CN203162584U - Integrated LED lamp with built-in glue heat-dissipating system - Google Patents
Integrated LED lamp with built-in glue heat-dissipating system Download PDFInfo
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- CN203162584U CN203162584U CN2012204934308U CN201220493430U CN203162584U CN 203162584 U CN203162584 U CN 203162584U CN 2012204934308 U CN2012204934308 U CN 2012204934308U CN 201220493430 U CN201220493430 U CN 201220493430U CN 203162584 U CN203162584 U CN 203162584U
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- heat
- heat conductive
- glue
- led chip
- conductive plate
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Abstract
The utility model discloses an integrated LED lamp with a built-in glue heat- dissipating system, which comprises a lamp shade, a lamp holder, a heat-dissipating casing, a heat conductive plate, a power supply and an LED chip, and is characterized in that the glue heat-dissipating system includes the heat-dissipating casing, the heat conductive plate and heat conductive glue; the lower part of the heat-dissipating casing is fixedly connected with the lamp holder, and the upper part is fixedly connected with the lamp shade; the heat conductive plate is fixedly connected onto the upper part of the heat-dissipating casing; the LED chip is stuck onto the heat conductive plate; the space formed by the heat conductive plate and the heat-dissipating casing is filled with the heat conductive glue; and the heat conductive glue covers the power supply. As the LED chip is stuck onto the heat conductive plate, the heat energy generated by the LED chip can be dissipated quickly; and as the space formed by the heat conductive plate and the heat-dissipating casing is filled with heat conductive glue, and the heat conductive glue covers the power supply, the heat energy can be dissipated uniformly and can be transmitted to the surface of the heat-dissipating casing. Therefore, the integrated LED lamp solves the problems of single heat conduction path, large thermal contact resistance, high local temperature and low efficiency of heat conduction.
Description
Technical field
The utility model relates to a kind of integral LED lamp of built-in encapsulating cooling system, belongs to LED lighting source technical field.
Background technology
At present, the popular direction that the integral LED lamp is used as led light source is the focus that each producer drops into research always, with regard to the integral LED lamp, led chip light decay occurs easily under higher temperature, its radiating effect directly influences its result of use and life-span, for this reason, existing integral LED lamp is typically equipped with the radiator auxiliary heat dissipation, but existing radiator and thermal source loose contact, it is too high local temperature to occur, because the heat radiation approach is single, radiating effect is poor again.
Summary of the invention
The utility model provides a kind of built-in encapsulating cooling system in order to overcome the shortcoming of existing integral LED lamp radiating effect difference and localized hyperthermia, can reach the integral LED lamp of good heat dissipation effect and equalizing temperature.
The technical solution of the utility model is, a kind of integral LED lamp of built-in encapsulating cooling system,
Comprise lampshade, lamp holder, radiating shell, heat-conducting plate, power supply, led chip, be characterized in that described encapsulating cooling system comprises radiating shell, heat-conducting plate, heat-conducting glue; Described radiating shell bottom and lamp holder are affixed, and top and lampshade are affixed, and heat-conducting plate is fixed in radiating shell top, and led chip is attached on the heat-conducting plate, and heat-conducting glue is filled in the space that heat-conducting plate and radiating shell form, and heat-conducting glue is wrapped in power supply.
Because led chip is attached on the heat-conducting plate, the heat energy that led chip is produced spreads apart rapidly, and heat-conducting glue is filled in the space that heat-conducting plate and radiating shell form, and heat-conducting glue is wrapped in power supply, and heat evenly spreads, and finally is transmitted to the radiating shell surface.It is single and thermal contact resistance is big, the problem that local temperature height, heat transfer efficiency are not high to have solved the heat pathway.Described heat-conducting glue is initially flowing liquid, and it fully contacts with radiating shell with heat-conducting plate.The heat that the heat that led chip produces and power supply produce is in same heat radiation approach, and temperature is even everywhere to make the LED lamp.
Description of drawings
Fig. 1 is a kind of integral LED modulated structure schematic diagram of built-in encapsulating cooling system.
The specific embodiment
A kind of integral LED lamp of built-in encapsulating cooling system as shown in Figure 1, comprises lampshade 1, lamp holder 7, radiating shell 6, heat-conducting plate 3, power supply 5, led chip 2, is characterized in that described encapsulating cooling system comprises radiating shell 6, heat-conducting plate 3, heat-conducting glue 4; Described radiating shell 6 bottoms and lamp holder 7 are affixed, top and lampshade 1 are affixed, and heat-conducting plate 3 is fixed in radiating shell 6 tops, and led chip 2 is attached on the heat-conducting plate 3, heat-conducting glue 4 is filled in the space that heat-conducting plate 3 and radiating shell 6 form, and heat-conducting glue 4 is wrapped in power supply 5.
