CN203013534U - Solid electrolytic capacitor - Google Patents

Solid electrolytic capacitor Download PDF

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Publication number
CN203013534U
CN203013534U CN201220538506.4U CN201220538506U CN203013534U CN 203013534 U CN203013534 U CN 203013534U CN 201220538506 U CN201220538506 U CN 201220538506U CN 203013534 U CN203013534 U CN 203013534U
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CN
China
Prior art keywords
cathode end
electrolytic capacitor
solid electrolytic
out terminal
anode
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Expired - Fee Related
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CN201220538506.4U
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Chinese (zh)
Inventor
土屋昌义
石塚英俊
汤成戎
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Nichicon Corp
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Fpcap Electronics Suzhou Co Ltd
Nichicon Corp
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Abstract

The purpose of the utility model is to provide a solid electrolytic capacitor capable of eliminating manufacturing process complexity and increasing electrostatic capacitance. The utility model is a solid electrolytic capacitor which comprises a rectangular component which enables a winding component formed by winding an anode foil, a cathode foil and a membrane between the anode foil and the cathode foil to be a flat rectangular shape to form a solid electrolyte, an anode lead terminal which is connected to the anode foil, a cathode lead terminal which is connected to the cathode foil, and a packaging body which packages the rectangular component. The anode lead terminal and the cathode lead terminal are configured at one side relative to a winding core of the rectangular component, and the cathode lead terminal is configured at an outermost shell of the rectangular component.

Description

Solid electrolytic capacitor
Technical field
The utility model relates to a kind of solid electrolytic capacitor.
Background technology
In recent years, along with electronic equipment high performance, miniaturization, matrix formula (Molded Chip) part of taking the part packing density into account becomes main flow.Aluminium electrolytic capacitor is no exception, and the aluminium electrolytic capacitor that (Surfaced Mounting Technology, SMT) installed on the surface also extensively is employed.
Surface mounting technology is Electronic Assemblies technology of new generation, and traditional electronic component is compressed into 1/tens of front volume, realizes high density, high reliability, miniaturization, the low cost that electronic component is installed and the automation of producing.Yet with regard to aluminium electrolytic capacitor, common surperficial mounted article is longitudinal type (being commonly referred to as the V chip), but requires to have the limit in the electronic equipment of narrow boards.
As the technology that can overcome this shortcoming, proposed to use in the solid electrolyte layer the convoluted matrix of polyaniline.Yet, there is following problem, that is, for columniform winding element moulding, restrict and cause the winding element diameter to produce, and after packing, still occupy relatively large thickness space, be difficult to further satisfy the narrow boards requirement.And, as Second Problem, though have the matrix type solid electrolytic capacitor that the lamination that element forms than unfertile land can be constructed, but when the polypyrrole that forms as solid electrolyte layer, form the chemical polymerization film on ground floor and needing the long period in the method that makes second layer electrolysis polymerization during at electrolysis polymerization, and then this electrolysis polymerization must carry out individual layer to be processed and welds corresponding to the laminated chip number, therefore there is the cost problem in man-hour.
In view of the above problems, following solid electrolytic capacitor has been proposed, this solid electrolytic capacitor comprises: the cuboid element, utilize anode foils, Cathode Foil and the barrier film (Separator) between anode foils and Cathode Foil to reel, and then make it the flat cuboid that turns to, utilize chemical polymerization to form solid electrolyte; Electrode leading-out terminal is connected with element; And package body, pack this cuboid element (for example with reference to patent documentation 1).
Figure 17 is the longitudinal section that schematically shows solid electrolytic capacitor in the past.
Solid electrolytic capacitor 101 comprises: cuboid element 110, and utilize anode foils, Cathode Foil and the barrier film between anode foils and Cathode Foil to reel, and then make it the flat cuboid that turns to, form solid electrolyte; Anode leading-out terminal 121 and cathode end 122 are connected with element 110; And package body 130, pack this cuboid element 110.Anode leading-out terminal 121 is to expose from one of element 110 end face 110a, and is connected with lead frame (lead frame) 140.Cathode end 122 is that the other end 110b from element 110 exposes, and is connected with lead frame 140.
Solid electrolytic capacitor according to patent documentation 1 discloses can further satisfy the narrow boards requirement, and can suppress to increase man-hour.
