CN203042196U - Three-dimensional electronic endoscope photographic device - Google Patents

Three-dimensional electronic endoscope photographic device Download PDF

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Publication number
CN203042196U
CN203042196U CN 201320027030 CN201320027030U CN203042196U CN 203042196 U CN203042196 U CN 203042196U CN 201320027030 CN201320027030 CN 201320027030 CN 201320027030 U CN201320027030 U CN 201320027030U CN 203042196 U CN203042196 U CN 203042196U
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China
Prior art keywords
lens
towards
electronic endoscope
dimensional electronic
sub
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Expired - Fee Related
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CN 201320027030
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Chinese (zh)
Inventor
王立强
唐佳
徐进
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HANGZHOU SHOUTIAN PHOTOELECTRIC TECHNOLOGY Co Ltd
Zhejiang University ZJU
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HANGZHOU SHOUTIAN PHOTOELECTRIC TECHNOLOGY Co Ltd
Zhejiang University ZJU
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Abstract

The utility model discloses a three-dimensional electronic endoscope photographic device. The three-dimensional electronic endoscope photographic device comprises two tiny lenses which are identical in structure and parallel in light paths and a printed circuit board (PCB) parallel to axes of the tiny lenses. Two complementary metal oxide semiconductor (CMOS) imaging sensors, two low voltage differential signaling (LVDS) encoding chips and two active crystal oscillators are symmetrically installed on two sides of the PCB. A prism is fixed at the tail end of each tiny lens, incident rays of the tiny lenses are totally reflected through the prisms and imageries on photosurfaces, forming an included angle of 90 degrees with a preimage surface, of the CMOS imaging sensors. Digital image signals and vertical and horizontal synchronizing signals output by the CMOS imaging sensors are encoded into differential signals by the LVDS encoding chips, and then the differential signals are conducted out by conductor bundles. According to the three-dimensional electronic endoscope photographic device, the CMOS imaging sensors with high resolution are adopted, the LVDS encoding chips can achieve data high-rate transmission, and low power and anti-noise performance can be achieved. By adopting the three-dimensional electronic endoscope photographic device, high-quality three-dimensional images can be obtained even image data are reconstructed after long-distance transmission.

