CN203065609U - Novel anode plate and mold thereof - Google Patents
Novel anode plate and mold thereof Download PDFInfo
- Publication number
- CN203065609U CN203065609U CN2012206757011U CN201220675701U CN203065609U CN 203065609 U CN203065609 U CN 203065609U CN 2012206757011 U CN2012206757011 U CN 2012206757011U CN 201220675701 U CN201220675701 U CN 201220675701U CN 203065609 U CN203065609 U CN 203065609U
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- CN
- China
- Prior art keywords
- copper
- plate layer
- copper plate
- positive plate
- anode plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Electrolytic Production Of Metals (AREA)
Abstract
The utility model discloses a novel anode plate. The novel anode plate comprises a copper plate layer and a main plate, wherein a plurality of bulges are formed on the surface of the copper plate layer, and insulating nails are arranged on the surface of the copper plate layer. A plurality of sunk portions are formed in the surface of the internal wall of a mold of the novel anode plate, and the bulges are formed on the surface of the copper plate layer, so that the contact area between the copper plate layer and an electrolyte is increased compared with a copper plate layer with a smooth surface, and the reaction rate and production efficiency of copper electrolysis are accelerated. The insulating nails are arranged on the surface of the copper plate layer, so that the anode plate can be subjected to insulating protection.
Description
Technical field
The utility model belongs to the technical field of electrolyzer, relates in particular to a kind of novel positive plate and mould thereof.
Background technology
Positive plate is to be made by blister copper (copper content is about 99%), when electrolytic copper, blister copper on the positive plate is dissolved into cupric ion and is moved to negative electrode, arrive electron gain behind the negative electrode and separate out fine copper at negative electrode, existing positive plate is level and smooth surface, and electrochemical reaction is just carried out on the surface of positive plate, as only being smooth-flat-surface, less with the contact area of electrolytic solution, speed of reaction is slower, and production efficiency is lower.
The utility model content
The technical problems to be solved in the utility model provides a kind of novel positive plate and mould thereof, can accelerate the speed of reaction of electrolytic copper.
In order to solve the problems of the technologies described above, the utility model provides following technical scheme: a kind of novel positive plate, comprise copper coin layer and mainboard, and the surface of described copper coin layer is several projectioies, the mainboard of copper coin layer is provided with insulated hanger.Produce the mould of above-mentioned novel positive plate, also be provided with several depressed parts on the inwall of described mould.
Compared with prior art, advantage of the present utility model is: the copper coin layer and inner wall surface mould are several projectioies, with respect to level and smooth copper coin laminar surface, have increased the contact area with electrolytic solution, have accelerated speed of reaction and the production efficiency of electrolytic copper.The surface of copper coin layer is provided with insulated hanger, but the firm and hard existing insulation protection of antianode.
Description of drawings
Below in conjunction with drawings and Examples technical solutions of the utility model are further specified:
Fig. 1 is the structural representation of the novel positive plate embodiment of the utility model;
Fig. 2 is the structural representation of the novel positive plate template of the utility model embodiment;
Embodiment
As depicted in figs. 1 and 2, a kind of novel positive plate of the utility model comprises copper coin layer 1 and mainboard, and the surface of described copper coin layer 1 is several projectioies 3, and the mainboard of copper coin layer 1 is provided with insulated hanger 2.Produce the mould of above-mentioned novel positive plate, also be provided with several depressed parts 4 on the inwall of described mould.
The utility model copper coin layer 1 is several projectioies 3, with respect to level and smooth copper coin layer 1 surface, has increased the contact area with electrolytic solution, has accelerated speed of reaction and the production efficiency of electrolytic copper.The surface of copper coin layer 1 is provided with insulated hanger 2, but the firm and hard existing insulation protection of antianode.
For a person skilled in the art; under the prerequisite that does not break away from the utility model structure; can also make some distortion and improvement, these also should be considered as protection domain of the present utility model, and these can not influence effect and practical applicability that the utility model is implemented.
Claims (2)
1. a novel positive plate comprises copper coin layer and mainboard, it is characterized in that: the surface of described copper coin layer is several projectioies, and the mainboard of copper coin layer is provided with insulated hanger.
2. as the mould of the described novel positive plate of production claim 1, it is characterized in that: the inwall of described mould is provided with several depressed parts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012206757011U CN203065609U (en) | 2012-12-10 | 2012-12-10 | Novel anode plate and mold thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012206757011U CN203065609U (en) | 2012-12-10 | 2012-12-10 | Novel anode plate and mold thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203065609U true CN203065609U (en) | 2013-07-17 |
Family
ID=48764421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012206757011U Expired - Fee Related CN203065609U (en) | 2012-12-10 | 2012-12-10 | Novel anode plate and mold thereof |
Country Status (1)
Country | Link |
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CN (1) | CN203065609U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104790019A (en) * | 2015-05-06 | 2015-07-22 | 江苏金奕达铜业股份有限公司 | Copper ball for PCB and processing method |
CN104790020A (en) * | 2015-05-06 | 2015-07-22 | 江苏金奕达铜业股份有限公司 | Copper particle and processing method thereof |
-
2012
- 2012-12-10 CN CN2012206757011U patent/CN203065609U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104790019A (en) * | 2015-05-06 | 2015-07-22 | 江苏金奕达铜业股份有限公司 | Copper ball for PCB and processing method |
CN104790020A (en) * | 2015-05-06 | 2015-07-22 | 江苏金奕达铜业股份有限公司 | Copper particle and processing method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130717 Termination date: 20131210 |