circuit board is collapsible or crooked, and thereby can arrange more neatly in electronic device.
Preferably, those insulating barriers comprise the semi-solid preparation material.
These semi-finished product are for the production of printed circuit board, it comprises a plurality of insulating barrier and conductive layers that alternately arrange, form at least two rigid zones that separate, these semi-finished product further comprise central soft layer, it is arranged between a pair of central insulating barrier in the described rigid zone that separates, and wherein between the conductive layer at least one rigid zone that separates and insulating barrier peel ply is set.It is over each other that this allows that those insulating barriers and conductive layer are laminated in a conventional manner, and go by those pull-ups that are cut to this peel ply downwards and will be laminated to this peel ply top, removes unwanted those layers.Therefore, can produce printed circuit board with the rigid zone of different-thickness.
Preferably, this peel ply is to add bond and solvent forms by the material in the group that is selected from the metallic soap that comprises aluminium, magnesium, calcium, sodium and zinc.With these materials, those that cut down layer can be easily layer under this separate.Such peel ply is well-known, and prevents that the lamination of printed circuit board or cohesive process from effectively occuring in the coating zone at this.Peel ply on the utility model meaning is fully open in applicant's US2011/0272177A1, and wherein this peel ply is called as " preventing bonding material ".
Description of drawings
Now will be by the mode of exemplary embodiment and with reference to accompanying drawing, for a more detailed description to the utility model, wherein:
Fig. 1 to 10 has shown the stages in the process of producing printed circuit board of the present utility model.
Fig. 9 has shown this semi-finished product.
Figure 10 has shown printed circuit board of the present utility model.
Embodiment
For for simplicity, this specification is only mentioned a side of this plate, and only obviously, this printed circuit board and these semi-finished product are to produce symmetrically on the both sides of this plate.
In process shown in Figure 1 began, the central soft layer 1 that is provided with was with conductive layer 2.Peel ply 4 is applied to (Fig. 2) on the cover layer 3.Thereafter (Fig. 3) is pressed onto on this structure semi-solid preparation is material bed, to form insulating barrier 5.With these insulating barrier 5 structurings, gapped 8 to be with, for the printed circuit board that will produce provides flexibility.In Fig. 4, as seen there is another conductive layer 7 to be applied on this structure, this conductive layer 7 also is provided with gap 8.After this, can apply another structurized insulating barrier 5(Fig. 5).Can be by adding another conductive layer 7(Fig. 6) and apply first peel ply 9(Fig. 7 thereon), further process this structure.Applying insulating barrier 5(Fig. 8) after, can in this semi-finished product zone, apply another conductive layer 7(Fig. 9).Figure 10 has shown the step of removing those layers above those peel plies 4 and 9, to obtain the printed circuit board 11 in the utility model definition.
Claims (3)
1. printed circuit board (11), it comprises a plurality of insulating barrier (5) and conductive layers (2 that alternately arrange, 7), it is characterized in that this printed circuit board (11) is with at least two rigid zones, these at least two insulating barrier (5) and the conductive layers (2 that rigid zone alternately arranges, 7) quantity is different, and with at least one soft zone, it is arranged between the described rigid zone.
2. printed circuit board as claimed in claim 1, wherein those insulating barriers (5) comprise the semi-solid preparation material.
3. for the production of the semi-finished product of printed circuit board (11), it comprises a plurality of insulating barrier (5) and conductive layers (2 that alternately arrange, 7), form at least two rigid zones that separate, it is characterized in that these semi-finished product for the production of printed circuit board further comprise central soft layer (1), it is arranged between a pair of central insulating barrier (2) in the described rigid zone that separates, wherein between the conductive layer (2,7) at least one rigid zone that separates and insulating barrier (5), be provided with peel ply (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320146810 CN203206578U (en) | 2013-03-27 | 2013-03-27 | Printed circuit board and semi-finished product used for producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320146810 CN203206578U (en) | 2013-03-27 | 2013-03-27 | Printed circuit board and semi-finished product used for producing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203206578U true CN203206578U (en) | 2013-09-18 |
Family
ID=49150627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320146810 Expired - Lifetime CN203206578U (en) | 2013-03-27 | 2013-03-27 | Printed circuit board and semi-finished product used for producing same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203206578U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015172729A1 (en) * | 2014-05-16 | 2015-11-19 | At&S (China) Co., Ltd. | Semi-finished product for the production of connection systems for electronic components and method |
-
2013
- 2013-03-27 CN CN 201320146810 patent/CN203206578U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015172729A1 (en) * | 2014-05-16 | 2015-11-19 | At&S (China) Co., Ltd. | Semi-finished product for the production of connection systems for electronic components and method |
| US10729013B2 (en) | 2014-05-16 | 2020-07-28 | At&S (China) (Co., Ltd. | Semi-finished product for the production of connection systems for electronic components and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130918 |
|
| CX01 | Expiry of patent term |