CN203027606U - Distressing equipment of circuit board - Google Patents
Distressing equipment of circuit board Download PDFInfo
- Publication number
- CN203027606U CN203027606U CN 201320003237 CN201320003237U CN203027606U CN 203027606 U CN203027606 U CN 203027606U CN 201320003237 CN201320003237 CN 201320003237 CN 201320003237 U CN201320003237 U CN 201320003237U CN 203027606 U CN203027606 U CN 203027606U
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- equipment
- temperature
- destressing equipment
- circuit board
- warm area
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Abstract
The utility model relates to distressing equipment of a circuit board. The distressing equipment of the circuit board comprises a conveying belt and a heating device. At least three temperature areas are arranged along the length direction of the distressing equipment. The heating device is used for heating all the temperature areas to 129.5 DEG C-351 DEG C, and rising the temperature of the temperature area in the middle area of the distressing equipment to be higher or close to the temperature of the temperature areas at the inlet and outlet of the distressing equipment. By utilizing the distressing equipment, the stress of a base plate can be eliminated, so that the expansion of the base plate can be maintained within a control range.
Description
Technical field
The utility model relates to the circuit board technology field, relates in particular to the method for removing stress of circuit board and the destressing equipment of circuit board.
Background technology
At present, along with market increasing substantially consumption electronic products (comprising mobile phone, notebook computer, digital camera, game machine etc.) demand, the printed circuit board (PCB) of electronic product (Printed Circuit Board, PCB) is also to compact, high frequency and multi-functional future development.Substrate is the stock of making printed circuit board (PCB), generally, what substrate adopted is copper clad laminate, it is to soak with the resin adhesive with reinforcing material (Reinforement Material), by processing procedures such as oven dry, cutting, curing, then be overlapped into blank, then be covered with Copper Foil,, be shaped to process through HTHP in hot press and make as mould with steel plate.
But substrate is in the processing procedures such as oven dry, curing, and its inside tends to gather stress, if above-mentioned stress can not discharge well, causes possibly substrate in ambient stress and crooked, and may cause substrate breakage.
The utility model content
In view of above-mentioned condition, be necessary to provide a kind of destressing equipment of circuit board.
The destressing equipment of circuit board provided by the utility model, comprise conveyer belt and heater, destressing equipment is provided with at least three warm areas along its length direction, heater is used for the temperature of each warm area is heated to 129.5 ℃ ~ 351 ℃, and the temperature that will be positioned at the warm area of destressing equipment zone line is heated above the temperature near the warm area of the outlet of destressing equipment and porch, and conveyer belt is used for the speed transmission past stress equipment of circuit board with 0.2 ~ 3.0 m/min.
In the utility model, by heating destressing equipment, make the temperature of its each warm area be positioned at 129.5 ℃ ~ 351 ℃, and the temperature that makes the warm area that is positioned at destressing equipment zone line is higher than the temperature near the warm area of the outlet of destressing equipment and porch, with substrate with the speed of 0.2 ~ 3.0 m/min by destressing equipment, to eliminate the thermal stress of substrate, guarantee that the distortion size (being the harmomegathus size) of substrate remains in predetermined harmomegathus scope.Thereby make the utility model can the stress of substrate is released, avoided substrate bending and fracture phenomena in ambient stress, and can also guarantee that the harmomegathus size of substrate maintains in the scope of management and control.
Description of drawings
Fig. 1 is the main Organization Chart of the destressing equipment of the circuit board that proposes of the utility model embodiment.
Embodiment
Be to reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the utility model, below in conjunction with accompanying drawing and preferred embodiment, to embodiment of the present utility model, structure, feature and effect thereof, be described in detail as follows.
Fig. 1 is the main Organization Chart of the destressing equipment of the circuit board that proposes of the utility model embodiment.See also Fig. 1, the destressing equipment of circuit board comprises heater 201 and conveyer belt 203.
Above-mentioned destressing equipment is provided with at least three warm areas along its length direction.Particularly, destressing equipment is provided with 3 ~ 25 warm areas, and preferably, destressing equipment is provided with 12 warm areas, and the quantity of warm area can be adjusted according to the correlated conditions such as length of destressing equipment in the utility model.
Particularly, heater 201 comprises infrared light supply, and this heater 201 offers the temperature that the power of the infrared light supply of destressing equipment is heated to each warm area to be scheduled to by change.Be provided with in the embodiment of 12 warm areas at destressing equipment, the temperature range of these 12 warm areas is followed successively by from the entrance and exit place of destressing equipment: 178.5 ℃ ~ 331.5 ℃, 175 ℃ ~ 325 ℃, 175 ℃ ~ 325 ℃, 175 ℃ ~ 325 ℃, 175 ℃ ~ 325 ℃, 175 ℃ ~ 325 ℃, 189 ℃ ~ 351 ℃, 175 ℃ ~ 325 ℃, 175 ℃ ~ 325 ℃, 175 ℃ ~ 325 ℃, 161 ℃ ~ 299 ℃, 129.5 ℃ ~ 240.5 ℃.That is to say, the temperature of warm area that is positioned at the zone line of destressing equipment is preferably 189 ℃ ~ 351 ℃, the temperature of the warm area of the porch of close destressing equipment is preferably 178.5 ℃ ~ 331.5 ℃, and the temperature of the warm area in the exit of close destressing equipment is preferably 129.5 ℃ ~ 240.5 ℃.In an embodiment of the present utility model, the temperature of these 12 warm areas is preferably from the entrance and exit place of destressing equipment: 255 ℃, 250 ℃, 250 ℃, 250 ℃, 250 ℃, 250 ℃, 250 ℃, 270 ℃, 250 ℃, 250 ℃, 230 ℃, 185 ℃.That is to say, in this embodiment, the temperature of warm area that is positioned at the zone line of destressing equipment is 270 ℃, is 255 ℃ near the temperature of the warm area of the porch of destressing equipment, is 185 ℃ near the temperature of the warm area in the exit of destressing equipment.
Conveyer belt 203 is used for the speed transmission past stress equipment of circuit board with 0.2 ~ 3.0 m/min.Preferably, can be with substrate with the speed of 0.84 m/min by destressing equipment.Like this, substrate heats by at least three warm areas of destressing equipment successively, through the process of cooling again that first heats up, can effectively eliminate the stress of substrate, and can guarantee that the distortion size of substrate remains in predetermined harmomegathus scope.
adopt the harmomegathus scope of the circuit board that the destressing equipment of the utility model circuit board obtains below by experimental verification, experimental data is as follows: circuit board (is comprised substrate, the carbon ink that is coated with on resistance and resistance) with the speed of 0.84 m/min by being provided with the destressing equipment of 12 warm areas, the design temperature of each warm area as shown in Table 1, experimental condition according to table one, by three experiments, 6 circuit boards of each sampling are verified, the distortion size that can record the circuit board that the destressing equipment that adopts the utility model circuit board obtains all remain on predetermined harmomegathus scope (+/-2mil) in.
Table one experiment condition
In embodiment of the present utility model, by heating destressing equipment, make the temperature of its each warm area be positioned at 129.5 ℃ ~ 351 ℃, and the temperature that makes the warm area that is positioned at destressing equipment zone line is higher than the temperature near the warm area of the outlet of destressing equipment and porch, with substrate with the speed of 0.2 ~ 3.0 m/min by destressing equipment, with the thermal stress of elimination substrate, and guarantee that the distortion size (being the harmomegathus size) of substrate remains in predetermined harmomegathus scope.Also offer by change the temperature that the power of the infrared light supply of destressing equipment is heated to each warm area to be scheduled to, thereby make the utility model can the stress of substrate is released, avoided substrate bending and fracture phenomena in ambient stress, and can also guarantee that the harmomegathus size of substrate maintains in the scope of management and control.
in the utility model, the warm area that is positioned at the zone line of destressing equipment refers to be positioned at the middle part of destressing equipment, and its temperature is higher than the part warm area of its both sides, the temperature of the warm area of zone line has the temperature increasing degree of certain limit with respect to the temperature of the warm area of its both sides, in specific embodiment, the warm area of zone line can comprise a warm area or a plurality of warm area, refer to be positioned at the close entrance of destressing equipment or a side of outlet near the entrance of destressing equipment or the warm area in exit, and its temperature is lower than the part warm area of zone line, in specific embodiment, also can comprise a warm area or a plurality of warm area near the entrance of destressing equipment or the warm area in exit.
