CN203165899U - Imaging device - Google Patents

Imaging device Download PDF

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Publication number
CN203165899U
CN203165899U CN 201220510550 CN201220510550U CN203165899U CN 203165899 U CN203165899 U CN 203165899U CN 201220510550 CN201220510550 CN 201220510550 CN 201220510550 U CN201220510550 U CN 201220510550U CN 203165899 U CN203165899 U CN 203165899U
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CN
China
Prior art keywords
lid
eyeglass
image device
bonding
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 201220510550
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Chinese (zh)
Inventor
栾竟恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Shenzhen R&D Co Ltd
Original Assignee
STMicroelectronics Shenzhen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by STMicroelectronics Shenzhen Manufacturing Co Ltd filed Critical STMicroelectronics Shenzhen Manufacturing Co Ltd
Priority to CN 201220510550 priority Critical patent/CN203165899U/en
Application granted granted Critical
Publication of CN203165899U publication Critical patent/CN203165899U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The embodiment of the utility model relates to an imaging device. The imaging device comprises a casing body, an image sensor IC in the casing body, a lens adjacent to the image sensor IC, and a cover body which is on the lens and is provided with an adhesive filling opening. The cover body, the casing body and the lens are defined in an adhesive receiving cavity which is connected with the adhesive filling opening. The imaging device can further comprise an adhesive material which contacts the cover body, the casing body and the lens in the adhesive receiving cavity.

Description

Image device
Technical field
The utility model relates to the field of semiconductor device, and more specifically, relates to image device.
Background technology
Typically, electronic equipment comprises the one or more camera models that strengthen media function be used to providing.For example, typical electronic equipment can utilize camera model to be used for photograph taking and video conference call.In having the typical electronic equipment of a plurality of camera models, principal phase machine module have high pixel density and adjustable focus lens systems and parafacies machine module faces forwards and have a lower picture element density.In addition, parafacies machine module can have fixing focusing lens system.
In typical electronic equipment, parafacies machine module can comprise (reflowable) camera model that can reflux.The camera model cost is less and for example install via surface-mounted connector easily though can reflux, and the camera model that can reflux may be frangible relatively when the assembling of production period.
For example, people's such as Brodie U.S. Patent application No.2009/0057544 (this application has transferred the application's assignee) discloses a kind of camera model for mobile device.Camera model comprises housing and the lid of the eyeglass on eyeglass and housing of eyeglass, bearing lens.Camera model comprises for the cartridge type mechanism that adjusts eyeglass.
Referring to Fig. 1-Fig. 2, a kind of typical camera model 10 has been described.For example, this camera model 10 as parts no.VS6559 can be available from the STMicw Electronics of Geneva, Switzerland.Camera model 10 comprises image sensor IC (IC) 25, a plurality of eyeglass 14-15 that are stacked and a plurality of interval body 17-18s adjacent with glassy layer with eyeglass that embed in glassy layer 16 in housing 12, the housing, silicon through hole (TSV) substrate 27 under the glassy layer in housing.Camera model 10 comprises the lid 11 on the eyeglass 14-15 and a plurality of adhint 19-21 that are used for adjacent component is fastened on camera model 10.The camera model 10 that can reflux is included in a plurality of projections contact 22a-22d on the dorsal part of TSV substrate 27.Typically, during manufacture, camera model 10 piles up to press from both sides folded mode.During these stacking procedures, form adhint 19-21.The latent defect of this fabrication scheme is that then stack layer may break away from if there is weak adhint.
The utility model content
Image device can comprise image sensor IC (IC) in housing, the housing, at least one eyeglass adjacent with image sensor IC and at least one eyeglass and have the lid of at least one bonding filling opening therein.Lid, housing and at least one eyeglass can be limited at least one bonding reception cavity that is communicated with at least one bonding filling opening wherein.Image device can also be included at least one bonding reception cavity and contact the jointing material of lid, housing and at least one eyeglass.Advantageously, image device is mechanically sane.
In certain embodiments, lid can have the rectangular shape that limits 4 angles, and at least one bonding filling opening is included in the corresponding bonding filling opening at each place, angle of lid.At least one bonding reception cavity can comprise the corresponding bonding reception cavity adjacent with each angle of lid.In certain embodiments, lid can have asymmetrical shape.In some other embodiment, lid can have symmetric shape.
More specifically, image device can also comprise the interval body between image sensor IC and at least one eyeglass.Image device can also comprise at least one adhint between image sensor IC and the interval body.At least one eyeglass can comprise a plurality of eyeglasses, and image device can also comprise the interval body between the adjacent mirror.
Additionally, image device can also comprise the interconnection substrate of glass on the adjacent part of image sensor IC and housing.Image device can also be included at least one adhint between the adjacent part of interconnection substrate of glass and housing.Lid can have the diaphragm of aiming at at least one eyeglass therein (aperture).
Of the present utility modelly relate to a kind of image device on the other hand, it is characterized in that, comprising: housing; Image sensor IC in the described housing; At least one eyeglass adjacent with described image sensor IC; Interval body between described image sensor IC and described at least one eyeglass; Limit the lid of the rectangular shape at four angles, it is on described at least one eyeglass and have respectively an a plurality of bonding filling opening at each place, angle of described lid; The lid of described rectangular shape, described housing and described at least one eyeglass limit a plurality of bonding reception cavity that is communicated with described a plurality of bonding filling openings respectively therein, and described a plurality of bonding reception cavity is also adjacent with each angle of the lid of described rectangular shape; And jointing material, in described a plurality of bonding reception cavitys and contact the lid of described rectangular shape, described housing and described at least one eyeglass.
Relate on the other hand for the method for making image device.This method can comprise image sensor IC is positioned in the housing, and be placed to image sensor IC at least one eyeglass adjacent.This method can also comprise being placed on lid at least one eyeglass and making to have at least one bonding filling opening therein, and lid, housing and at least one eyeglass limit at least one bonding reception cavity therein and this at least one bonding reception cavity is communicated with at least one bonding filling opening.This method can also comprise jointing material is placed at least one bonding reception cavity and contact lid, housing and at least one eyeglass.
Description of drawings
Fig. 1 is the perspective view according to the image device of prior art.
Fig. 2 is sectional view image device, 2-2 along the line of Fig. 1.
Fig. 3 is the vertical view according to image device of the present disclosure.
Fig. 4 A is sectional view image device, 4-4 along the line of Fig. 3.
Fig. 4 B is the sectional view of 4-4 along the line of image device that has Fig. 3 of jointing material therein.
Fig. 5-Fig. 8 is the vertical view according to other embodiment of the lid of the image device of Fig. 3.
Embodiment
Describe the utility model hereinafter more all sidedly now with reference to appended accompanying drawing, shown preferred embodiments more of the present utility model in the accompanying drawings.Yet the utility model can embody and be should not be construed as limited to embodiment described in this paper in many different forms.But, these embodiment are provided, thereby make that the disclosure will be comprehensive and complete, and will pass on scope of the present utility model to give those skilled in the art comprehensively.Similar numeral refers to similar element in full, and upward the slash symbol is used in reference to the similar components of generation in alternative.
At first, referring to Fig. 3 to Fig. 4 A, describe according to image device 30 of the present disclosure now.Image device 30 comprises image sensor IC 43 in housing 33, the housing, a plurality of eyeglasses 35 adjacent with image sensor IC, 37 and on eyeglass and have the lid 31 of a plurality of bonding filling opening 32a-32d therein illustratively.Housing 33 can comprise metal shell.Image device 30 comprises the TSV substrate 59 by housing 33 carryings illustratively, and image sensor IC 43 can be embedded in the TSV substrate.
Lid 31, housing 33 and eyeglass 35,37 can limit a plurality of bonding reception cavity 52a-52b that is communicated with bonding filling opening 32a-32d therein.Though only described two bonding reception cavity 52a-52b, should be appreciated that the image device 30 that illustrates is included in the bonding reception cavity of 4 of totals at the respective corners place of lid 31.
In the illustrated embodiment, lid 31 has the rectangular shape that limits four angles, and bonding filling opening 32a-32d is positioned at each angle of lid.Certainly, in some other embodiment, lid 31 can adopt other shapes.Each angle of bonding reception cavity 52a-52b and lid 31 is adjacent, and outstanding through the eyeglass of going up most 35 in the stacked arrangement of image device 30 downwards.In the illustrated embodiment, lid 31 has symmetric shape.
More specifically, image device 30 is included in interval body 38 between image sensor IC 43 and the adjacent mirror 37 and the adhint 41 between image sensor IC and the interval body illustratively.Image device 30 comprises the interval body 36 between the adjacent mirror illustratively.Additionally, image device 30 is included in the interconnection substrate of glass 42 on the adjacent part of image sensor IC 43 and housing 33 illustratively.Image device 30 comprises the adhint 53 between the adjacent part of interconnection substrate of glass 42 and housing 33 illustratively.Lid 31 is included in the diaphragm of wherein aiming at eyeglass 35,37 45 illustratively.As the skilled person will appreciate, incident light (imaging data) is hunted down by diaphragm 45 and collimates and guide into to image sensor IC 43 via eyeglass 35,37.
Additionally, image device 30 is included in a plurality of projections contact 44a-44b on the opposite side of interconnection substrate of glass 42 illustratively.Housing 33 comprises illustratively be used to opening visit, on its bottom that provides a plurality of projection contact 44a-44b.
Additionally referring to Fig. 4 B, during manufacture, the layer of image device 30 is stacked on the top of each other so that the image device of being described as among Fig. 4 A to be provided now.Afterwards, in a plurality of bonding reception cavity 52a-52b, arrange jointing material, thereby thereby make image device 30 can be included in wherein the jointing material 46 of contact and lid 31, housing 33 and eyeglass 35,37 are tightened together.In the illustrated embodiment, jointing material 46 is filled bonding reception cavity 52a-52b, but in some other embodiment, bonding reception cavity can not be completely filled, and namely is partially filled.Advantageously, image device 30 can mechanically have bigger elasticity than typical camera model.In addition, image device 30 can be under the prerequisite of typical technological process not being made remarkable change and manufactured, realizes cost thereby reduce.
Relate to the method for making image device 30 on the other hand.This method can comprise provides housing 33, place image sensor IC 43 in housing and be placed to image sensor IC at least one eyeglass 35,37 adjacent.This method comprises also and is placed on lid 31 at least one eyeglass 35,37 and makes it have therein at least one bonding filling opening 32a-32d that lid, housing 33 and at least one eyeglass limit at least one the bonding reception cavity 52a-52b that is communicated with at least one bonding filling opening therein.This method can also be included in and form jointing material 46 and contact at least one bonding reception cavity 52a-52b, thus fastening lid 31, housing 33 and at least one eyeglass 35,37.
Referring now to Fig. 5,, another embodiment of lid 31 ' is described now.In this embodiment of lid 31 ', those elements of having discussed referring to Fig. 3 to Fig. 4 B are endowed and cast aside symbol above, and great majority have no need for further discussion at this.The difference of this embodiment and embodiment before is that lid 31 ' also comprises a plurality of bonding filling opening the 32a '-32d ' at the outer perimeter edge that limits lid.In other words, bonding filling opening 32a '-32d ' comprises angle recess/depression.
Referring now to Fig. 6,, lid 31 is described now " another embodiment.At lid 31 " this embodiment in, those elements of having discussed referring to Fig. 3 to Fig. 4 B are endowed two going up and cast aside symbols and great majority need not further argumentation at this above.This embodiment is lid 31 with the difference of embodiment before " also comprise a plurality of bonding filling opening 32a "-32d ", these a plurality of bonding filling opening 32a "-32d " limit the outer perimeter edge of lid.In addition, a plurality of bonding filling opening 32a "-32d " dimensionally greater than those the bonding filling openings among the embodiment of Fig. 5.
Referring now to Fig. 7,, lid 31 is described now " ' another embodiment.At lid 31 " ' this embodiment in, those elements of having discussed referring to Fig. 3 to Fig. 4 B are endowed and cast aside symbol on three and great majority need not further argumentation above.This embodiment is lid 31 with the difference of embodiment before " ' also comprise a plurality of bonding filling opening 32a " '-32d " ', these a plurality of bonding filling opening 32a " '-32d " ' limit the outer perimeter edge of lid.In this embodiment, lid 31 " ' have asymmetrical shape illustratively.Particularly, bonding filling opening 32d " ' have a shape of oblique triangle.Advantageously, lid 31 " method of the machinery of the orientation of ' asymmetrical shape can be provided for manufacturing during manufacturing step in order to determine lid 31 " '.
Referring now to Fig. 8,, lid 31 is described now " " another embodiment.At lid 31 " " this embodiment in, those elements of having discussed referring to Fig. 3 to Fig. 4 B are endowed and cast aside symbol on four and great majority need not further argumentation above.This embodiment is lid 31 with the difference of embodiment before " " also comprise a plurality of bonding filling opening 32a " "-32d " ", these a plurality of bonding filling opening 32a " "-32d " " the outer perimeter edge of lid limited.In this embodiment, lid 31 " " have asymmetrical shape illustratively.Particularly, a bonding filling opening 32d " " be annular, and other openings 32a " " '-32b " " be rectangular shape.
After the instruction that in benefiting from front description and associated drawings, presents, be easy to expect many modifications of the present utility model and some other embodiment in those skilled in the art's the brain.Therefore, be appreciated that the utility model is not limited to disclosed specific embodiment, and be intended to modification and embodiment are comprised within the scope of the appended claims.

