CN203133689U - Thermal module buckle buckled with main board - Google Patents
Thermal module buckle buckled with main board Download PDFInfo
- Publication number
- CN203133689U CN203133689U CN 201320138370 CN201320138370U CN203133689U CN 203133689 U CN203133689 U CN 203133689U CN 201320138370 CN201320138370 CN 201320138370 CN 201320138370 U CN201320138370 U CN 201320138370U CN 203133689 U CN203133689 U CN 203133689U
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- CN
- China
- Prior art keywords
- thermal module
- main board
- face
- mainboard
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a thermal module buckle buckled with a main board. The thermal module buckle comprises a casing, wherein the casing is provided with at least one top surface and two opposite longitudinal surfaces; elastic sheets with downward elastic forces are arranged on the top surface; clamping hooks which penetrate through the main board and are matched with the main board are arranged on the two longitudinal surfaces, so that a thermal module is fixed with a CPU (Central Processing Unit); the elastic sheets at the top surface generate downward elastic force, and the elastic force is exerted on the CPU through copper sheets of the thermal module to keep a certain pressure on the CPU; the clamping hooks are slightly moved, and the thermal module is popped automatically by means of the elastic force to be taken down. The thermal module buckle buckled with the main board has the advantages that the structural stability is high, the use is convenient, cost reduction is guaranteed, and at the same time, the reliability in aspects of radiation, structure and the like of an assembled laptop is stable.
Description
Technical field
The utility model belongs to the computer heat radiation module, is specifically related to a kind of heat radiation module fastener that fastens with mainboard.
Background technology
In view of notebook computer heat radiation module is fixedly installed on the top of chip by fastener, present stage heat radiation module fastener exists the complicated cost of design high and have problems such as environmental protection of electroplating.Fastener is set will not dispel the heat just that module is fixed on the chip and give the certain pressure demand of chip, play the purpose that reduces thermal resistance simultaneously.There are nonlinear inverse relation in thermal resistance and pressure: the more big thermal resistance of pressure is more little.Certainly, pressure also cannot increase simply, and we must be the pressure of fastener control within the specific limits, otherwise that core is exposed to outer CPU is therefore injured probably.This shows that fastener is important components very.
At present, some most of fastener adopts die castings or stamping parts to cooperate the mode of Spring screws, and the die casting cost is higher, establishes that to become difficulty big and be difficult for repairing a die; Tolerance grade is relatively poor; And can produce metal fillings when sealed with Spring screws, bring hidden danger for system itself; Product is thick and heavy, unfavorable system layout; Need to electroplate welding, increase cost and also cause environmental pollution, in addition, adopt stamping parts, material body need be welded, but because of electroplate normal refuse to weld bad; Also need lean on 4 support columns sealed, take the mainboard space, unfavorable system layout.
The mode that adopts shell fragment to cooperate screw is arranged, and the shortcoming of this scheme is: 1) cost is higher, and public property is little; 2) product can't 100% check riveted power, defective to staking appears in die casting riveted often; 3) product only depends on heat pipe to support, intensity a little less than; 4) it is sealed that product need lean on 4 support columns, takies the mainboard space, unfavorable system layout.
Based on the computer cost consideration, reducing cost as far as possible under the requirement of satisfying user's use has become inexorable trend, and a kind of inexpensive, simple and reasonable fastener becomes current crowd and expects.
The utility model content
The technical problems to be solved in the utility model is to provide a kind of inexpensive, simple and reasonable heat radiation module fastener that fastens with mainboard.
For achieving the above object, the utility model by the following technical solutions:
A kind of heat radiation module fastener that fastens with mainboard comprises the housing that is provided with the end face vertical face relative with two at least, and described end face is provided with the shell fragment to down spring; Described two vertical faces are provided with the trip that passes mainboard and cooperate with mainboard.
Preferably, the shell fragment of described end face is three shell fragments of opening and bending that the end face fluting arranges.
Preferably, described end face arranges fluting, and upper surface arranges draw-in groove A, and lower surface arranges draw-in groove B, in the described draw-in groove A heat pipe is set, and the copper sheet of heat radiation module is set in the draw-in groove B, and described heat pipe is connected with copper sheet by fluting.
The utility model compared with prior art has the following advantages:
1) the utility model provides a kind of module that dispels the heat novel manner, and the trip of stamping parts housing is sticked on the mainboard after passing mainboard, and CPU is fixed on the mainboard, and will dispel the heat module and CPU are fixed together; The shell fragment of end face produces the copper sheet of elastic force by the heat radiation module downwards and acts on CPU, and CPU is kept certain pressure, reduces thermal resistance.
