CN203157258U - Copper-clad plate with high glass-transition temperature structure - Google Patents
Copper-clad plate with high glass-transition temperature structure Download PDFInfo
- Publication number
- CN203157258U CN203157258U CN 201320147127 CN201320147127U CN203157258U CN 203157258 U CN203157258 U CN 203157258U CN 201320147127 CN201320147127 CN 201320147127 CN 201320147127 U CN201320147127 U CN 201320147127U CN 203157258 U CN203157258 U CN 203157258U
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- China
- Prior art keywords
- copper
- clad plate
- transition temperature
- temperature structure
- high glass
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Abstract
The utility model discloses a copper-clad plate with a high glass-transition temperature structure, and relates to the technical field of copper-clad plates. The copper-clad plate comprises copper foil layers (1), nano compound plastic layers (2), high-toughness material layers (3) and a high glass-transition temperature structure layer (4), wherein the high-toughness material layers (3) are arranged on both sides of the high glass-transition temperature structure layer (4), the nano compound plastic layers (2) arranged outside the high-toughness material layers (3), and the copper foil layers (1) are arranged outside the nano compound plastic layers (2). Tg of the copper-clad plate is improved, and the high-toughness material layers are arranged, so that the toughness of the copper-clad plate is further improved. The copper-clad plate is internally provided with the nano compound plastic layers, so that the heat dissipation of the copper-clad plate is improved.
Description
Technical field:
The utility model relates to the copper-clad plate technical field, is specifically related to a kind of copper-clad plate with high glass-transition temperature structure.
Background technology:
Copper-clad plate is the basic material of electronics industry, is mainly used in the processing and manufacturing printed circuit board (pcb), extensively is used on the electronic products such as television set, radio, computer, computer, mobile communication.Copper-clad plate had had the history of last 100 years already, and this is one one and electronic information industry, particularly with PCB industry synchronized development, indivisible technograph.
Copper-clad plate (Copper Clad Laminate, full name copper-clad plate lamination plate, the English CCL that is called for short) is to make reinforcing material by wood pulp paper or glass cloth etc., soaks with resin, and single or double is coated with Copper Foil, a kind of product that forms through hot pressing.
Along with development of science and technology, the requirement of electronization product is more and more higher, for example, service life etc., copper-clad plate is the core component of the inside of electronic product, and at present a lot of people are at the Tg that tries every possible means to improve copper-clad plate, but the method for the Tg of raising copper-clad plate at present all can make the toughness variation of copper-clad plate, and the thermal diffusivity of the copper-clad plate of using at present is bad, reduces the service life of copper-clad plate.
The utility model content:
The purpose of this utility model provides a kind of copper-clad plate with high glass-transition temperature structure, it has improved the Tg of copper-clad plate, and is provided with the high tenacity material layer, and the toughness of copper-clad plate also is improved, its inside is provided with the nano composite plastics layer, has improved the thermal diffusivity of copper-clad plate.
In order to solve the existing problem of background technology, the utility model is by the following technical solutions: it comprises copper foil layer 1, nano composite plastics layer 2, high tenacity material layer 3 and high glass-transition temperature structure sheaf 4, the both sides external of high glass-transition temperature structure sheaf 4 is provided with high tenacity material layer 3, the arranged outside of high tenacity material layer 3 has nano composite plastics layer 2, and the arranged outside of nano composite plastics layer 2 has copper foil layer 1.
Described nano composite plastics layer 2 comprises nano plastic and inorganic filler.Can improve its thermal diffusivity.
The utlity model has following beneficial effect:
1, have good thermal diffusivity, prolong the service life of copper-clad plate,
2, have high tenacity,
3, processing technology is simple,
4, hear resistance height.
Description of drawings:
Fig. 1 is structural representation of the present utility model.
The specific embodiment:
Referring to Fig. 1, this specific embodiment is by the following technical solutions: it comprises copper foil layer 1, nano composite plastics layer 2, high tenacity material layer 3 and high glass-transition temperature structure sheaf 4, the both sides external of high glass-transition temperature structure sheaf 4 is provided with high tenacity material layer 3, the arranged outside of high tenacity material layer 3 has nano composite plastics layer 2, and the arranged outside of nano composite plastics layer 2 has copper foil layer 1.
Described nano composite plastics layer 2 comprises nano plastic and inorganic filler.Can improve its thermal diffusivity.
It has improved the Tg of copper-clad plate, and is provided with the high tenacity material layer, and the toughness of copper-clad plate also is improved, and its inside is provided with the nano composite plastics layer, has improved the thermal diffusivity of copper-clad plate.
Claims (2)
1. copper-clad plate with high glass-transition temperature structure, it is characterized in that it comprises copper foil layer (1), nano composite plastics layer (2), high tenacity material layer (3) and high glass-transition temperature structure sheaf (4), the both sides external of high glass-transition temperature structure sheaf (4) is provided with high tenacity material layer (3), the arranged outside of high tenacity material layer (3) has nano composite plastics layer (2), and the arranged outside of nano composite plastics layer (2) has copper foil layer (1).
2. a kind of copper-clad plate with high glass-transition temperature structure according to claim 1 is characterized in that described nano composite plastics layer (2) comprises nano plastic and inorganic filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320147127 CN203157258U (en) | 2013-03-28 | 2013-03-28 | Copper-clad plate with high glass-transition temperature structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320147127 CN203157258U (en) | 2013-03-28 | 2013-03-28 | Copper-clad plate with high glass-transition temperature structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203157258U true CN203157258U (en) | 2013-08-28 |
Family
ID=49018474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320147127 Expired - Fee Related CN203157258U (en) | 2013-03-28 | 2013-03-28 | Copper-clad plate with high glass-transition temperature structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203157258U (en) |
-
2013
- 2013-03-28 CN CN 201320147127 patent/CN203157258U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Guixi Huatai Copper Co.,Ltd. Assignor: Jiangxi Kaian Copper Co., Ltd. Contract record no.: 2014360000250 Denomination of utility model: Copper-clad plate with high glass-transition temperature structure Granted publication date: 20130828 License type: Exclusive License Record date: 20141226 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130828 Termination date: 20140328 |