[background technology document]
[patent documentation]
Patent documentation 1: No. 101527203 specification of People's Republic of China's Patent Application Publication
The utility model content
[problem that utility model will solve]
Yet, the solid electrolytic capacitor that discloses in patent documentation 1 is as shown in figure 17, centered by volume core 110c (some chain lines), the anode leading-out terminal 121 that will be connected with anode foils, and cathode end 122 that is connected with Cathode Foil be configured in both sides (symmetry), so, on the thickness direction of element 110, the position of anode leading-out terminal 121 (highly), differ widely with the position (highly) of cathode end 122.Yet solid electrolytic capacitor 101 is usually to utilize resin cast component 110, when forming package body 130, must make the height of the lead frame 140 that exposes from package body 130 consistent.Therefore, the solid electrolytic capacitor that discloses in patent documentation 1 must by lead frame 140 is implemented bending machining, arrange jump 140a, and at the link position of lead frame 140 with cathode end 122, adjust the height of lead frame 140, so, there is the problem of numerous and diverseization of manufacturing step.
And if jump 140a is set in lead frame 140, this jump part also must be utilized resin-sealedly, therefore, the width of electrode foil (for example anode foils) is shortened.Therefore, existence causes the problem that the electrostatic capacitance of capacitor is restricted.
The utility model is the utility model of completing in view of described problem, and its purpose is to provide a kind of solid electrolytic capacitor of eliminating numerous and diverseization of manufacturing step and electrostatic capacitance being increased.
[technological means of dealing with problems]
The utility model is a kind of solid electrolytic capacitor, described solid electrolytic capacitor comprises: the cuboid element, make by anode foils, Cathode Foil, and the winding element that forms of membrane winding between anode foils and Cathode Foil be flat rectangular-shaped, form solid electrolyte; The anode leading-out terminal is connected with described anode foils; Cathode end is connected with described Cathode Foil; And package body, pack described cuboid element; The volume core of described anode leading-out terminal and both relatively described cuboid elements of described cathode end is configured in one-sided, and described anode leading-out terminal or described cathode end are configured in the outermost shell place of described cuboid element.
In solid electrolytic capacitor as above, comprise in described package body respectively and the lead frame of described anode leading-out terminal and described cathode end sub-connection, described lead frame is by conductive adhesive and described cathode end sub-connection.
In solid electrolytic capacitor as above, described cathode end attached bag contains copper base metal.
In solid electrolytic capacitor as above, described cathode end forms through nickel or silver plating.
In solid electrolytic capacitor as above, the thickness of described anode leading-out terminal outside described cuboid element is greater than the thickness of described cathode end.[effect of utility model]
Method in the past is to roll up centered by core, and anode leading-out terminal and cathode end are configured in both sides, must carry out bending machining to lead frame, and the width of electrode foil is restricted.
Yet, the utility model can be by being configured in the one-sided of volume core with anode leading-out terminal and cathode end, and the jump (difference of height) of anode leading-out terminal and cathode end is reduced, need not the bending machining of lead frame, so can eliminate numerous and diverseization of manufacturing step.
And, due to the crooked jump that can eliminate lead frame, so, can make the width (area) of electrode foil become large.Therefore, the electrostatic capacitance value of capacitor is increased.
And then the utility model is anode leading-out terminal or cathode end to be configured in the outermost shell place of cuboid element, so the terminal that this can be configured in the outermost shell place is connected with lead frame, thus the path of drawing that can shorten lead frame.Its result, according to solid electrolytic capacitor of the present utility model, compare with unidimensional solid electrolytic capacitor in the past (with reference to patent documentation 1), can realize low resistance (ESR (equivalent series resistance for example, Equivalent Series Resistance) and ESL (equivalent series inductance, Equivalent Series Inductance) reduce).
Description of drawings
Fig. 1 is the summary longitudinal section of solid electrolytic capacitor that schematically shows the first execution mode of this case utility model.
Fig. 2 is that the solid electrolyte that schematically shows the solid electrolytic capacitor of the first execution mode forms the general perspective that front decomposition is constructed.
Fig. 3 (a) means the schematic diagram of the cuboid element 10 of the first execution mode, Fig. 3 (b) means the schematic diagram of element 110 in the past, Fig. 3 (c) means the schematic diagram of element 1010 as a comparative example, and Fig. 3 (d) is the summary longitudinal section that schematically shows as comprising the solid electrolytic capacitor 1001 of the comparative example of element 1010 shown in Fig. 3 (c).
Fig. 4 (a) is the cross-sectional view that schematically shows the element before the compression molding of the first execution mode, and Fig. 4 (b) is the cross-sectional view that schematically shows the element after the compression molding of the first execution mode.
Fig. 5 is the figure of manufacturing step that schematically shows the solid electrolytic capacitor of the first execution mode.
Fig. 6 is the figure of manufacturing step that schematically shows the solid electrolytic capacitor of the first execution mode.
Fig. 7 is the figure of manufacturing step that schematically shows the solid electrolytic capacitor of the first execution mode.
Fig. 8 is the figure of manufacturing step that schematically shows the solid electrolytic capacitor of the first execution mode.
Fig. 9 is the figure of manufacturing step that schematically shows the solid electrolytic capacitor of the first execution mode.
Figure 10 (a)~Figure 10 (d) is the figure of manufacturing step that schematically shows the solid electrolytic capacitor of the first execution mode.
Figure 11 is the figure of manufacturing step that schematically shows the solid electrolytic capacitor of the first execution mode.
Figure 12 is the figure of manufacturing step that schematically shows the solid electrolytic capacitor of the first execution mode.
Figure 13 is the summary longitudinal section that schematically shows the solid electrolytic capacitor of the second execution mode.
Figure 14 is the schematic diagram of the element after the compression molding of the second execution mode.
Figure 15 is the schematic diagram of the element after the compression molding of the second execution mode.
Figure 16 is the figure of manufacturing step that schematically shows the solid electrolytic capacitor of the second execution mode.
Figure 17 is the longitudinal section that schematically shows solid electrolytic capacitor in the past.
[explanation of symbol]
1 solid electrolytic capacitor
10 cuboid elements
The 10a end face
The 10b end face
11 anode foils
12 Cathode Foil
13 barrier films (solid electrolyte layer)
14 anti-roll adhesive tapes
21 anode leading-out terminals
22 cathode end
30 package bodies
The 40a lead frame
The 40b lead frame
Embodiment
For described purpose of the present utility model, feature and advantage are more readily understood, below, utilize the accompanying drawing execution mode concrete to the utility model (the first execution mode and the second execution mode) at length to describe.For easy to understand the utility model, disclose detailed content in the following description, but the utility model can utilize also the mode of following enforcement to implement in addition, and be not limited to following execution mode.In addition, accompanying drawing is not to make according to actual size, is only skeleton diagram or schematic diagram, and therefore, the utility model is not limited by accompanying drawing.And, in the accompanying drawings, in order to emphasize characteristic of the present utility model, omit and exist the situation that an expression part consists of.
[the first execution mode]
Fig. 1 is the summary longitudinal section of solid electrolytic capacitor that schematically shows the first execution mode of this case utility model.Fig. 2 is that the solid electrolyte that schematically shows the solid electrolytic capacitor of the first execution mode forms the general perspective that front decomposition is constructed.
As shown in Figure 2, solid electrolytic capacitor 1 comprises: cuboid element 10, make by anode foils 11, Cathode Foil 12 and be configured in anode foils 11 and Cathode Foil 12 between barrier film 13 winding element that forms of reeling be flat rectangular-shaped, form solid electrolyte; Anode leading-out terminal 21 is connected with anode foils 11; Cathode end 22 is connected with Cathode Foil 12; And package body 30, utilize resin die (resin mold) packing cuboid element 10 (with reference to Fig. 1).
In Fig. 2, the end of anti-roll adhesive tape 14 is free, but in fact, the side at cuboid element 10 is pasted in the end of anti-roll adhesive tape 14.And, also there is the method for not using anti-roll adhesive tape and utilizing adhesive to paste.As shown in Figure 2, generally speaking anode foils 11 and Cathode Foil 12 are banded.Between anode foils 11 and Cathode Foil 12, barrier film 13 is being set.As by anode foils 11 and Cathode Foil 12 surface separately and the solid electrolyte of barrier film 13 maintenances, can use electroconductive polymer.As electroconductive polymer, such as enumerating poly--3,4-rthylene dioxythiophene etc.
Anode foils 11 comprises the first valve metal layer (not shown) and is formed on the dielectric medium oxide scale film (not shown) on the first valve metal layer surface.As valve metal herein, can enumerate the metals such as aluminium, tantalum, niobium, titanium.Present embodiment is to use aluminium.Described dielectric medium oxide scale film is the surface that is formed on through changing into processing (anodized) through the first valve metal layer of etch processes.In the present embodiment, the dielectric medium oxide scale film is aluminium oxide.
Cathode Foil 12 comprises second valve metal level (not shown) and is attached to the carbide particle layer (not shown) of second valve layer on surface of metal.As valve metal herein, can enumerate the metals such as aluminium, tantalum, niobium, titanium.Present embodiment is to use aluminium.
In the utility model, Cathode Foil and the nonessential carbide particle layer that comprises, and as Cathode Foil, such as adopting the Cathode Foil that is only consisted of by the second valve metal level, the well-known Cathode Foil such as Cathode Foil that comprise evaporated metal layer or evaporation metal compound layer etc. on the second valve layer on surface of metal.