Description

A kind of three-dimensional electronic endoscope image pick-up device
Technical field
This utility model relates to a kind of three-dimensional electronic endoscope image pick-up device, belongs to the medical equipment technical field.
Background technology
Plurality of advantages such as chamber mirror surgery is a big main flow of micro-wound surgical operation development from now on, compares with traditional abdominal, and it is light to have an operation wound, and patient's misery is little, and post-operative recovery is fast; Endoscopic apparatus is the key equipment of chamber mirror surgery, and auxiliary doctor carries out micro-wound surgical operation.Endoscopic apparatus is the extension of doctor's vision, need not out abdomen and can observe internal organs of the body, carries out disease treatment and operation.But the existing doctor in operation of endoscope can't obtain the true vision imaging clear, that third dimension is strong as abdominal, cause some endoscope-assistant surgery operating difficultiess, damage the important organ structure in the art easily, situations such as the incidence rate of severe complication obviously increases, so three-dimensional electronic endoscope mirror device arises at the historic moment.
Three-dimensional electronic endoscope is a kind of with two groups of miniature CMOS shooting modules endoscope tip portion of packing into, with the three-dimensional electronic endoscope of cable replacement glass fibre images signal.Compare the fiber fujinon electronic video endoscope, fujinon electronic video endoscope has plurality of advantages such as resolution height, definition height, no visual field stain.Simultaneously, distant surveillance and control easily again, and can adopt image processing techniques to obtain important characteristic information, realize the quantitative analysis of early stage focus and accurately diagnosis.But three-dimensional electronic endoscope provides 3-D view Xiang the doctor, makes doctor's implementation and operation more accurately, and success rate and the efficient of operation technique obviously improve, and patient's misery further alleviates.
Summary of the invention
The purpose of this utility model is to provide a kind of three-dimensional electronic endoscope image pick-up device with high-resolution, small size, low cost, employing cmos image sensor.
For achieving the above object, three-dimensional electronic endoscope image pick-up device of the present utility model comprises the cylinder with bonnet, axis at cylinder fixedly has the PCB printed circuit board (PCB), be symmetrically installed with two identical in structure lens barrels in the cylinder, the axis of lens barrel is parallel with the axis of cylinder, first lens are arranged in each lens barrel from the object side to the image side successively, second lens, first spacer ring and first balsaming lens constitute micro-lens, wherein first lens are minus lens, it is convex surface towards the object space face, towards being concave surface as the aspect, second lens are convex lens, it is the plane towards the object space face, towards being convex surface as the aspect, first balsaming lens is formed by first sub-lens and second sub-lens gummed, first sub-lens is concavees lens, it is the plane towards the object space face, towards being concave surface as the aspect, second sub-lens is convex lens, it is convex surface towards the object space face, towards being convex surface as the aspect, wherein the convex surface of first sub-lens towards the concave surface of picture side and second sub-lens towards object space is cemented surface, the end of lens barrel has one section screw thread, two camera lens mount pads that prism is installed are connected on the screw thread of lens barrel end by screw thread is stubborn respectively, lateral symmetry at the PCB printed circuit board (PCB) is equipped with two cmos image sensors, two LVDS coding chips and two active crystal oscillators, the incident ray of micro-lens is through the prism total reflection, image on the photosurface with the cmos image sensor of barrelshift line parallel, the primary image plane of micro-lens and the optical window of cmos image sensor are 90 oThe angle, the data image signal of cmos image sensor output and field, line synchronising signal are encoded into differential signal through the LVDS coding chip and draw from the bonnet center through strand.
In this utility model, the resolution of described two cmos image sensors all is not less than 1,000,000 pixels, and optical specification is not more than 1/4 ".Described strand comprises power line, differential signal line and control signal wire.
Three-dimensional electronic endoscope image pick-up device of the present utility model adopts high-resolution cmos image sensor, the LVDS coding chip can be realized the transmission of data high-speed rate, and can also keep low-power and noise robustness, adopt this technical scheme to make view data still can obtain high-quality 3-D view when after long Distance Transmission more than 2 meters, rebuilding.Simultaneously, the incident ray of two micro-lens is through the prism total reflection, images on the photosurface with the cmos image sensor of barrelshift line parallel, and the primary image plane of micro-lens and the optical window of cmos image sensor are 90 oThe angle has dwindled the integral installation size greatly.This device particularly is applicable to the upper and lower gastral medical detection of human body guaranteeing to have reduced manufacturing cost under high-resolution, the undersized prerequisite.
Description of drawings
Fig. 1 is the population structure sketch map of this utility model three-dimensional electronic endoscope image pick-up device.
Fig. 2 is the structural representation of the micro-lens of this utility model three-dimensional electronic endoscope image pick-up device.
Fig. 3 is the front end face sketch map of three-dimensional electronic endoscope image pick-up device.
Among the figure: 1. micro-lens; 2. camera lens mount pad; 3.PCB printed circuit board (PCB); 4.CMOS imageing sensor; 5.LVDS coding chip; 6. active crystal oscillator; 7. strand; 8. cylinder; 9. bonnet; 10. prism; 101. first lens; 102. second lens; 103. first spacer ring; 104. first balsaming lens; 104a. first sub-lens; 104b. second sub-lens; 105. lens barrel; 106. screw thread; 801. micro-lens installing hole; 802. illuminator installing hole.
The specific embodiment
Below in conjunction with accompanying drawing this utility model is elaborated.
See figures.1.and.2, three-dimensional electronic endoscope image pick-up device of the present utility model comprises the cylinder 8 with bonnet 9, axis at cylinder 8 fixedly has PCB printed circuit board (PCB) 3, be symmetrically installed with two identical in structure lens barrels 105 in the cylinder 8, the axis of lens barrel 105 is parallel with the axis of cylinder 8, first lens 101 are arranged in each lens barrel 105 from the object side to the image side successively, second lens 102, first spacer ring 103 and first balsaming lens 104 constitute micro-lens 1, wherein first lens 101 are minus lens, it is convex surface towards the object space face, towards being concave surface as the aspect, second lens 102 are convex lens, it is the plane towards the object space face, towards being convex surface as the aspect, first balsaming lens 104 is formed by the first sub-lens 104a and second sub-lens gummed 104b, the first sub-lens 104a is concavees lens, it is the plane towards the object space face, towards being concave surface as the aspect, the second sub-lens 104b is convex lens, it is convex surface towards the object space face, towards being convex surface as the aspect, wherein the convex surface of the first sub-lens 104a towards the concave surface of picture side and the second sub-lens 104b towards object space is cemented surface, here also be the aperture diaphragm of optical system first spacer ring, 103 fixing lens the time, end at lens barrel 105 has one section screw thread 106, two camera lens mount pads 2 that prism 10 is installed are connected on the screw thread 106 of lens barrel 105 ends by screw thread is stubborn respectively, lateral symmetry at PCB printed circuit board (PCB) 3 is equipped with two cmos image sensors 4, two LVDS coding chips 5 and two active crystal oscillators 6, the incident ray of micro-lens 1 is through prism 10 total reflections, image on the photosurface with the cmos image sensor 4 of barrelshift line parallel, the optical window of the primary image plane of micro-lens 1 and cmos image sensor 4 is 90 oThe angle, the data image signal of cmos image sensor 4 outputs and field, line synchronising signal are encoded into differential signal through LVDS coding chip 5 and draw from bonnet 9 centers through strand 7.Be provided with micro-lens installing hole 801 and illuminator installing hole 802(sees Fig. 3 at the front end face of the cylinder 8 of three-dimensional electronic endoscope image pick-up device).
When carrying out abdominal operation, peritoneoscope of the present utility model is stretched into the sufferer abdominal cavity, then under the cooperation of illuminator, the 3-D view of in-vivo tissue is through micro-lens 1 imaging and by prism 10 turnovers in the camera lens mount pad 2, be imaged on the photosurface of cmos image sensor 4, cmos image sensor 4 converts optical signal to the signal of telecommunication, and this signal of telecommunication is behind LVDS coding chip 5 codings, spread out of through strand 7 external, to carry out image reconstruction.Adopt cmos image sensor 4 can realize high-resolution imaging (resolution is better than mega pixel), adopt LVDS coding 5 can realize long distance and the high fidelity transmission of signal more than 2 meters, when guaranteeing the high quality graphic picked-up and transmitting, the size of having dwindled camera head.This three-dimensional electronic endoscope image pick-up device can reach the resolution of 1,300,000 pixels and the visual field of 140 degree.
This utility model three-dimensional electronic endoscope image pick-up device adopts the cmos image sensor of low cost, low-power consumption, resolution can reach 1,300,000 pixels, the image sensor chip symmetry is installed on the both sides of PCB printed circuit board (PCB), and adopt small size LVDS coding chip that the output high-frequency digital signal of cmos image sensor is encoded to differential signal, grow the high fidelity transmission of distance.Adopt aspheric lens, can realize the imaging of big visual field, little distortion: in conjunction with the antimierophonic characteristic of LVDS coding chip, and through the reconstruction of image with handle synchronously, can obtain high-quality 3-D view external, simultaneously, prolonged the active length of whole fujinon electronic video endoscope equipment.

