CN203185546U - Die positioning device - Google Patents
Die positioning device Download PDFInfo
- Publication number
- CN203185546U CN203185546U CN 201320090905 CN201320090905U CN203185546U CN 203185546 U CN203185546 U CN 203185546U CN 201320090905 CN201320090905 CN 201320090905 CN 201320090905 U CN201320090905 U CN 201320090905U CN 203185546 U CN203185546 U CN 203185546U
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- CN
- China
- Prior art keywords
- die
- submodule
- sub
- positioning
- pilot pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a die positioning device. The die positioning device comprises positioning bolts, springs, a female die, a sub die, a sub die structure, a female die structure and a shell, wherein the positioning bolts are respectively arranged on the upper and lower ends of the female die and connect the female die with the sub die, the left ends of the positioning bolts penetrate through the sub die and insert into the sub die structure, and the springs are arranged on the left ends of the positioning bolts; a membrane is arranged between the female die and the sub die, wherein the female die structure is arranged on the right side of the female die, and the shell wraps the sub die structure and the female die structure. The die positioning device has the beneficial effects that the die positioning device has a good internal positioning effect, is especially suitable for positioning the structureless membrane, and has the advantages of high precision, strong practicability and high application prospect.
Description
Technical field
The utility model relates to the Mould Machining field, is specifically related to a kind of die arrangement device.
Background technology
Existing injection forming mold locate mode in mould can only be utilized the product shape location, and this locate mode makes adhered film location unstability in its mould, and precision is low, influences the quality of injecting products.And can't not have by the product of bit architecture on the surface in the prior art and do to locate in the mould, therefore can better not improve adhered film position stability and product quality in the mould.
The utility model content
At the problems referred to above, the utility model aims to provide a kind of die device with positioning action.
For realizing this technical purpose, scheme of the present utility model is: a kind of die arrangement device comprises pilot pin, spring, master mold, submodule, submodule structure, master structure, shell.Pilot pin is arranged on master mold up and down on the two ends, and pilot pin makes master mold be connected with submodule, and the pilot pin left end passes submodule and penetrates submodule structure, and the pilot pin left end is provided with spring; Pad pasting places between master mold and the submodule, and wherein master structure places the right side of master mold, and shell wraps up submodule structure and master structure wherein.
As preferably, shell also is provided with set bolt in both sides up and down.
The beneficial effects of the utility model, location when improving in-mould injection pad pasting non-structure by the position for adhered film in the positioning module, precisely effectively locate the Working position of adhered film, can be applied in the positioning function of different product mechanism, tool hi-Fix product appearance is decorated the position, practical, have very high application prospect.
Description of drawings
Fig. 1 is structural representation of the present utility model.
The specific embodiment
Below in conjunction with the drawings and specific embodiments the utility model is described in further details.
As shown in Figure 1, a kind of die arrangement device comprises pilot pin 5, spring 6, master mold 2, submodule 3, submodule structure 4, master structure 1, shell 7.Pilot pin 5 is arranged on master mold about in the of 2 on the two ends, and pilot pin 5 makes master mold 2 be connected with submodule 3, and pilot pin 5 left ends pass submodule 3 and penetrate submodule structure 4, and pilot pin 5 left ends are provided with spring 6; Pad pasting 9 places between master mold 2 and the submodule 3, and wherein master structure 1 places the right side of master mold 2, and shell 7 wraps up submodule structure 4 and master structure 1 wherein.Shell also is provided with set bolt 8 in both sides about in the of 7.
The above; it only is preferred embodiment of the present utility model; not in order to limiting the utility model, any trickle modification that every foundation technical spirit of the present utility model is done above embodiment, be equal to and replace and improve, all should be included within the protection domain of technical solutions of the utility model.
Claims (2)
1. die arrangement device, comprise pilot pin, spring, master mold, submodule, submodule structure, master structure, shell, it is characterized in that: pilot pin is arranged on master mold up and down on the two ends, pilot pin makes master mold be connected with submodule, the pilot pin left end passes submodule and penetrates submodule structure, and the pilot pin left end is provided with spring; Pad pasting places between master mold and the submodule, and wherein master structure places the right side of master mold, and shell wraps up submodule structure and master structure wherein.
2. die arrangement device according to claim 1 is characterized in that: shell also is provided with set bolt in both sides up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320090905 CN203185546U (en) | 2013-02-27 | 2013-02-27 | Die positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320090905 CN203185546U (en) | 2013-02-27 | 2013-02-27 | Die positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203185546U true CN203185546U (en) | 2013-09-11 |
Family
ID=49102434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320090905 Expired - Fee Related CN203185546U (en) | 2013-02-27 | 2013-02-27 | Die positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203185546U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107511966A (en) * | 2017-09-06 | 2017-12-26 | 奥克斯空调股份有限公司 | Die arrangement device and shaped device |
-
2013
- 2013-02-27 CN CN 201320090905 patent/CN203185546U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107511966A (en) * | 2017-09-06 | 2017-12-26 | 奥克斯空调股份有限公司 | Die arrangement device and shaped device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130911 Termination date: 20140227 |