Claims (16)

1. an image device is characterized in that, comprising:
Housing;
Image sensor IC in the described housing;
At least one eyeglass adjacent with described image sensor IC;
Lid, on described at least one eyeglass at least and have therein at least one bonding filling opening;
Described lid, described housing and described at least one eyeglass are limited at least one bonding reception cavity that is communicated with described at least one bonding filling opening wherein; And
Jointing material is in described at least one bonding reception cavity and contact described lid, described housing and described at least one eyeglass.
2. image device according to claim 1 is characterized in that, described lid has the rectangular shape that limits four angles; Wherein said at least one bonding filling opening is included in the corresponding bonding filling opening at each place, angle of described lid; And wherein said at least one bonding reception cavity comprises the corresponding bonding reception cavity adjacent with each angle of described lid.
3. image device according to claim 1 is characterized in that, described lid has asymmetrical shape.
4. image device according to claim 1 is characterized in that, described lid has symmetric shape.
5. image device according to claim 1 is characterized in that, also is included in the interval body between described image sensor IC and described at least one eyeglass.
6. image device according to claim 5 is characterized in that, also is included at least one adhint between described image sensor IC and the described interval body.
7. image device according to claim 1 is characterized in that, described at least one eyeglass comprises a plurality of eyeglasses; And be included in interval body between the adjacent mirror.
8. image device according to claim 1 is characterized in that, also is included in the interconnection substrate of glass on the adjacent part of described image sensor IC and described housing.
9. image device according to claim 8 is characterized in that, also is included at least one adhint between the described adjacent part of described interconnection substrate of glass and described housing.
10. image device according to claim 1 is characterized in that, described lid has the diaphragm of aiming at described at least one eyeglass therein.
11. an image device is characterized in that, comprising:
Housing;
Image sensor IC in the described housing;
At least one eyeglass adjacent with described image sensor IC;
Interval body between described image sensor IC and described at least one eyeglass;
Limit the lid of the rectangular shape at four angles, it is on described at least one eyeglass and have respectively an a plurality of bonding filling opening at each place, angle of described lid;
The lid of described rectangular shape, described housing and described at least one eyeglass limit a plurality of bonding reception cavity that is communicated with described a plurality of bonding filling openings respectively therein, and described a plurality of bonding reception cavity is also adjacent with each angle of the lid of described rectangular shape; And
Jointing material is in described a plurality of bonding reception cavitys and contact the lid of described rectangular shape, described housing and described at least one eyeglass.
12. image device according to claim 11 is characterized in that, the lid of described rectangular shape has asymmetrical shape.
13. image device according to claim 11 is characterized in that, the lid of described rectangular shape has symmetric shape.
14. image device according to claim 11 is characterized in that, also is included at least one adhint between described image sensor IC and the described interval body.
15. image device according to claim 11 is characterized in that, described at least one eyeglass comprises a plurality of eyeglasses; And be included in other interval body between the adjacent mirror.
16. image device according to claim 11 is characterized in that, also is included in the interconnection substrate of glass on the adjacent part of described image sensor IC and described housing.
CN 201220510550 2012-09-28 2012-09-28 Imaging device Expired - Lifetime CN203165899U (en)

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Application Number Priority Date Filing Date Title
CN 201220510550 CN203165899U (en) 2012-09-28 2012-09-28 Imaging device

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Application Number Priority Date Filing Date Title
CN 201220510550 CN203165899U (en) 2012-09-28 2012-09-28 Imaging device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103715208A (en) * 2012-09-28 2014-04-09 意法半导体制造(深圳)有限公司 Imaging device having bonding filling opening and related method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103715208A (en) * 2012-09-28 2014-04-09 意法半导体制造(深圳)有限公司 Imaging device having bonding filling opening and related method
CN103715208B (en) * 2012-09-28 2016-12-21 意法半导体研发(深圳)有限公司 There is bonding and fill image device and the correlation technique of opening

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: ST SEMICONDUCTOR DESIGN AND APPLICATION CO., LTD.

Free format text: FORMER OWNER: STMICROELECTRONICS MANUFACTURING (SHENZHEN) CO., LTD.

Effective date: 20140630

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 518116 SHENZHEN, GUANGDONG PROVINCE TO: 518057 SHENZHEN, GUANGDONG PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20140630

Address after: 518057 SKYWORTH building, South Zone, hi tech Zone, Nanshan District Science Park, Guangdong, Shenzhen

Patentee after: STMicroelectronics (Shenzhen) R&D Co.,Ltd.

Address before: No. 12 Longgang District of Shenzhen City, Guangdong province 518116 Baolong Industrial City hi tech Avenue

Patentee before: STMICROELECTRONICS (SHENZHEN) R&D Co.,Ltd.

CP02 Change in the address of a patent holder
CP02 Change in the address of a patent holder

Address after: 5 / F East B501, South B502, North B503, 6th floor, block B, TCL Industrial Research Institute building, No. 006, Gaoxin South 1st Road, Nanshan District, Shenzhen City, Guangdong Province

Patentee after: STMicroelectronics (Shenzhen) R&D Co.,Ltd.

Address before: 518057 SKYWORTH building, South Zone, hi tech Zone, Nanshan District Science Park, Guangdong, Shenzhen

Patentee before: STMicroelectronics (Shenzhen) R&D Co.,Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20130828