CN203110372U - 光电镀膜材料模压模具 - Google Patents

光电镀膜材料模压模具 Download PDF

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Publication number
CN203110372U
CN203110372U CN 201320055821 CN201320055821U CN203110372U CN 203110372 U CN203110372 U CN 203110372U CN 201320055821 CN201320055821 CN 201320055821 CN 201320055821 U CN201320055821 U CN 201320055821U CN 203110372 U CN203110372 U CN 203110372U
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boss
wall
mould
pie
base
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CN 201320055821
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Inventor
谢长明
高登华
谢云
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Hubei Dongtian Micro Technology Co ltd
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HUBEI DONGTIAN OPTICAL MATERIAL TECHNOLOGY Co Ltd
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Abstract

一种光电镀膜材料模压模具,由底座,环套和冲压头组成,所述的底座上设有凸台,环套内壁下端与凸台的外壁配合,冲压头的外壁与环套内壁配合。所述的冲压头的下端面和凸台的上端面设有凹形边缘。所述的底座,环套和冲压头为不锈钢材质。本实用新型提供的一种光电镀膜材料模压模具,通过采用上述的结构,利于将细粉末状的光电镀膜材料压制成饼状,从而在相同能耗下可以获得更多产品,且饼状原料形成的粉末少,也减轻了对设备的损伤。进一步的,采用凹形边缘制得的饼状原料利于输送和搬动,进一步减少了粉末的产生。

Description

光电镀膜材料模压模具
技术领域  
    本实用新型涉及光电镀膜材料原材料的预处理领域,特别是一种光电镀膜材料模压模具。
背景技术  
光电镀膜材料原材料通常是细粉末状的,直接将粉末状的原料装入坩埚内烧结,不仅产量低,能耗高,而且粉末状原料溢出还对生产设备造成一定的损伤。
发明内容  
针对现有技术的不足,本实用新型的目的是提供一种光电镀膜材料模压模具,可以提高产品的产量,在耗费相同能耗的情况下能获得更多产品,饼状原料所形成的粉末少,对设备的损伤也减弱。
本实用新型的目的是这样实现的:一种光电镀膜材料模压模具,由底座,环套和冲压头组成,所述的底座上设有凸台,环套内壁下端与凸台的外壁配合,冲压头的外壁与环套内壁配合。 
所述的冲压头的下端面和凸台的上端面设有凹形边缘。 
所述的底座,环套和冲压头为不锈钢材质。 
本实用新型提供的一种光电镀膜材料模压模具,通过采用上述的结构,利于将细粉末状的光电镀膜材料压制成饼状,从而在相同能耗下可以获得更多产品,且饼状原料形成的粉末少,也减轻了对设备的损伤。进一步的,采用凹形边缘制得的饼状原料利于输送和搬动,进一步减少了粉末的产生。 
附图说明
下面结合附图和实施例对本实用新型作进一步说明。 
图1是本实用新型的整体结构示意图。 
图中:底座1,环套2,凸台3,冲压头4,物料5,凹形边缘6。 
具体实施方式
如图1中,一种光电镀膜材料模压模具,由底座1,环套2和冲压头4组成,所述的底座1上设有凸台3,环套2内壁下端与凸台3的外壁配合,冲压头4的外壁与环套2内壁配合。本例中的环套2内径为188mm。 
所述的冲压头4的下端面和凸台3的上端面设有凹形边缘6。由此结构,制成的饼状原料,具有圆角或倒角,利于搬动,搬动过程当中粉末不会掉落。 
所述的底座1,环套2和冲压头4为不锈钢材质。采用不锈钢材质不易腐蚀。 
使用时,将原料先装入本实用新型中,然后用压机压制成饼状后取出,再将原料饼装入坩埚内烧结。 

Claims (3)

1.一种光电镀膜材料模压模具,其特征是:由底座(1),环套(2)和冲压头(4)组成,所述的底座(1)上设有凸台(3),环套(2)内壁下端与凸台(3)的外壁配合,冲压头(4)的外壁与环套(2)内壁配合。
2.根据权利要求1所述的一种光电镀膜材料模压模具,其特征是:所述的冲压头(4)的下端面和凸台(3)的上端面设有凹形边缘(6)。
3.根据权利要求1所述的一种光电镀膜材料模压模具,其特征是:所述的底座(1),环套(2)和冲压头(4)为不锈钢材质。
CN 201320055821 2013-02-01 2013-02-01 光电镀膜材料模压模具 Expired - Lifetime CN203110372U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320055821 CN203110372U (zh) 2013-02-01 2013-02-01 光电镀膜材料模压模具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320055821 CN203110372U (zh) 2013-02-01 2013-02-01 光电镀膜材料模压模具

Publications (1)

Publication Number Publication Date
CN203110372U true CN203110372U (zh) 2013-08-07

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CN 201320055821 Expired - Lifetime CN203110372U (zh) 2013-02-01 2013-02-01 光电镀膜材料模压模具

Country Status (1)

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CN (1) CN203110372U (zh)

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Address after: 444100 Hubei province Yichang city mayor of Osaka Road No. 188 South Dangyang

Patentee after: Hubei Dongtian Micro Technology Co.,Ltd.

Address before: 444100 Hubei province Yichang city mayor of Osaka Road No. 188 South Dangyang

Patentee before: HUBEI DONGTIAN OPTIC MATERIAL TECHNOLOGY Co.,Ltd.

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Granted publication date: 20130807

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