CN203082845U - Heat-dissipating device of light-emitting diode (LED) light - Google Patents
Heat-dissipating device of light-emitting diode (LED) light Download PDFInfo
- Publication number
- CN203082845U CN203082845U CN2013200507498U CN201320050749U CN203082845U CN 203082845 U CN203082845 U CN 203082845U CN 2013200507498 U CN2013200507498 U CN 2013200507498U CN 201320050749 U CN201320050749 U CN 201320050749U CN 203082845 U CN203082845 U CN 203082845U
- Authority
- CN
- China
- Prior art keywords
- substrate
- cavity
- heat
- led
- heat pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a heat-dissipating device of a light-emitting diode (LED) light. The heat-dissipating device of the LED light comprises a heat pipe and a substrate, wherein a cavity is formed in the middle of the substrate, a connecting hole is formed in the left side of the substrate, and a connecting hole is formed in the right side of the substrate. The heat pipe comprises an evaporating section, a flowing section, and a condensation section, wherein the evaporating section comprises the cavity of the substrate and a metal copper pipe which is arranged in the cavity through the connecting hole formed in the left side, the flowing section of the heat pipe is communicated with the cavity through the connecting hole formed in the right side of the substrate, an LED chip is located on the upper end surface of the substrate. According to the heat-dissipating device of the LED light, phase-change liquid is used as a working medium of the heat pipe, heat-dissipating efficiency of the heat pipe is high, and the heat-dissipating device of the LED light has a good protective effect on the high-power LED chip.
Description
Technical field
The utility model relates to heat abstractor, particularly a kind of LED heat sink for lamp.
Background technology
Compare with the high-pressure mercury lamp of use amount maximum in road lighting, great power LED as lighting device have that colour temperature is optional, luminous efficiency is high, need not high pressure, advantage such as super brightness, colour rendering height and long-life.Heat dissipation problem is the biggest obstacle that the restriction high-power LED illumination is used.
In LED light fixture the inside, increase area of dissipation, spreader surface handled provides radiating efficiency, be subject to LED light fixture appearance and size requirement for restriction, area of dissipation can't increase, the heat radiation form can't cause present luminous flux can't do greatly with power by optimum, when making with conventional lamp relatively, the deficiency of brightness aspect, phase-change material (PCM) is in the process that itself undergoes phase transition, heat (cold) amount that can absorbing environmental, and emit heat (cold) amount to environment when needed, thus reach the purpose of control ambient temperature.The material phase transition process is an isothermal or approximate constant temperature process, and being attended by the absorption of energy or discharging phase-change thermal storage in this process is to utilize phase-change material in its phase transition process, absorbs or release heat from environment, reaches the purpose of energy storage or exoergic.Because these excellent properties of phase-change material, the preparation of using it for the LED lamp radiator will make the LED light fixture have preferable performance.When but existing phase-change material was applied to the LED lamp radiator, because conventional phase-change material temperature control range is in the LED light fixture scope of application, energy storage and heat-conducting effect were not obvious, and thermal resistance is big under the high temperature.
The utility model content
In order to overcome the shortcoming and deficiency that prior art exists, the utility model provides a kind of LED heat sink for lamp.
The technical solution adopted in the utility model is as follows:
A kind of LED heat sink for lamp, comprise heat pipe, substrate, the middle part of described substrate is provided with cavity, the described substrate left and right sides has connecting hole, described heat pipe comprises evaporator section, flow sections, condensation segment, described evaporator section comprises the cavity of substrate and is arranged on metal copper pipe in the cavity by the left side connecting hole that the flow sections of described heat pipe is communicated with cavity by the connecting hole on substrate right side, the upper surface placement led chip of described substrate.
Described cavity is a band shape cavity.
Described metal copper pipe top is provided with a plurality of spray-holes, and the injection direction of described spray-hole is vertical with the upper surface of substrate.
Said apparatus also comprises the brainpower insufflation device, and described brainpower insufflation device is installed between the evaporator section and condensation segment of heat pipe.
The condensation segment of described heat pipe is provided with fin.
Described cavity upper surface coating one deck hydrophilic material film.
The described metal copper pipe that is arranged in the cavity is 9/10ths of a metallic copper length of tube, and the tube head sealing.
The course of work of the present utility model:
Led chip produces heat, substrate is pressed close to chip one side temperature and is raise, when being raised to certain threshold value, the brainpower insufflation device starts, and phase-change liquid is ejected into the hydrophilic film of cavity by spray-hole, the phase-change liquid formation thin film that evenly distributes, be subjected to form steam after the thermal evaporation, the connecting hole through the substrate right side imports flow sections, enters condensation segment at last, carry out being condensed into liquid after the heat exchange at condensation segment and air, be back to the brainpower insufflation device through capillary pressure effect capillaceous.
