CN203025387U

CN203025387U - Fiber array positioning assembly

Info

Publication number: CN203025387U
Application number: CN 201320034287
Authority: CN
Inventors: 徐艇
Original assignee: WUXI CHUANGRUN SENSING TECHNOLOGY Co Ltd
Current assignee: Jiangsu Rayme Biotechnology Co ltd
Priority date: 2013-01-23
Filing date: 2013-01-23
Publication date: 2013-06-26
Anticipated expiration: 2023-01-23

Abstract

The utility model discloses a fiber array positioning assembly. The fiber array positioning assembly comprises a substrate, wherein the substrate comprises a front-end region and a rear-end region; the front-end region is a bare fiber positioning and fixing region, a plurality of U-shaped troughs are uniformly formed in the bare fiber positioning and fixing region, the adjacent U-shaped troughs are separated by ridges with uniform and equal widths, the widths of the ridges are 10-18 microns, the joints of the side walls of the U-shaped troughs and the upper surface of the substrate are edges of the ridges, and the side walls of the U-shaped troughs are vertical to the upper surface of the substrate; and the rear-end region is an integrally and downward sunken flat step for fixing fibers with plastic claddings, the sunken depth from the flat step to the upper surface of the substrate is 200-300 microns, and the flat step and the front-end region are tightly connected without any partition. According to the fiber array positioning assembly, as only a polycrystalline silicon film is taken as a single mask layer, the whole technological process steps are greatly reduced, the production cycle is shortened, and all processes are compatible with an integrated circuit process; and the mass production can be carried out, the production cost is low, and the production cycle is short.

Description

Optical fibre array positioning assembly

Technical field

The utility model relates to a kind of optical fibre array positioning assembly, belongs to the passive device technical field in optical fiber communication.

Background technology

For accelerating the construction of China's information society, three large operators and Broadcast and TV system have all strengthened the Optical Access Network to FTTX() and the input of the integration of three networks (voice network, data network, cable television network) construction.But due to factors such as cost of access, core technologies, progress is also slower so far, not yet obtains large-scale promotion and development.Operators do one's utmost to reduce costs, and the fiber array shunt is the core devices in FTTX, account for most of overall cost.Assembly cost and the precision used as the fixed fiber of one of Primary Component inside fiber array also seem extremely important in extension process.

A kind of production method of the assembly that present main product fixed fiber is used is the machine cuts method, and the assembly that the fixed fiber of producing is used claims the V groove usually, and material is quartz or glass.This series products is very high to the requirement of cutting equipment, only has at present the import lathe just can meet the demands, and early stage, equipment investment was larger.Because the V groove is to be formed by the diamant cutting, because intrinsic accumulation machine error, port number is more, and error is larger, and precision is lower, thereby causes higher cost.

The production method of the assembly that another fixed fiber is used is to adopt the optical semiconductor lithography, and the assembly that the fixed fiber of producing is used claims U-lag usually.Process by micro-processing method the U-shaped groove that quartz or glass wafer form, this series products adopts photoetching technique to determine its initial graphics, and all passages are while machine-shaping, the cumulative errors when not having machine cuts, when processing major path assembly, can guarantee bearing accuracy.Use the U-lag of the method processing, be divided into dry method and wet method and carve two kinds of (corruption) erosions.

Dry etching adopts more expensive reactive ion dry etching, and the method can guarantee high precision and homogeneity, but the monolithic long processing time, and expense is high.

Wet etching adopts precious metal (as gold/chromium thin film structure) as process materials, but this technique and ripe integrated circuit production line can not compatible (gold can stain the CMOS production line), can only carry out manual process processing, and the sheet number of every lots processed is limited, precious metal material is more expensive, thereby cost is still very high, and production efficiency is lower, is unfavorable for large-scale production.In addition, with the U-lag that the method is produced, because the angle of groove sidewall and upper surface of base plate means that less than 90 degree (being determined by its special membrane structure characteristic) gradient of groove sidewall is smaller, smoother; This can cause when row is fine, and naked fibre easily rolls, and even adjacent optical fiber mutual dislocation has increased the fine difficulty of row, has reduced production efficiency.Add the restriction of its mask characteristic, the U-lag degree of depth is limited at present, and the distance of optical fiber bottom bottom U-lag is less; When glue, UV glue is easy to occur the problems such as bubble or poor fluidity, affects reliability and production efficiency.

Summary of the invention

Technical problem to be solved in the utility model is to provide a kind of low cost, high precision, good uniformity, production efficiency is high and compatible mutually with existing semiconductor production line, can be mass-produced, and more is suitable for practical optical fibre array positioning assembly.

The technical solution of the utility model is:

A kind of optical fibre array positioning assembly, comprise substrate, substrate comprises former and later two zones, front end area is that bare fibre is located fixed area, contain equally distributed U-lag, the back interval that is evenly equated by width between two adjacent U-lags, the width of back is between 10-18um, the sidewall of U-lag and the junction of upper surface of base plate are the rib of back, and the sidewall of U-lag is vertical with upper surface of base plate;

Back-end region is whole platform rank toward lower recess, is used for fixing the band plastic-clad optical fiber, and described platform rank are 200-350um apart from the cup depth of upper surface of base plate, and platform rank closely are connected with the front end U-lag is regional, between without any partition.

The quantity of U-lag is 8 integral multiple.

Baseplate material is quartz or glass.

The A/F of U-lag is less than the diameter of bare fibre, and the degree of depth of U-lag is placed in the height of partial arc in groove greater than optical fiber.

Beneficial effect: the utility model uses semiconductor processing technology to prepare, and in process, (principal ingredient is SiO to glass or quartz for ammonium fluoride and hydrofluorite mixed solution ₂) be identical in the corrosion speed of all directions.Polysilicon membrane is fabulous with the adhesiveness on quartzy (glass) surface in addition, in the U-lag corrosion process, excessive corrosion laterally seldom occurring.Therefore, between the sidewall of U-lag and upper surface of base plate, mitre joint is bordering on 90 degree.In the process of row's optical fiber, the naked fibre that such angle can effectively be avoided occurring in present U-lag easily rolls, the situation of even adjacent optical fiber mutual dislocation.But the rib of back is more straight, and is sharper, is the too sharp damage optical fiber surface of rib of avoiding back, after U-lag etches, more overtime corrosion a period of time, with the rib of passivation back, increase the contact area of itself and fiber sidewall, reduce that optical fiber scratches and assembling process in the damage that occurs.Simultaneously because the adhesiveness on polysilicon membrane and quartzy (glass) surface is better than gold/chromium thin film, and laterally excessive corrosion is less, (U-lag is excessively dark deeply for the U-lag that the U-lag degree of depth in the utility model prepares than gold/chromium thin film, gold/chromium thin film will come off from back), so just increased the distance of optical fiber bottom bottom U-lag; When glue, UV glue just the problem of bubble can not occur; Roughness after ammonium fluoride and hydrofluorite mixed solution corrosion quartz or glass is smaller simultaneously, the surperficial smoother of U-lag, and mobility is very significantly improved.Each miniature U-lag corrodes moulding simultaneously, and bearing accuracy can reach 0.1-0.3um, the cumulative errors of having avoided the V groove of machining to occur.Compare with the U-lag of multi-layer mask layer (gold/chromium thin film) preparation, the utility model only adopts polysilicon membrane as single mask layer (once can deposit simultaneously the 200-300 wafer), greatly reduced whole process flow steps, shortened the production cycle, and each road technique all with ic process compatibility, thereby can produce in enormous quantities in existing semiconductor foundry factory, its production cost was compared with other method with the production cycle, had very large advantage.

Description of drawings

Fig. 1 is U-lag substrate in the utility model;

Fig. 2 is the end face Local map of the utility model U-lag;

Fig. 3 is the end view after the utility model U-lag substrate and optical fiber and cover plate are assembled into fiber array;

Fig. 4-Fig. 9 is the cross-sectional end view of the utility model in each road technological process;

Fig. 4 is wafer top and bottom deposition mask layer figure;

Fig. 5 is that above-mentioned mask layer is with the photoresist layer figure after developing;

Fig. 6 is the required opening figure of corrosion U-lag that the mask layer upper surface forms;

The U-lag figure of Fig. 7 for obtaining after corroding;

Fig. 8 is the U-lag figure that removes after mask layer;

Fig. 9 is after having ground step, whole U-lag outboard profile.