Because led chip 2 is attached on the heat-conducting plate 3, the heat energy that led chip 2 is produced spreads apart rapidly, and heat-conducting glue 4 is filled in the space that heat-conducting plate 3 and radiating shell 6 form, and heat-conducting glue 4 is wrapped in power supply 5, and heat evenly spreads, and finally is transmitted to the radiating shell surface.It is single and thermal contact resistance is big, the problem that local temperature height, heat transfer efficiency are not high to have solved the heat pathway.Described heat-conducting glue 4 is initially flowing liquid, and it fully contacts with radiating shell 6 with heat-conducting plate 3.The heat that the heat that led chip 2 produces and power supply 5 produce is in same heat radiation approach, and temperature is even everywhere to make the LED lamp.
The material of described lampshade 1 is transparent or coloured material that is added with fluorescent material.
Described heat-conducting glue 4 adopts the cold curing heat conduction embedding silica gel TPC-213 that is produced by Shanghai Chooyu Chemical Co., Ltd..
Encapsulating cooling system of the present utility model is a kind of can to import to product surface very soon with the heat of LED and power supply generation, is dispersed into airborne cooling system by the surface that contacts with air again.This cooling system adopts a kind of medium to be liquid heat conduction thing in the early stage, can fill the confined space that radiating shell and heat-conducting plate are formed, and can infiltrate in the gap narrow and small between the power supply components and parts, change through the certain hour section, the liquid heat conductive thing is transformed into a kind of soft heat conduction solid, and stable performance.This cooling system requires soft heat conduction solids well to contact with the heat-conducting plate large tracts of land, heat-conducting plate mainly with soft heat conduction solid as heat conducting path.Concrete heat dissipation principle is: the heat that led chip 2 produces is transmitted to heat-conducting plate 3, is transmitted to soft heat conduction solid heat-conducting glue 4 again, and the heat loss through conduction shell 6 again, and heat-dissipating casing 6 looses heat with surface of good convection current and surface emissivity and overflows in air.The heat that power supply 5 components and parts produce is transmitted to soft heat conduction solid heat-conducting glue 4, is transmitted to radiating shell 6 again, and radiating shell 6 looses heat with surface of good convection current and surface emissivity and overflows in air.In a system, both solved the heat that led chip 2 produces like this, and also solved the heat that power supply 5 produces, and system temperature had been even, overall performance is good.
Claims (1)
1. the integral LED lamp of a built-in encapsulating cooling system, comprise lampshade (1), lamp holder (7), radiating shell (6), heat-conducting plate (3), power supply (5), led chip (2), it is characterized in that described encapsulating cooling system comprises radiating shell (6), heat-conducting plate (3), heat-conducting glue (4); Described radiating shell (6) bottom and lamp holder (7) are affixed, top and lampshade (1) are affixed, heat-conducting plate (3) is fixed in radiating shell (6) top, led chip (2) is attached on the heat-conducting plate (3), heat-conducting glue (4) is filled in the space that heat-conducting plate (3) and radiating shell (6) form, and heat-conducting glue (4) is wrapped in power supply (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204934308U CN203162584U (en) | 2012-09-26 | 2012-09-26 | Integrated LED lamp with built-in glue heat-dissipating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204934308U CN203162584U (en) | 2012-09-26 | 2012-09-26 | Integrated LED lamp with built-in glue heat-dissipating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203162584U true CN203162584U (en) | 2013-08-28 |
Family
ID=49023767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012204934308U Expired - Fee Related CN203162584U (en) | 2012-09-26 | 2012-09-26 | Integrated LED lamp with built-in glue heat-dissipating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203162584U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102900980A (en) * | 2012-09-26 | 2013-01-30 | 上海顿格电子贸易有限公司 | Integrated light-emitting diode (LED) lamp of built-in glue-filling heat dissipation system |
-
2012
- 2012-09-26 CN CN2012204934308U patent/CN203162584U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102900980A (en) * | 2012-09-26 | 2013-01-30 | 上海顿格电子贸易有限公司 | Integrated light-emitting diode (LED) lamp of built-in glue-filling heat dissipation system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130828 Termination date: 20150926 |
|
| EXPY | Termination of patent right or utility model |