In addition, as shown in Figure 5, the paper tinsel of Cathode Foil 12 long (length on the length direction of Cathode Foil 12) is longer than the paper tinsel long (length on the length direction of anode foils 11) of anode foils 11, and as described below, and Cathode Foil 12 is wound on the outside of wireline reel with respect to anode foils 11.
As shown in Figure 1, solid electrolytic capacitor 1 comprises anode leading-out terminal 21 and cathode end 22.Anode leading-out terminal 21 is connected to anode foils (with reference to Fig. 2).Cathode end 22 is connected to Cathode Foil (with reference to Fig. 2).
As shown in Figure 1, the volume core 10c of anode leading-out terminal 21 and cathode end 22 both relative cuboid elements 10 is configured in one-sided.
As shown in Figure 1, cathode end 22 is configured in the outermost shell place of cuboid element 10.That is, cathode end 22 exposes in the side of cuboid element 10 (bottom surface of cuboid element 10, the face of below in Fig. 1).In addition, said outermost shell refers to compare this leading-out terminal in the position of outer circumferential side without anode foils and Cathode Foil in described one-sided (with anode leading-out terminal 21 and cathode end 22 phase the same sides) of cuboid element 10 herein.In solid electrolytic capacitor 1, anode leading-out terminal 21, cathode end 22, and following lead frame 40 (40a, 40b) be configured in described one-sided.
Cathode end 22 exposes between end face 10a, the 10b of the length direction (left and right directions in figure) of cuboid element 10 at least.Cathode end 22 exposes in the side of the volume core 10c of relative cuboid element 10 one-sided (configuring a side of anode leading-out terminal 21 and cathode end 22, i.e. downside in figure).And cathode end 22 that this exposes is connected with lead frame 40b.The coupling part of cathode end 22 and lead frame 40b is positioned between end face 10a, the 10b of length direction of cuboid element 10 at least.
As shown in Figure 1, anode leading-out terminal 21 is that an end face 10a from cuboid element 10 exposes.Cathode end 22 is that the other end 10b from cuboid element 10 exposes.End face 10a, 10b be with cuboid element 10 in anode foils 11 and the vertical face of the coiling axis of Cathode Foil 12.In other words, end face 10a, 10b are the faces vertical with the Width of Cathode Foil 12 with anode foils 11.And, with the face of the wireline reel line parallel of anode foils 11 in cuboid element 10 and Cathode Foil 12 be the side of cuboid element 10.
The exposed division 21a (with reference to Fig. 5) of anode leading-out terminal 21 and the exposed division 22a (with reference to Fig. 5) of cathode end 22 comprise non-valve metal.In the utility model, the exposed division 21a of anode leading-out terminal 21 and the exposed division 22a of cathode end 22 also can comprise valve metal.The connecting portion 21b (with reference to Fig. 5) of anode leading-out terminal 21 comprises valve metal.The connecting portion 22b (with reference to Fig. 5) of cathode end 22 comprises copper base metal, and electronickelling or silver are implemented in the surface of copper base metal.By using cathode end 22 of this material, the contact resistance when cathode end 22 is connected with lead frame 40 is reduced.As mentioned above, cathode end preferably comprises copper base metal, but in the utility model, the material of cathode end is not particularly limited.
And, the outer thickness of the cuboid element of anode leading-out terminal 21 10, be anode leading-out terminal 21 from the thickness of the end face exposed portions serve thickness greater than cathode end 22 (being configured in the terminal of the outermost shell of cuboid element 10).Thus, can make take higher precision the height, consistent with the height of the solder side of cathode end 22 and the lead frame 40b surface of downside (in the figure as) of the solder side surface of downside (in the figure as) of anode leading-out terminal 21 and lead frame 40a.
As shown in Figure 1, lead frame 40 (40a and 40b) in the outer setting of cuboid element 10.Lead frame 40 embeds in package body 30.And, connecting anode leading-out terminal 21 on lead frame 40a, connecting cathode end 22 on lead frame 40b.In this consists of, when making solid electrolytic capacitor 1, connect a plurality of cuboid elements 10 (with reference to Fig. 9, Figure 12) on a lead frame 40.
Anode leading-out terminal 21 is to be combined by intermetallic to connect with lead frame 40a.Do not use conductive adhesive in being connected of anode leading-out terminal 21 and lead frame 40a.As the method for attachment of intermetallic combination, can enumerate welding (laser welding or electric resistance welding etc.).
And lead frame 40a is that the part that exposes outside at cuboid element 10 with anode leading-out terminal 21 (part of exposing from the end face 10a of cuboid element 10) is connected.And lead frame 40a is connected with anode leading-out terminal 21 face near a side of the outermost shell of cuboid element 10 part that cuboid element 10 exposes outside (part that anode leading-out terminal 21 exposes from the end face of cuboid element 10).