the above, it is only preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, although the utility model discloses as above with preferred embodiment, yet be not to limit the utility model, any those skilled in the art, within not breaking away from the technical solutions of the utility model scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solutions of the utility model content, any simple modification that foundation technical spirit of the present utility model is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (6)
1. the destressing equipment of a circuit board, it is characterized in that, it comprises: conveyer belt and heater, wherein, this destressing equipment is provided with at least three warm areas along its length direction, this heater is used for the temperature of each warm area is heated to 129.5 ℃ ~ 351 ℃, and the temperature that will be positioned at the warm area of this destressing equipment zone line is heated above the temperature near the warm area of the outlet of this destressing equipment and porch, and this conveyer belt is used for circuit board was transmitted this destressing equipment with the speed of 0.2 ~ 3.0 m/min.
2. the destressing equipment of circuit board according to claim 1, it is characterized in that: this destressing equipment has 3 ~ 25 warm areas.
3. the destressing equipment of circuit board according to claim 2, it is characterized in that: this destressing equipment has 12 warm areas, and the temperature range of these 12 warm areas is followed successively by from the entrance and exit place of this destressing equipment: 178.5 ℃ ~ 331.5 ℃, 175 ℃ ~ 325 ℃, 175 ℃ ~ 325 ℃, 175 ℃ ~ 325 ℃, 175 ℃ ~ 325 ℃, 175 ℃ ~ 325 ℃, 189 ℃ ~ 351 ℃, 175 ℃ ~ 325 ℃, 175 ℃ ~ 325 ℃, 175 ℃ ~ 325 ℃, 161 ℃ ~ 299 ℃, 129.5 ℃ ~ 240.5 ℃.
4. the destressing equipment of circuit board according to claim 1, it is characterized in that: the temperature of warm area that is positioned at the zone line of this destressing equipment is 189 ℃ ~ 351 ℃, the temperature of the warm area of the porch of close this destressing equipment is 178.5 ℃ ~ 331.5 ℃, and the temperature of the warm area in the exit of close this destressing equipment is 129.5 ℃ ~ 240.5 ℃.
5. the destressing equipment of circuit board according to claim 1, it is characterized in that: the temperature of warm area that is positioned at the zone line of this destressing equipment is 270 ℃, the temperature of the warm area of the porch of close this destressing equipment is 255 ℃, and the temperature of the warm area in the exit of close this destressing equipment is 185 ℃.
6. the destressing equipment of circuit board according to claim 1, it is characterized in that: this heater comprises infrared light supply, this heater offers the temperature that the power of the infrared light supply of this destressing equipment is heated to each warm area to be scheduled to by change.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320003237 CN203027606U (en) | 2013-01-05 | 2013-01-05 | Distressing equipment of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320003237 CN203027606U (en) | 2013-01-05 | 2013-01-05 | Distressing equipment of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203027606U true CN203027606U (en) | 2013-06-26 |
Family
ID=48651543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320003237 Expired - Fee Related CN203027606U (en) | 2013-01-05 | 2013-01-05 | Distressing equipment of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203027606U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096629A (en) * | 2013-01-05 | 2013-05-08 | 上海卓凯电子科技有限公司 | Circuit board distressing method and circuit board destressing equipment |
| WO2014106333A1 (en) * | 2013-01-05 | 2014-07-10 | 上海卓凯电子科技有限公司 | Method for destressing circuit board and device for destressing circuit board |
-
2013
- 2013-01-05 CN CN 201320003237 patent/CN203027606U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096629A (en) * | 2013-01-05 | 2013-05-08 | 上海卓凯电子科技有限公司 | Circuit board distressing method and circuit board destressing equipment |
| WO2014106333A1 (en) * | 2013-01-05 | 2014-07-10 | 上海卓凯电子科技有限公司 | Method for destressing circuit board and device for destressing circuit board |
| CN103096629B (en) * | 2013-01-05 | 2015-07-15 | 上海卓凯电子科技有限公司 | Circuit board distressing method and circuit board destressing equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130626 Termination date: 20180105 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |