CN203191681U - PCB (printed circuit board) via hole and plug hole film structure - Google Patents
PCB (printed circuit board) via hole and plug hole film structure Download PDFInfo
- Publication number
- CN203191681U CN203191681U CN 201320172724 CN201320172724U CN203191681U CN 203191681 U CN203191681 U CN 203191681U CN 201320172724 CN201320172724 CN 201320172724 CN 201320172724 U CN201320172724 U CN 201320172724U CN 203191681 U CN203191681 U CN 203191681U
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- CN
- China
- Prior art keywords
- film structure
- hole
- pcb
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a PCB (printed circuit board) via hole and plug hole film structure which is used for producing a PCB. A light hole matched with a PCB is formed in the film structure; and the size of the light hole is equal to that of a via hole of the PCB. According to the film structure disclosed by the utility model, by forming the light hole in a light transmitting part of the film, the light transmittance is greatly enhanced, the fullness of the plug hole in follow-up processes can be guaranteed, and the residue of tin sweat is effectively prevented; and the film structure disclosed by the utility model can be widely applied to the etching of industrial PCBs.
Description
Technical field
The utility model relates to a kind of industrial film structure, specifically, relates to a kind of pcb board via hole consent film structure.
Background technology
The industrial film refers generally to print the film that uses in the making sheet, it is made up of light transmission part and lightproof part, pcb board film structure generally is applied in the middle of the making of pcb board, traditional pcb board film structure does not have perforate for film light transmission part, make the printing opacity deficiency, after the light irradiation, the UV lacquer state of cure of light transmission part is bad, cause the plumpness that can not guarantee consent in the subsequent technique, generate tin sweat(ing) in the hole easily.
The utility model content
The purpose of this utility model is to overcome pcb board film structure printing opacity in the prior art and does not cause the plumpness of consent low and a kind of pcb board film via hole consent structure that easily generates the deficiency of tin sweat(ing) in the operation mesopore of back and provide is provided by force.
The technical scheme that the prior art problem that solves the utility model adopts is: a kind of pcb board via hole consent film structure, and be used for making pcb board and use, comprise the film, the described film has the light hole that is complementary with pcb board.
Further, the via hole equal and opposite in direction of described light hole and pcb board.
The beneficial effects of the utility model are:
The first, strengthen intensity of illumination.Perforate is carried out in film light transmission part, and exposure back perforate part is transmissive all, has strengthened intensity of illumination.
The second, guarantee the plumpness of consent, no tin sweat(ing).After the perforate, intensity of illumination is strengthened, and the UV lacquer of illumination part can solidify fully, and etching machine also can be good at identifying cured portion, and in addition etching makes in the operation of back, and consent is full, is difficult for the generation tin sweat(ing) in the hole in.
Description of drawings
Fig. 1 is pcb board via hole consent film structural representation among the utility model embodiment.
The realization of the utility model purpose, functional characteristics and advantage will be in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Describe the technical solution of the utility model in detail below with reference to drawings and the specific embodiments, so as clearer, understand invention essence of the present utility model intuitively.
With reference to shown in Figure 1, the film 1 of the present utility model is made up of light hole 2 and district backlight 3, and described light hole 2 is a perforate, with local all incisions that light need pass, can allow the whole transmissions of light during illumination.By this, strengthened intensity of illumination, the UV lacquer is cured, and well choked flow oil in the operation of back, is not easy to generate tin sweat(ing) in the pcb board hole, and consent is full.
The above only is preferred embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model instructions and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (2)
1. a pcb board via hole consent film structure is used for making pcb board and uses, and comprises the film, it is characterized in that the described film has the light hole that is complementary with pcb board.
2. pcb board via hole consent film structure according to claim 1 is characterized in that the via hole equal and opposite in direction of described light hole and pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320172724 CN203191681U (en) | 2013-04-09 | 2013-04-09 | PCB (printed circuit board) via hole and plug hole film structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320172724 CN203191681U (en) | 2013-04-09 | 2013-04-09 | PCB (printed circuit board) via hole and plug hole film structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203191681U true CN203191681U (en) | 2013-09-11 |
Family
ID=49108530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320172724 Expired - Fee Related CN203191681U (en) | 2013-04-09 | 2013-04-09 | PCB (printed circuit board) via hole and plug hole film structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203191681U (en) |
-
2013
- 2013-04-09 CN CN 201320172724 patent/CN203191681U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130911 Termination date: 20160409 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |