CN203021673U - Device for monitoring and controlling temperature range of copper electroplating cavity - Google Patents
Device for monitoring and controlling temperature range of copper electroplating cavity Download PDFInfo
- Publication number
- CN203021673U CN203021673U CN 201220641425 CN201220641425U CN203021673U CN 203021673 U CN203021673 U CN 203021673U CN 201220641425 CN201220641425 CN 201220641425 CN 201220641425 U CN201220641425 U CN 201220641425U CN 203021673 U CN203021673 U CN 203021673U
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- temperature
- cavity
- copper
- monitoring
- electroplating
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Abstract
The utility model discloses a device for monitoring and controlling the temperature range of a copper electroplating cavity, which is applied to a copper electroplating cavity system. The copper electroplating cavity system comprises an electroplating cavity, a public electroplating pool and a pump. The device comprises a temperature monitor and a temperature regulator, wherein the temperature monitor is connected or arranged in the electroplating cavity and used for monitoring the temperature in the electroplating cavity; and the temperature regulator is connected to the temperature monitor and the pump and used for regulating the flow of the pump according to temperature signals obtained through the monitoring of the temperature monitor. According to the device, the flow of the pump is regulated through the temperature regulator and the electroplating temperature in the cavity is controlled in real time, so that the copper defect generated in the electroplating production of the product is reduced.
Description
Technical field
The utility model relates to the temperature-control device that a kind of copper is electroplated cavity, particularly relates to a kind of device that copper is electroplated the cavity temperature scope of monitoring and control.
Background technology
Fig. 1 is the schematic diagram that present copper is electroplated cavity.Due in the electroplating process that continues, particularly need in the process of a large amount of electro-copperings, the temperature of cavity can sharply raise, although there is temperature-control device in the public pond that the board cavity shares, but because volume is large more than the volume of electroplating cavity, therefore the control ratio of temperature is slower.In arriving plating cavity process, easily cause the generation of product defects.And electroplate cavity and the flow electroplated between public pond is changeless, because flow is fixed, can cause in efficiency ratio in the heat exchange of public pond lower.
In sum, exist as can be known copper to electroplate the cavity problem that temperature sharply raises and causes product defects to produce in continuing electroplating process in prior art, therefore be necessary to propose improved technique means in fact, solve this problem.
The utility model content
The deficiency that exists for overcoming above-mentioned prior art, one of the utility model purpose is to provide a kind of device that copper is electroplated the cavity temperature scope of monitoring and control, it is by installing device for monitoring temperature in electroplating cavity, when guaranteeing the processing procedure minimum flow rate, can adjust by thermoswitch the flow of pump, control in real time the electroplating temperature in cavity, thereby reduce the copper defective that product produces in Electroplating Production, reduce or eliminate the copper that causes greatly due to temperature fluctuation and fill the cavity that forms, improve product quality.
For reaching above-mentioned and other purpose, the utility model provides a kind of device that copper is electroplated the cavity temperature scope of monitoring and control, and is applied to copper and electroplates the cavity system, and this copper is electroplated the cavity system and comprised and electroplate the chamber, electroplate public pond and pump, and wherein, this device comprises:
Temperature monitor connects or is arranged in this plating chamber, to monitor the temperature in this plating cavity; And
Thermoswitch is connected in this temperature monitor and this pump, regulates the flow of this pump with the temperature signal that obtains according to this temperature monitor monitoring.
Further, if when the temperature signal that this thermoswitch obtains is the temperature rising, this thermoswitch sends a flow and controls signal to this pump to control the flow increase of this pump.
Further, if the temperature signal that this thermoswitch obtains is temperature when reducing, this thermoswitch sends a flow and controls signal to this pump and reduce with the flow of controlling this pump.
Further, the electroplating solution in this plating chamber has a passage and flows into this plating public pond, and the electroplating solution in this plating public pond flows into this plating chamber by this pump.
Further, the temperature in the public pond of this plating is guaranteed in the public pond of this plating by refrigerator.
compared with prior art, a kind of device of monitoring and controlling copper plating cavity temperature scope of the utility model is installed temperature monitor and thermoswitch by electroplating at copper in cavity, when guaranteeing the processing procedure minimum flow rate, adjust in real time the flow of pump according to the temperature of temperature monitor monitoring by thermoswitch, increase heat exchanger effectiveness, with the electroplating temperature in real-time control cavity, the temperature that guarantees copper plating cavity keeps relative low temperature and falls after rise fast, thereby reduce the copper defective that product produces in Electroplating Production, reduce or eliminate the copper that causes greatly due to temperature fluctuation and fill the cavity that forms, improve product quality.
Description of drawings
Fig. 1 is the schematic diagram that present copper is electroplated cavity;
Fig. 2 is that a kind of device of monitoring and controlling copper plating cavity temperature scope of utility model should be used for copper plating cavity system of systems structural representation.
Embodiment
Below by specific specific examples and accompanying drawings embodiment of the present utility model, those skilled in the art can understand other advantage of the present utility model and effect easily by content disclosed in the present specification.The utility model also can be implemented or be used by other different specific examples, and the every details in this specification sheets also can be based on different viewpoints and application, carries out various modifications and change under spirit of the present utility model not deviating from.
Fig. 2 is that a kind of device of monitoring and controlling copper plating cavity temperature scope of the utility model should be used for copper plating cavity system of systems structural representation.as shown in Figure 2, a kind of device of monitoring and controlling copper plating cavity temperature scope of the utility model, being arranged at copper electroplates in cavity, be used for monitoring and controlling copper and electroplate the cavity temperature scope, copper plating cavity system comprises electroplates chamber 201, electroplate public pond 202 and pump 203, electroplating solution in plating chamber 201 has a passage inflow and electroplates public pond, the electroplating solution of electroplating in public pond 202 is electroplated the chamber by pump 203 inflows, a kind of device of monitoring and controlling copper plating cavity temperature scope of the utility model, it comprises at least: temperature monitor 204 and thermoswitch 205.
It should be noted that at this, in copper was electroplated cavity, a kind of device of monitoring and controlling copper plating cavity temperature scope of the utility model can arrange a cover, and many covers also can be set, and can arrange as required, and the utility model is not as limit.
as seen, a kind of device of monitoring and controlling copper plating cavity temperature scope of the utility model is installed temperature monitor and thermoswitch by electroplating at copper in cavity, when guaranteeing the processing procedure minimum flow rate, adjust in real time the flow of pump according to the temperature of temperature monitor monitoring by thermoswitch, increase heat exchanger effectiveness, with the electroplating temperature in real-time control cavity, the temperature that guarantees copper plating cavity keeps relative low temperature and falls after rise fast, thereby reduce the copper defective that product produces in Electroplating Production, reduce or eliminate the copper that causes greatly due to temperature fluctuation and fill the cavity that forms, improve product quality.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not is used for restriction the utility model.Any those skilled in the art all can under spirit of the present utility model and category, modify and change above-described embodiment.Therefore, rights protection scope of the present utility model should be as listed in claims.
Claims (3)
1. monitor and control the device that copper is electroplated the cavity temperature scope for one kind, be applied to copper and electroplate the cavity system, this copper is electroplated the cavity system and is comprised and electroplate the chamber, electroplate public pond and pump, and it is characterized in that, this device comprises:
Temperature monitor connects or is arranged in this plating chamber, to monitor the temperature in this plating cavity; And
Thermoswitch is connected in this temperature monitor and this pump, regulates the flow of this pump with the temperature signal that obtains according to this temperature monitor monitoring.
2. a kind of device that copper is electroplated the cavity temperature scope of monitoring and control as claimed in claim 1, it is characterized in that: the electroplating solution in this plating chamber has a passage and flows into this plating public pond, and the electroplating solution in this plating public pond flows into this plating chamber by this pump.
3. a kind of device that copper is electroplated the cavity temperature scope of monitoring and control as claimed in claim 1 is characterized in that: the temperature in the public pond of this plating is guaranteed in this plating public pond by refrigerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220641425 CN203021673U (en) | 2012-11-28 | 2012-11-28 | Device for monitoring and controlling temperature range of copper electroplating cavity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220641425 CN203021673U (en) | 2012-11-28 | 2012-11-28 | Device for monitoring and controlling temperature range of copper electroplating cavity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203021673U true CN203021673U (en) | 2013-06-26 |
Family
ID=48645668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220641425 Expired - Lifetime CN203021673U (en) | 2012-11-28 | 2012-11-28 | Device for monitoring and controlling temperature range of copper electroplating cavity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203021673U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103645757A (en) * | 2013-12-04 | 2014-03-19 | 湖北工业大学 | Non-contact temperature control method and device for automatic electroplating production line |
-
2012
- 2012-11-28 CN CN 201220641425 patent/CN203021673U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103645757A (en) * | 2013-12-04 | 2014-03-19 | 湖北工业大学 | Non-contact temperature control method and device for automatic electroplating production line |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130626 |