The beneficial effects of the utility model:
(1) bottom of led chip is connected with heat abstractor, reduced led chip and heat sink between thermal resistance, good heat dissipation effect;
(2) adopt heat pipe heat radiation, it is long-pending significantly to have reduced the LED lamp body;
(3) use the working media of phase-change liquid as heat pipe, heat pipe heat radiation efficient height plays good protection effect to high-power LED chip;
(4) the substrate cavity wall applies hydrophilic membrane, phase-change liquid is effectively sprawled on wall come, and has increased heat transfer efficiency.
Description of drawings
Fig. 1 is a kind of structural representation of LED heat sink for lamp,
Fig. 2 is the A-A profile among Fig. 1.
Shown in the figure:
The 1-LED chip, 2-substrate, 3-heat pipe, 3-1-brainpower insufflation device, 3-2-spray-hole, 3-3 fin, 3-4-capillary, 4-cavity, I-evaporator section, II-flow sections, III-condensation segment.
The specific embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but embodiment of the present utility model is not limited thereto.
Embodiment
As shown in Figure 1, a kind of LED heat sink for lamp, comprise heat pipe 3, substrate 2, the middle part of described substrate 2 is provided with cavity 4, described substrate 2 left and right sides have connecting hole, and described heat pipe 3 comprises evaporator section I, flow sections II, condensation segment III, and described evaporator section I comprises cavity 4 and is arranged on metal copper pipe in the cavity by the left side connecting hole, the flow sections II of described heat pipe is communicated with cavity 4 by the connecting hole on substrate right side, and led chip 1 is placed in the upper surface of described substrate.
Described cavity 4 is a band shape cavity.
The condensation segment of described heat pipe is provided with fin 3-3.
Cavity upper surface coating one deck hydrophilic material film of described substrate.
The described metal copper pipe that is arranged in the cavity is 9/10ths of a metallic copper length of tube, and the tube head sealing.
Described metal copper pipe top is provided with a plurality of spray-hole 3-2, and the injection direction of described spray-hole 3-2 is vertical with the upper surface of substrate 2, and phase-change liquid is stored in the metal copper pipe.
Upper surface coating one deck hydrophilic material film of described cavity 4, described hydrophilic material is the ITO material, such structure can make phase-change liquid come at the evaporator section surface spreading of heat pipe, has increased disengagement area, thereby has accelerated radiating rate.Cold-producing medium has absorbed the heat that chip discharges in the evaporation process, and steam carries out heat exchange through the condensation segment of superheater tube and air and is condensed, and reenters the evaporator section of heat pipe through capillary 3-4, and is recycling.
Described phase-change liquid is volatile cold-producing mediums such as water or alcohol.
The upper surface of described cavity 4 is near led chip 1.
Brainpower insufflation device 3-1 is installed between the evaporator section I of heat pipe and condensation segment III, described brainpower insufflation device 3-1 comprises electronic pump, temperature detect switch (TDS), the electronic pump model is ZRTE-3402, the model of temperature detect switch (TDS) is TB02-BB1D, the metal copper pipe that specifically is positioned at the cavity outside is connected with brainpower insufflation device 3-1, and design temperature threshold value, when the LED caloric value is big, temperature surpasses certain value, brainpower insufflation device 3-1 starts, phase-change liquid is ejected into by spray-hole 3-2 on the hydrophilic film of cavity 4, quickens liquid circulation velocity.When the LED caloric value hour, temperature surpasses certain value, brainpower insufflation device 3-1 closes, and relies on capillary 3-4 to carry liquid.
The foregoing description is the utility model preferred implementation; but embodiment of the present utility model is not limited by the examples; other any do not deviate from change, the modification done under spiritual essence of the present utility model and the principle, substitutes, combination, simplify; all should be the substitute mode of equivalence, be included within the protection domain of the present utility model.
Claims (7)
1. LED heat sink for lamp, it is characterized in that, comprise heat pipe, substrate, the middle part of described substrate is provided with cavity, the described substrate left and right sides has connecting hole, and described heat pipe comprises evaporator section, flow sections, condensation segment, and described evaporator section comprises the cavity of substrate and is arranged on metal copper pipe in the cavity by the left side connecting hole, the flow sections of described heat pipe is communicated with cavity by substrate right side connecting hole, and led chip is placed in the upper surface of described substrate.
2. a kind of LED heat sink for lamp according to claim 1 is characterized in that, described cavity is a band shape cavity.
3. a kind of LED heat sink for lamp according to claim 2 is characterized in that, described metal copper pipe top is provided with a plurality of spray-holes, and the injection direction of described spray-hole is vertical with the upper surface of substrate.
4. a kind of LED heat sink for lamp according to claim 1 is characterized in that, also comprises the brainpower insufflation device, and described brainpower insufflation device is installed between the evaporator section and condensation segment of heat pipe.
5. a kind of LED heat sink for lamp according to claim 1 is characterized in that the condensation segment of described heat pipe is provided with fin.
6. a kind of LED heat sink for lamp according to claim 1 is characterized in that, cavity upper surface coating one deck hydrophilic material film of described substrate.