Claims (3)

1. three-dimensional electronic endoscope image pick-up device, it is characterized in that: comprise the have bonnet cylinder (8) of (9), axis at cylinder (8) fixedly has PCB printed circuit board (PCB) (3), be symmetrically installed with two identical in structure lens barrels (105) in the cylinder (8), the axis of lens barrel (105) is parallel with the axis of cylinder (8), first lens (101) are arranged in each lens barrel (105) from the object side to the image side successively, second lens (102), first spacer ring (103) and first balsaming lens (104) constitute micro-lens (1), wherein first lens (101) are minus lens, it is convex surface towards the object space face, towards being concave surface as the aspect, second lens (102) are convex lens, it is the plane towards the object space face, towards being convex surface as the aspect, first balsaming lens (104) is formed by first sub-lens (104a) and second sub-lens gummed (104b), first sub-lens (104a) is concavees lens, it is the plane towards the object space face, towards being concave surface as the aspect, second sub-lens (104b) is convex lens, it is convex surface towards the object space face, towards being convex surface as the aspect, wherein the convex surface of first sub-lens (104a) towards the concave surface of picture side and second sub-lens (104b) towards object space is cemented surface, the end of lens barrel (105) has one section screw thread (106), two camera lens mount pads (2) that prism (10) is installed are twisted on the screw thread (106) that is connected on lens barrel (105) end by screw thread respectively, lateral symmetry at PCB printed circuit board (PCB) (3) is equipped with two cmos image sensors (4), two LVDS coding chips (5) and two active crystal oscillators (6), the incident ray of micro-lens (1) is through prism (10) total reflection, image on the photosurface with the cmos image sensor (4) of barrelshift line parallel, the optical window of the primary image plane of micro-lens (1) and cmos image sensor (4) is 90 oThe angle, the data image signal of cmos image sensor (4) output and field, line synchronising signal are encoded into differential signal through LVDS coding chip (5) and draw from bonnet (9) center through strand (7).
2. three-dimensional electronic endoscope image pick-up device according to claim 1, it is characterized in that: the resolution of described two cmos image sensors (4) all is not less than 1,000,000 pixels, and optical specification is not more than 1/4 ".
3. three-dimensional electronic endoscope image pick-up device according to claim 1, it is characterized in that: described strand (7) comprises power line, differential signal line and control signal wire.
CN 201320027030 2013-01-18 2013-01-18 Three-dimensional electronic endoscope photographic device Expired - Fee Related CN203042196U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103070660A (en) * 2013-01-18 2013-05-01 浙江大学 Three-dimensional electronic endoscope image pick-up device
CN105725953A (en) * 2016-01-21 2016-07-06 深圳市鹏瑞智能技术应用研究院 Hard laparoscope
CN116473491A (en) * 2023-04-21 2023-07-25 极限人工智能有限公司 3D electronic endoscope lens and 3D electronic endoscope

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103070660A (en) * 2013-01-18 2013-05-01 浙江大学 Three-dimensional electronic endoscope image pick-up device
CN105725953A (en) * 2016-01-21 2016-07-06 深圳市鹏瑞智能技术应用研究院 Hard laparoscope
CN116473491A (en) * 2023-04-21 2023-07-25 极限人工智能有限公司 3D electronic endoscope lens and 3D electronic endoscope

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20130710

Termination date: 20190118