CN103110361A - Pancake making mold - Google Patents
Pancake making mold Download PDFInfo
- Publication number
- CN103110361A CN103110361A CN201310056908XA CN201310056908A CN103110361A CN 103110361 A CN103110361 A CN 103110361A CN 201310056908X A CN201310056908X A CN 201310056908XA CN 201310056908 A CN201310056908 A CN 201310056908A CN 103110361 A CN103110361 A CN 103110361A
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- CN
- China
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- mold
- lower mold
- forming tank
- upper die
- pancake making
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a pancake making mold which comprises an upper mold and a lower mold. A first handle and a second handle are respectively arranged at one end of the upper mold and one end of the lower mold, the other end of the upper mold is fixedly connected with the other end of the lower mold by a hinge device, first forming grooves and second forming grooves are respectively arranged on a clamping surface of the upper mold and a clamping surface of the lower mold in a staggered manner, a first overflow groove is annularly arranged on the periphery, which is close to the first forming grooves, of the clamping surface of the upper mold, and a second overflow groove is annularly arranged on the periphery, which is close to the second forming grooves, of the clamping surface of the lower mold. The pancake making mold can effectively prevent overflow after excessive baking materials are placed in the pancake making mold, composite surfaces are arranged on the upper mold and the lower mold of the pancake making mold, the pancake making mold has the advantage of fast heat conduction, the work efficiency can be obviously improved, and waste of resources is prevented.
Description
Technical field
The present invention relates to a kind of wafer manufacture instrument, especially relate to a kind of wafer manufacture mould.
Background technology
Existing wafer manufacture mould, if put in use cure material too much, the excessive phenomenon that goes out die body of material can appear curing, if cure on direct-fired heater, what overflow cures material and can burn; If cure on electromagnetic oven, what overflow cures material and can cause the electromagnetic oven heating surface dirty, and the heat that affect electromagnetic oven is conducted.
Summary of the invention
The purpose of this invention is to provide a kind of wafer manufacture mould, solve when using, put into too much when curing material, easily overflow the problem of making mould.
the technical solution adopted for the present invention to solve the technical problems is: a kind of wafer manufacture mould, comprise upper die body and lower mold body, one end of upper die body is provided with the first in command, one end of lower mold body is provided with the second in command, the other end of upper die body and lower mold body is fixedly connected with by splicer, the clamping area of described upper die body is provided with the first forming tank, the clamping area of described lower mold body is provided with the second forming tank, described the first forming tank and the second forming tank are crisscross arranged, it is characterized in that: the peripheral annular in close the first forming tank of patrix clamping area arranges the first excessive groove, peripheral annular in close the first forming tank of counterdie clamping area arranges the second excessive groove.
In order to improve the heat conduction, the top of described upper die body is provided with the first composite surface.
Further, in order to improve the heat conduction, the bottom of described lower mold body is provided with the second composite surface.
Beneficial effect of the present invention: excessive groove is set owing to adopting in the clamping area of upper and lower mould, can effectively prevent from curing material and put many rear excessive phenomenons generations, the upper and lower mould of this wafer manufacture mould is provided with composite surface simultaneously, have advantages of that the heat conduction is fast, can obviously increase work efficiency, avoid the wasting of resources.
Below with reference to drawings and Examples, the present invention is described in detail.
Description of drawings
Fig. 1 is organigram of the present invention.
Fig. 2 is the organigram after the present invention launches.
In figure: 1. upper die body, 2. lower mold body, the 3. first in command, the 4. second in command, 5. splicer, 6. patrix clamping area, 7. the first forming tank, 8. counterdie clamping area, 9. the second forming tank, 10. the first overflow groove, 11. second overflow grooves, 12. first composite surfaces, 13. second composite surfaces.
The specific embodiment
embodiment, as Fig. 1, shown in Figure 2, a kind of wafer manufacture mould, comprise upper die body 1 and lower mold body 2, one end of upper die body 1 is provided with the first in command 3, one end of lower mold body 2 is provided with the second in command 4, the other end of upper die body 1 and lower mold body 2 is fixedly connected with by splicer 5, patrix clamping area 6 at upper die body 1 is provided with the first forming tank 7, counterdie clamping area 8 in lower mold body 2 is provided with the second forming tank 9, described the first forming tank 7 and the second forming tank 9 are crisscross arranged, it is characterized in that: the peripheral annular in patrix clamping area 6 close the first forming tank 7 arranges the first excessive groove 10, peripheral annular in counterdie clamping area 8 close the first forming tank 9 arranges the second excessive groove 11.
In order to improve the heat conduction, the top of described upper die body 1 is provided with the first composite surface 12.
Further, in order to improve the heat conduction, the bottom of described lower mold body 2 is provided with the second composite surface 13.
Above embodiment is described the preferred embodiment of the present invention; be not that scope of the present invention is limited; design under the prerequisite of spirit not breaking away from the present invention; various distortion and improvement that the common engineers and technicians in this area make technical scheme of the present invention all should fall in the definite protection domain of claims of the present invention.
The part that the present invention does not relate to all prior art that maybe can adopt same as the prior art is realized.
Claims (3)
1. wafer manufacture mould, comprise upper die body and lower mold body, one end of upper die body is provided with the first in command, one end of lower mold body is provided with the second in command, the other end of upper die body and lower mold body is fixedly connected with by splicer, the clamping area of described upper die body is provided with the first forming tank, the clamping area of described lower mold body is provided with the second forming tank, described the first forming tank and the second forming tank are crisscross arranged, it is characterized in that: the peripheral annular in close the first forming tank of patrix clamping area arranges the first excessive groove, peripheral annular in close the first forming tank of counterdie clamping area arranges the second excessive groove.
2. wafer manufacture mould according to claim 1, it is characterized in that: the top of described upper die body is provided with the first composite surface.
3. wafer manufacture mould according to claim 1, it is characterized in that: the bottom of described lower mold body is provided with the second composite surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310056908XA CN103110361A (en) | 2013-02-24 | 2013-02-24 | Pancake making mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310056908XA CN103110361A (en) | 2013-02-24 | 2013-02-24 | Pancake making mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103110361A true CN103110361A (en) | 2013-05-22 |
Family
ID=48408762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310056908XA Pending CN103110361A (en) | 2013-02-24 | 2013-02-24 | Pancake making mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103110361A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4373429A (en) * | 1980-02-27 | 1983-02-15 | Haas Franz Sen | Steam sealing strip for water baking plates |
| CN2087482U (en) * | 1991-03-13 | 1991-10-30 | 张一禹 | High-efficiency baking pan |
| CN2659303Y (en) * | 2003-12-08 | 2004-12-01 | 苏州欧意电器科技有限公司 | Dual-side frying pan |
| CN201073223Y (en) * | 2007-08-16 | 2008-06-18 | 何广军 | Novel double face cooking pan |
| CN203074351U (en) * | 2013-02-24 | 2013-07-24 | 左颖 | Pancake preparation die |
-
2013
- 2013-02-24 CN CN201310056908XA patent/CN103110361A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4373429A (en) * | 1980-02-27 | 1983-02-15 | Haas Franz Sen | Steam sealing strip for water baking plates |
| CN2087482U (en) * | 1991-03-13 | 1991-10-30 | 张一禹 | High-efficiency baking pan |
| CN2659303Y (en) * | 2003-12-08 | 2004-12-01 | 苏州欧意电器科技有限公司 | Dual-side frying pan |
| CN201073223Y (en) * | 2007-08-16 | 2008-06-18 | 何广军 | Novel double face cooking pan |
| CN203074351U (en) * | 2013-02-24 | 2013-07-24 | 左颖 | Pancake preparation die |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130522 |