Opening in figure on 1-substrate, 2-front end area, 3-back-end region, 4-cover plate, 5-optical fiber, 6-glue, 7-U-lag, 8-back, 9-mask layer, 10-photoresist layer, 11-photoresist layer, the opening on 12-mask layer.

Embodiment

The utility model is described in further detail below in conjunction with accompanying drawing.

A kind of optical fibre array positioning assembly, comprise substrate 1, substrate 1 comprises former and later two zones, front end area 2 is located fixed area for bare fibre, contain equally distributed U-lag 7, back 8 intervals that evenly equated by width between two adjacent U-lags 7, the width of back 8 is between 10-18um, the sidewall of U-lag 7 and the junction of upper surface of base plate are the rib of back, and the sidewall of U-lag 7 is vertical with upper surface of base plate;

Back-end region 3 is whole platform rank toward lower recess, is used for fixing the band plastic-clad optical fiber, and platform rank are 200-350um apart from the cup depth of upper surface of base plate, and platform rank closely are connected with the front end U-lag is regional, between without any partition.

The quantity of U-lag 7 is 8 integral multiple, or customization quantity.

Substrate 1 material is quartz or glass.

The A/F of U-lag 7 is less than the diameter of bare fibre, and the degree of depth of U-lag 7 is placed in the height of partial arc in groove greater than optical fiber.

A kind of method for making of optical fibre array positioning assembly: carry out as follows:

A. choose purity more than 99.999%, impurity content is low, inside wafer without the quartz of micro-bubble or glass wafer as baseplate material;

B. the method by vapour deposition is at the upper and lower surface of aforesaid substrate deposition mask layer simultaneously; Mask layer is polysilicon membrane, and thickness is at 1000-1200nm;

C. spin coating photoresist layer on above-mentioned mask layer, and according to the figure of the design of photolithography plate, photoresist layer is carried out exposure imaging technique, the figure on reticle is transferred on photoresist layer;

D. under the protection of photoresist, above-mentioned mask layer is carried out wet etching, form the required opening of corrosion U-lag at the wafer upper surface; Corrosive liquid band alkalescence used, as KOH, the TMAH(Tetramethylammonium hydroxide);

E. under the common protection of above-mentioned photoresist layer and mask layer, adopt wet corrosion technique, corrosive liquid carries out selective corrosion by opening to wafer, thereby obtains needed U-lag; Corrosive liquid ammonium fluoride used and hydrofluorite mixed solution;

F. further corrosion, the rib of passivation back;

G. remove mask layer;

H. grind out the platform rank of back-end region.

In view of existing U-lag technical costs is high, the large-scale production difficulty is large, arranges the problems such as fine difficulty and efficient are low, and the utility model U-lag bearing accuracy is high, and production technology is simple, and is compatible mutually with existing semiconductor production line, can be mass-produced, and the decrease cost is low.

As shown in Figure 1, the utility model comprises front end area 2 and back-end region 3 two zones, and front end area 2 zones are the location fixed area of bare fibre (removing the optical fiber of plastics covering), as shown in Figure 2, front end area 2 zones contain n (n=8,16,32,48,64,128 etc., or customization quantity) equally distributed U-lag 7, between two adjacent U-lags by the uniform back of width 8 intervals.Back-end region 3 zone is fixed area with plastic-clad optical fiber for end regions, and front end area 2 closely connects, between without any partition.This whole past lower recess in platform rank guarantees not fractureed at assembling optical fiber array process optical fiber.Because mask 9 is fabulous with the adhesiveness on quartzy (glass) surface, in the U-lag corrosion process, excessive corrosion laterally seldom occurs, so between the sidewall of U-lag 7 and substrate 1 upper surface, mitre joint is bordering on 90 degree.Under such angle, the sidewall of back 8 is more steep, and in the process of the side of optical fiber 5 and row's optical fiber, naked fibre is not easy to roll, and also is not prone to the situation of optical fiber mutual dislocation.The rib of the back 8 after transpassivation is rounder and more smooth, can not damage optical fiber 5 surfaces.In Fig. 3, optical fiber 5 is fixed by two ribs of cover plate 4 and back 8, and by this 3 fixations, optical fiber 5 is accurately positioned.The UV glue 6 that be used for to solidify use covers the outside surface of whole optical fiber, and fills up U-lag 7 and be positioned at bottom section (degree of depth is H) below optical fiber 5.

Groove depth in the utility model is greater than present U-lag; That is to say, increased depth H, when glue, UV glue has so just improved the reliability of finished product with regard to bubble not occurring because of capillarity by the situation of fluid-tight in glue 6 the insides.The surfaceness of U-lag 7 diminishes simultaneously, and glue 6 flowing property inside also is greatly improved, and has improved the packaging efficiency of optical fiber 5.

The utility model can prepare by step shown in Fig. 4-9, specifically describes as follows:

A. basic material is quartz or glass substrate 1, and purity is more than 99.999%, and impurity content is low, and substrate 1 inside is without micro-bubble, and the surface is without minute scratch marks;

B. as shown in Figure 4, by the method for vapour deposition, at the upper and lower surface while of aforesaid substrate 1 deposition mask layer 9; This mask layer 9 is polysilicon membrane, and thickness is at 1000-1200nm, because the mixed solution of 9 pairs of hydrofluorite of mask layer and ammonium fluoride has good corrosion resistivity, and has fabulous compactness, can avoid acid accumulator penetration mask 9 to erode to substrate 1, and produces defective;

C. as shown in Figure 5, spin coating photoresist layer 10 on above-mentioned mask layer 9, and according to the figure of the design of photolithography plate, photoresist layer 10 is carried out exposure imaging technique, figure on reticle is transferred on photoresist layer, in this road technique, the opening 11 on the required photoresist layer of corrosion U-lag 7 is in photoresist layer 10 moulding;

D. as shown in Figure 6, under the protection of photoresist layer 10, above-mentioned mask layer 9 is carried out wet etching, form the required opening 12 of corrosion U-lag at substrate 1 upper surface, when etching mask layer 9, control the time well, avoid excessive corrosion;

E. as shown in Figure 7, under the common protection of photoresist layer 10 and mask layer 9, adopt wet corrosion technique, corrosive liquid carries out selective corrosion by 12 pairs of substrates of the opening on mask layer 1, thereby obtains needed U-lag 7;

F. be the sharp keen degree that reduces the rib of back 8, after the degree of depth of U-lag 7 reaches design load, more further corrosion (5-9 minute), the rib of back 8 will obtain little passivation like this, becomes rounder and more smooth; The corrosive liquid that uses in U-lag 7 corrosion processes is the mixed solution of hydrofluorite and ammonium fluoride, and (principal ingredient is SiO to this mixed solution to glass or quartz ₂) have identical corrosion rate in all directions, and the roughness after corrosion is smaller, can improve glue 6 in the mobility of U-lag 7 the insides;

G. as shown in Figure 8, remove mask layer 9 and photoresist layer 10;

H. as shown in Figure 9, mechanical grinding grinds the platform rank of back-end region 3.

Claims

1. optical fibre array positioning assembly, comprise substrate (1), it is characterized in that: described substrate (1) comprises former and later two zones, front end area (2) is located fixed area for bare fibre, contain equally distributed U-lag (7), back (8) interval that is evenly equated by width between adjacent two U-lags (7), the width of back (8) is between 10-18um, the sidewall of U-lag (7) and the junction of upper surface of base plate are the rib of back, and the sidewall of U-lag (7) is vertical with upper surface of base plate;

Back-end region (3) is whole platform rank toward lower recess, is used for fixing the band plastic-clad optical fiber, and described platform rank are 200-350um apart from the cup depth of upper surface of base plate, and platform rank closely are connected with the front end U-lag is regional, between without any partition.

2. optical fibre array positioning assembly according to claim 1, it is characterized in that: the quantity of described U-lag (7) is 8 integral multiple.

3. optical fibre array positioning assembly according to claim 1, it is characterized in that: described substrate (1) material is quartz or glass.

4. optical fibre array positioning assembly according to claim 1, it is characterized in that: the A/F of described U-lag (7) is less than the diameter of bare fibre, and the degree of depth of U-lag (7) is placed in the height of partial arc in groove greater than optical fiber.