7. a kind of LED heat sink for lamp according to claim 1 is characterized in that, the described metal copper pipe that is arranged in the cavity is 9/10ths of a metallic copper length of tube, and the tube head sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200507498U CN203082845U (en) | 2013-01-30 | 2013-01-30 | Heat-dissipating device of light-emitting diode (LED) light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200507498U CN203082845U (en) | 2013-01-30 | 2013-01-30 | Heat-dissipating device of light-emitting diode (LED) light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203082845U true CN203082845U (en) | 2013-07-24 |
Family
ID=48828678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013200507498U Expired - Fee Related CN203082845U (en) | 2013-01-30 | 2013-01-30 | Heat-dissipating device of light-emitting diode (LED) light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203082845U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104864373A (en) * | 2015-05-26 | 2015-08-26 | 施文斌 | LED lamp heat dissipation device |
| CN104676320B (en) * | 2015-01-13 | 2017-02-01 | 中国科学院半导体研究所 | Flexible light-emitting device array and manufacture method thereof |
| CN107257936A (en) * | 2014-11-28 | 2017-10-17 | 法雷奥舒适驾驶助手公司 | Backlighting arrangement, it is particularly used for head-up display, and the head-up display for motor vehicles |
| CN107409996A (en) * | 2017-07-18 | 2017-12-01 | 华南理工大学 | A kind of LED plant cultivation devices |
| US10168041B2 (en) | 2014-03-14 | 2019-01-01 | Dyson Technology Limited | Light fixture |
| CN112254042A (en) * | 2020-10-20 | 2021-01-22 | 江苏文瑞智能科技有限公司 | Instant heat dissipation type high-power electric lighting device |
-
2013
- 2013-01-30 CN CN2013200507498U patent/CN203082845U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10168041B2 (en) | 2014-03-14 | 2019-01-01 | Dyson Technology Limited | Light fixture |
| CN107257936A (en) * | 2014-11-28 | 2017-10-17 | 法雷奥舒适驾驶助手公司 | Backlighting arrangement, it is particularly used for head-up display, and the head-up display for motor vehicles |
| CN104676320B (en) * | 2015-01-13 | 2017-02-01 | 中国科学院半导体研究所 | Flexible light-emitting device array and manufacture method thereof |
| CN104864373A (en) * | 2015-05-26 | 2015-08-26 | 施文斌 | LED lamp heat dissipation device |
| CN107409996A (en) * | 2017-07-18 | 2017-12-01 | 华南理工大学 | A kind of LED plant cultivation devices |
| CN107409996B (en) * | 2017-07-18 | 2023-11-21 | 华南理工大学 | LED plant culture device |
| CN112254042A (en) * | 2020-10-20 | 2021-01-22 | 江苏文瑞智能科技有限公司 | Instant heat dissipation type high-power electric lighting device |
| CN112254042B (en) * | 2020-10-20 | 2023-02-10 | 江苏文瑞智能科技有限公司 | Instant heat dissipation type high-power electric lighting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203082845U (en) | Heat-dissipating device of light-emitting diode (LED) light | |
| CN103174950A (en) | Light-emitting diode bulb | |
| CN201243015Y (en) | Liquid radiating device for high power light-emitting diode | |
| CN103423648A (en) | Magnetic-fluid heat-pipe high-power LED (Light Emitting Diode) lamp | |
| CN101995183A (en) | Flat heat pipe | |
| CN201396724Y (en) | Automobile LED headlight heat pipe cooling device | |
| CN101413653A (en) | A kind of vacuum liquid heat radiating device that is used for the LED light fixture | |
| CN204042816U (en) | A kind of LED radiator based on vapor chamber heat dissipation technology | |
| CN201636634U (en) | Cavity-type light-emitting diode lamp | |
| CN201145244Y (en) | Self-refrigeration cooling LED lamp | |
| CN203162619U (en) | LED lamp with high radiating efficiency | |
| CN203605188U (en) | LED mining lamp | |
| CN203686656U (en) | Light source module and light-emitting component using same | |
| CN103644556B (en) | The thermal drivers circulation lamp stand heat dissipation LED road lamp of a kind of band two check-valves | |
| Li et al. | Experimental study on natural convection cooling of LED using a flat-plate pulsating heat pipe | |
| CN208535945U (en) | A kind of pulsating heat pipe lighting electronic cooler based on interfacial effect | |
| CN203586138U (en) | LED street lamp combination type phase change heat dissipation device | |
| CN201688196U (en) | High-power LED lamp | |
| CN203656659U (en) | Led lamp | |
| CN201688367U (en) | Radiator for high-power LED lamp | |
| CN203892995U (en) | LED mining lamp using fluid phase change circulation to intensify radiation | |
| CN204693096U (en) | The LED lamp of a kind of many places heat radiation | |
| CN103644551B (en) | A kind of LED bay light | |
| CN204333037U (en) | For the heat exchange of heat pipe of semiconductor chip heat radiation | |
| CN203893719U (en) | Novel reflux tank flat heat pipe |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130724 Termination date: 20160130 |
|
| EXPY | Termination of patent right or utility model |