CN203019754U - Diamond compact easy to weld - Google Patents

Diamond compact easy to weld Download PDF

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Publication number
CN203019754U
CN203019754U CN 201220657418 CN201220657418U CN203019754U CN 203019754 U CN203019754 U CN 203019754U CN 201220657418 CN201220657418 CN 201220657418 CN 201220657418 U CN201220657418 U CN 201220657418U CN 203019754 U CN203019754 U CN 203019754U
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CN
China
Prior art keywords
hard alloy
diamond
layer
alloy substrate
compact
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Expired - Lifetime
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CN 201220657418
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Chinese (zh)
Inventor
彭清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Juxin New Material Technology Co ltd
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ZHUHAI JUXIN TECHNOLOGY DEVELOPMENT Co Ltd
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Priority to CN 201220657418 priority Critical patent/CN203019754U/en
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Publication of CN203019754U publication Critical patent/CN203019754U/en
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Abstract

The utility model discloses a diamond compact easy to weld. The diamond compact easy to weld comprises a polycrystalline diamond layer and a hard alloy substrate layer. The diamond compact is characterized in that a coarse surface layer is formed on the outer surface of the hard alloy substrate layer; and the polycrystalline diamond layer is closely fused with the hard alloy substrate layer through high-pressure high-temperature sintering. The structure of the easily welded diamond compact is simple and reasonable, and the coarse surface layer is formed on the outer surface of the hard alloy substrate layer to reinforce the adhesive force between the diamond hard alloy compact and a welding material, the diamond hard alloy compact is more firmly connected with a drill bit, the mechanical performance of the surface of the hard alloy substrate is improved, and the fatigue resistance of the diamond hard alloy compact is improved, and therefore the service life of the easily welded diamond compact is prolonged.

Description

A kind of diamond compact that is easy to weld
Technical field
The utility model relates to diamond hard alloy complex sheet, is specifically related to a kind of diamond compact that is easy to weld.Belong to the hard material technical field.
Background technology
Diamond hard alloy complex sheet is to be formed by diamond layer and carbide by sintering process under the high pressure high temperature condition, it has the excellent properties of diamond and carbide alloy concurrently, has been widely used in the cutting position of the probing exploitation instruments such as oil, natural gas, geology, engineering, colliery, mine.
At present, being connected all adopt between diamond hard alloy complex sheet and bit body (steel matrix) is weldingly connected, namely directly scolder or solder flux are placed between cement carbide substrate and carbon steel solder side, then adopt flame or high-frequency induction heating solder fusing to weld, because the diamond hard alloy complex sheet substrate mostly is WC content up to 90% carbide alloy, and the performance difference between carbon steel or steel alloy is very large, easily causes the phenomenon of the diamond hard alloy complex sheet generation flake on drill bit.And diamond hard alloy complex sheet adopts hard alloy substrate and carbon steel solder side through polishing, because there is micro-crack in the carbide matrix external surface through polishing, make the fatigue resistance of matrix poor, easily ftracture in drilling process, be unfavorable for the welding of diamond hard alloy complex sheet and drill bit, can not guarantee to weld fastness, and easily come off in drilling process.
Summary of the invention
The purpose of this utility model provides a kind of easy welding in order to overcome the deficiencies in the prior art, connects the more diamond hard alloy complex sheet of fastness.
The utility model is for solving the problems of the technologies described above, and the technical scheme of employing is as follows:
A kind of diamond compact that is easy to weld comprises polycrystalline diamond layer and hard alloy substrate layer, it is characterized in that: on the outer surface formation alligatoring top layer of hard alloy substrate layer; Polycrystalline diamond layer by high pressure-temperature sintering and the tight molten adhere of hard alloy substrate layer together.
The mechanical performance of the cemented carbide substrate surfaces that described rough layer makes improves, and has therefore improved the fatigue resistance of hard alloy substrate layer, has increased the adhesive force between hard alloy substrate layer and welding material.
Further scheme of the present utility model: described alligatoring top layer is to adopt 24# black silicon carbide particle carry out blasting treatment and form under greater than 0.4MPa pressure.
Further scheme of the present utility model: respectively form an alligatoring top layer in the circumferential surface of described hard alloy substrate layer and bottom surface.
Further scheme of the present utility model: the surface roughness on described alligatoring top layer is 2.5 μ m~3.5 μ m.
Further scheme of the present utility model: the surface roughness on described alligatoring top layer is 3.2 μ m.
The beneficial effects of the utility model:
Of the present utility model simple and reasonable for structure, the alligatoring top layer that the outer surface of the utility model hard alloy substrate layer forms, make the Adhesion enhancement between diamond hard alloy complex sheet and welding material, diamond hard alloy complex sheet is more firm with being connected of drill bit, and improved the mechanical performance of cemented carbide substrate surfaces, improve the anti-fatigue performance of diamond hard alloy complex sheet, thereby extended service life.
Description of drawings
Fig. 1 is the structural representation of specific embodiment 1.
The specific embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
Specific embodiment 1:
A kind of diamond compact that is easy to weld shown in Figure 1, comprise polycrystalline diamond layer 1 and hard alloy substrate layer 2, form alligatoring top layer 23 at the outer surface of hard alloy substrate layer 2, respectively form an alligatoring top layer 23 in the circumferential surface 21 of described hard alloy substrate layer 2 and bottom surface 22; Polycrystalline diamond layer 1 by high pressure-temperature sintering and the tight molten adhere of hard alloy substrate layer 2 together.
Described alligatoring top layer 23 is to adopt 24# black silicon carbide particle carry out blasting treatment and form under greater than 0.4MPa pressure.
The surface roughness on described alligatoring top layer 23 is 2.5 μ m.
Due to impact and the shear action of diamond dust to hard alloy substrate layer outer surface, make the surface of hard alloy substrate layer obtain certain cleannes and roughness, the mechanical performance of matrix surface is made moderate progress, therefore improve the fatigue resistance of matrix, strengthened the adhesive force between hard alloy substrate layer and welding material.
Specific embodiment 2:
The characteristics of the present embodiment are: the surface roughness on described alligatoring top layer 23 is 3.2 μ m, and other characteristics are identical with specific embodiment 1.
Specific embodiment 3:
The characteristics of the present embodiment are: the surface roughness on described alligatoring top layer 23 is 3.5 μ m, and other characteristics are identical with specific embodiment 1.

Claims (5)

1. a diamond compact that is easy to weld, comprise polycrystalline diamond layer (1) and hard alloy substrate layer (2), it is characterized in that: the outer surface at hard alloy substrate layer (2) forms alligatoring top layer (23); Polycrystalline diamond layer (1) by the tight molten adhere of high pressure-temperature sintering and hard alloy substrate layer (2) together.
2. a kind of diamond compact that is easy to weld according to claim 1 is characterized in that: described alligatoring top layer (23) is to adopt 24# black silicon carbide particle carry out blasting treatment and form under greater than 0.4MPa pressure.
3. a kind of diamond compact that is easy to weld according to claim 1 and 2, it is characterized in that: circumferential surface (21) and bottom surface (22) at described hard alloy substrate layer (2) respectively form an alligatoring top layer (23).
4. a kind of diamond compact that is easy to weld according to claim 1 and 2, it is characterized in that: the surface roughness on described alligatoring top layer (23) is 2.5 μ m~3.5 μ m.
5. a kind of diamond compact that is easy to weld according to claim 1 and 2, it is characterized in that: the surface roughness on described alligatoring top layer (23) is 3.2 μ m.
CN 201220657418 2012-11-29 2012-11-29 Diamond compact easy to weld Expired - Lifetime CN203019754U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220657418 CN203019754U (en) 2012-11-29 2012-11-29 Diamond compact easy to weld

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220657418 CN203019754U (en) 2012-11-29 2012-11-29 Diamond compact easy to weld

Publications (1)

Publication Number Publication Date
CN203019754U true CN203019754U (en) 2013-06-26

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CN 201220657418 Expired - Lifetime CN203019754U (en) 2012-11-29 2012-11-29 Diamond compact easy to weld

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CN (1) CN203019754U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104563889A (en) * 2013-11-25 2015-04-29 莱州市原野科技有限公司 Pre-graphitized polycrystalline diamond compact
CN105382941A (en) * 2014-08-21 2016-03-09 周振嘉 Tool unit applied to ultrasonic machining

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104563889A (en) * 2013-11-25 2015-04-29 莱州市原野科技有限公司 Pre-graphitized polycrystalline diamond compact
CN105382941A (en) * 2014-08-21 2016-03-09 周振嘉 Tool unit applied to ultrasonic machining

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 519110 Doumen Town, Doumen District, Zhuhai, Guangdong Province, Longshan two East 1

Patentee after: GUANGDONG JUXIN NEW MATERIAL TECHNOLOGY CO.,LTD.

Address before: 519110 Doumen Town, Doumen District, Zhuhai, Guangdong Province, Longshan two East 1

Patentee before: ZHUHAI JUXIN TECHNOLOGY DEVELOPMENT Co.,Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20130626