2) the utility model adopts and utilizes trip and shell fragment integraty to replace existing Spring screws or structures such as shell fragment and screw, and the support column that the quantity of minimizing overall package material requested and saving are inlayed etc. reduce material cost; And simulation heat radiation module [Dummy cooler] is convenient unified, reduces research and development in early stage expense; Sealed former material bandwidth can be unified, and reduces the cost of raw material.
3) the utility model is simple in structure, makes things convenient for ﹠amp; Simplify the tool design, processing technology is simple, the craft precision height, and it is little to take system space, saves and electroplates and the processing step of welding, and friction does not produce the aluminium bits in the time of can be because of assembling, reduces the risk of environmental pollution and main plate short.
4) the utility model is easy to assembly, saves tool and the instrument at the heat radiation module clasp worker of assembly plant station, uses manpower and material resources sparingly greatly, effectively saves and shortens built-up time, increases work efficiency.
5) the utility model structural stability height, easy to use, when the assurance cost reduces, also kept the notebook after the assembling in stable reliabilities in aspect such as heat radiation, structures, no matter in the cost reduction with at the assembling convenience or in the purpose that can reach optimization aspect the design accuracy.
Description of drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of Fig. 1 bottom surface.
Embodiment
Below in conjunction with accompanying drawing the utility model is described further:
As shown in Figure 1, 2, a kind of heat radiation module fastener that fastens with mainboard of present embodiment, comprise be provided with end face 1 with two pairs relatively and the housing of the vertical face 2 that links to each other with end face 1, described end face 1 is provided with the shell fragment 3 to down spring, and the shell fragment of described end face is three shell fragments of opening and bending that end face 1 fluting arranges; Described wherein a pair of vertical face 2 is provided with the trip 4 that passes mainboard and cooperate with mainboard.
Described end face 1 is provided with fluting 5, draw-in groove A6 and draw-in groove B7, and the copper sheet of heat radiation module is set in the described draw-in groove A6, and described draw-in groove B7 location heat pipe, described heat pipe be by the contact position point tin cream of fluting 5 with the copper sheet of heat radiation module, and both are welded.
Described trip 4 passes mainboard and is fastened on the mainboard, and heat pipe heat radiation module and CPU are fixed together; End face 1 carries the downward elastic force that produces of shell fragment 3 compressions and acts on CPU by copper sheet, and CPU is kept certain pressure, reduces thermal resistance.Take off the heat radiation module as need, gently dial trip 4 and utilize the elastic force module that will dispel the heat automatically to eject.
The utility model is applicable to need dispel the heat all chips of module heat radiation of engaging.
The utility model above-described embodiment only is this patent embodiment preferably, and the structure that all employing the technical program are described, feature and the variation on its spiritual principle, modification all belong to the protection domain of this patent.
Claims (3)
1. heat radiation module fastener that fastens with mainboard, it is characterized in that: comprise the housing that is provided with the end face vertical face relative with two at least, described end face is provided with the shell fragment to down spring; Described two vertical faces are provided with the trip that passes mainboard and cooperate with mainboard.
2. the heat radiation module fastener that fastens of according to claim 1 and mainboard is characterized in that: the shell fragment of described end face is that three of arranging of end face fluting open and the shell fragments of bending.
3. the heat radiation module fastener that fastens of according to claim 2 and mainboard, it is characterized in that: described end face arranges fluting, upper surface arranges draw-in groove A, lower surface arranges draw-in groove B, in the described draw-in groove A heat pipe is set, the copper sheet of heat radiation module is set in the draw-in groove B, and described heat pipe is connected with copper sheet by fluting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320138370 CN203133689U (en) | 2013-03-25 | 2013-03-25 | Thermal module buckle buckled with main board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320138370 CN203133689U (en) | 2013-03-25 | 2013-03-25 | Thermal module buckle buckled with main board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203133689U true CN203133689U (en) | 2013-08-14 |
Family
ID=48941656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320138370 Expired - Lifetime CN203133689U (en) | 2013-03-25 | 2013-03-25 | Thermal module buckle buckled with main board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203133689U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106937520A (en) * | 2017-05-12 | 2017-07-07 | 广东泛仕达机电有限公司 | A kind of radiator structure of built-in control panel |
-
2013
- 2013-03-25 CN CN 201320138370 patent/CN203133689U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106937520A (en) * | 2017-05-12 | 2017-07-07 | 广东泛仕达机电有限公司 | A kind of radiator structure of built-in control panel |
| CN106937520B (en) * | 2017-05-12 | 2023-11-21 | 泛仕达机电股份有限公司 | Heat radiation structure of built-in control panel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130814 |