CN203074351U

CN203074351U - Pancake preparation die

Info

Publication number: CN203074351U
Application number: CN 201320082455
Authority: CN
Inventors: 左颖
Original assignee: Individual
Current assignee: Individual
Priority date: 2013-02-24
Filing date: 2013-02-24
Publication date: 2013-07-24
Anticipated expiration: 2023-02-24

Abstract

The utility model provides a pancake preparation die which comprises an upper die body and a lower die body, wherein a first handle and a second handle are respectively arranged at one ends of the upper and lower die bodies; the other ends of the upper and lower die bodies are fixedly connected by a hinge device; a first forming groove and a second forming groove are respectively staggered on the clamping surfaces of the upper and lower die bodies; a first overflow groove is annularly formed in the clamping surface of the upper die close to the periphery of the first forming groove; and a second overflow groove is annularly formed in the clamping surface of the lower die close to the periphery of the first forming groove so as to effectively prevent excessive baking materials from overflowing outside. According to the pancake preparation die provided by the utility model, a composite surface is arranged on the upper and lower dies, so that the heat conduction is fast, the working efficiency is obviously improved, and the resource waste is avoided.

Description

A kind of wafer manufacture mould

Technical field

The utility model relates to a kind of wafer manufacture instrument, especially relates to a kind of wafer manufacture mould.

Background technology

Existing wafer manufacture mould, in use if put into cure material too much, the excessive phenomenon that goes out die body of material then can appear curing, if cure on direct-fired heater, what overflow cures material and then can burn; If cure on electromagnetic oven, what overflow cures material and then can cause the dirt of electromagnetic oven heating surface, influences the heat conduction of electromagnetic oven.

The utility model content

The purpose of this utility model provides a kind of wafer manufacture mould, solves when using, and puts into too much when curing material, overflows the problem of making mould easily.

The technical scheme that its technical problem that solves the utility model adopts is: a kind of wafer manufacture mould, comprise upper die body and lower mold body, one end of upper die body is provided with the first in command, one end of lower mold body is provided with the second in command, the other end of upper die body and lower mold body is fixedlyed connected by splicer, the clamping area of described upper die body is provided with first forming tank, the clamping area of described lower mold body is provided with second forming tank, described first forming tank and second forming tank are crisscross arranged, it is characterized in that: near the peripheral annular of first forming tank first groove that overflows is set at the patrix clamping area, near the peripheral annular of first forming tank second groove that overflows is set at the counterdie clamping area.

In order to improve the heat conduction, the top of described upper die body is provided with first composite surface.

Further, in order to improve the heat conduction, the bottom of described lower mold body is provided with second composite surface.

The beneficial effects of the utility model: excessive groove is set in the clamping area of upper and lower mould owing to adopt, can effectively prevent to cure material and put the excessive phenomenon generation in many backs, the upper and lower mould of this wafer manufacture mould is provided with composite surface simultaneously, has the fast advantage of heat conduction, can obviously increase work efficiency, avoid the wasting of resources.

Below with reference to drawings and Examples, the utility model is carried out comparatively detailed explanation.

Description of drawings

Fig. 1 is an organigram of the present utility model.

Fig. 2 is the organigram of the utility model after launching.

Among the figure: 1. upper die body, 2. lower mold body, the 3. first in command, the 4. second in command, 5. splicer, 6. patrix clamping area, 7. first forming tank, 8. counterdie clamping area, 9. second forming tank, 10. first overflow groove, 11. second overflow grooves, 12. first composite surfaces, 13. second composite surfaces.

The specific embodiment

Embodiment, as Fig. 1, shown in Figure 2, a kind of wafer manufacture mould, comprise upper die body 1 and lower mold body 2, one end of upper die body 1 is provided with the first in command 3, one end of lower mold body 2 is provided with the second in command 4, the other end of upper die body 1 and lower mold body 2 is fixedlyed connected by splicer 5, patrix clamping area 6 at upper die body 1 is provided with first forming tank 7, counterdie clamping area 8 in lower mold body 2 is provided with second forming tank 9, described first forming tank 7 and second forming tank 9 are crisscross arranged, and it is characterized in that: near the peripheral annular of first forming tank 7 first groove 10 that overflows is set at patrix clamping area 6, near the peripheral annular of first forming tank 9 second groove 11 that overflows is set at counterdie clamping area 8.

In order to improve the heat conduction, the top of described upper die body 1 is provided with first composite surface 12.

Further, in order to improve the heat conduction, the bottom of described lower mold body 2 is provided with second composite surface 13.

Above embodiment is described preferred implementation of the present utility model; be not that scope of the present utility model is limited; under the prerequisite that does not break away from the utility model design spirit; various distortion and improvement that the common engineers and technicians in this area make the technical solution of the utility model all should fall in the definite protection domain of claims of the present utility model.

The utility model does not relate to the part prior art that maybe can adopt all same as the prior art to be realized.

Claims

1. wafer manufacture mould, comprise upper die body and lower mold body, one end of upper die body is provided with the first in command, one end of lower mold body is provided with the second in command, the other end of upper die body and lower mold body is fixedlyed connected by splicer, the clamping area of described upper die body is provided with first forming tank, the clamping area of described lower mold body is provided with second forming tank, described first forming tank and second forming tank are crisscross arranged, it is characterized in that: near the peripheral annular of first forming tank first groove that overflows is set at the patrix clamping area, near the peripheral annular of first forming tank second groove that overflows is set at the counterdie clamping area.

2. wafer manufacture mould according to claim 1 is characterized in that: the top of described upper die body is provided with first composite surface.

3. wafer manufacture mould according to claim 1 is characterized in that: the bottom of described lower mold body is provided with second composite surface.