Cathode end 22 is connected by conductive adhesive with lead frame 40b.As conductive adhesive, such as using thermosetting resin (such as epoxy resin) with insulating properties to be dispersed with the well-known person in the past such as conductive material (such as silver, copper, graphite) as main component and in this resin.In the present embodiment, use the silver slurry as conductive adhesive.
And, lead frame 40b be with cathode end 22 in consist of the side (bottom surface of cuboid element 10, the face of the below of Fig. 1) of cuboid element 10 part connect.Cathode end 22 is to be connected with lead frame 40b between end face 10a, the 10b of the length direction of cuboid element 10 (left and right directions of Fig. 1).
In the present embodiment, the part exposed from cuboid element 10 of anode leading-out terminal 21 is flat.Be that columned situation is compared with this part, contact when the lead-in wire that makes anode leading-out terminal 21 with cuboid element 10 outsides (for example lead frame 40) can become face when being connected, thus larger contact area can be obtained, thus can guarantee to be electrically connected.In the utility model, the shape of anode leading-out terminal 21 exposed portions serve is not limited to this example, for example also can be thick tabular of the part that is connected with anode foils 11 than anode leading-out terminal 21 and cathode end 22 parts that are connected with Cathode Foil 12.Anode leading-out terminal 21 can be the plane from the surface of the part that cuboid element 10 exposes, and also can be curved surface, also can comprise plane and curved surface.
As shown in Figure 1, utilize package body 30 packing (sealing) cuboid elements 10, reach the lead frame 40 that is connected with cuboid element 10, thereby guarantee and exterior insulation.As package body 30, such as enumerating epoxy resin or liquid crystal polymer etc.And, when forming package body 30, use common compression molding processing procedure.In package body 30, lead frame 40 has tabular, and contacts with anode leading-out terminal 21 and cathode end 22 difference faces.Lead frame 40 is not implemented bending machining, therefore lead frame 40 forms tabular, and not with end face 10a, 10b subtend.Therefore, can shorten cuboid element 10 end face 10a, 10b and and the surface of the package body 30 of end face 10a, 10b subtend between distance.Its result can make the width of anode foils 11 become large, and can increase electrostatic capacitance.
In the present embodiment, can be by cuboid element 10 being set as suitable thickness (for example 1.8mm), and carrying out when resin-molded, the not restriction of producing component diameter realizes the chip type solid electrolytic capacitor that more can tackle the narrow boards requirement.Therefore, according to the solid electrolytic capacitor 1 of present embodiment, shared thickness space is less, thereby can be with the more high-grade requirement of satisfying the electronic equipment narrow boards.
Secondly, utilize Fig. 3, to the included cuboid element 10 of the solid electrolytic capacitor 1 of the first execution mode, compare with the included element 1010 of the solid electrolytic capacitor 1001 of the included element 110 of in the past solid electrolytic capacitor 101 and comparative example.Fig. 3 (a) means the schematic diagram of the cuboid element 10 of the first execution mode, Fig. 3 (b) means the schematic diagram of element 110 in the past, Fig. 3 (c) means the schematic diagram of the element 1010 of comparative example, and Fig. 3 (d) is the summary longitudinal section that schematically shows as the solid electrolytic capacitor 1001 of the comparative example that comprises the element 1010 shown in Fig. 3 (c).
As shown in Fig. 3 (a), in cuboid element 10, anode leading-out terminal 21 and cathode end 22 relative volume core 10c are configured in one-sided.Volume core 10c comprises and is positioned at the barrier film 13 (with reference to Fig. 4) in week.
On the other hand, in the element in the past 110 shown in Fig. 3 (b), volume core 110c is between anode leading-out terminal 121 and cathode end 122.As shown in Fig. 3 (a), (b), the anode leading-out terminal 21 in cuboid element 10 and the distance of the distance of cathode end 22 less than cuboid element 110 Anodic leading-out terminals 121 and cathode end 122.Therefore, in the cuboid element 10 of present embodiment, can reduce the difference in height of thickness direction Anodic leading-out terminal 21 with cathode end 22 of cuboid element 10.
With the cuboid element 10 of present embodiment similarly, also in the element as a comparative example 1010 shown in Fig. 3 (c), anode leading-out terminal 1021 and cathode end 1022 relative volume core 1010c are configured in one-sided.As shown in Fig. 3 (b), (c), the distance of element 1010 inner anode leading-out terminals 1021 and cathode end 1022 is less than the distance of element 110 Anodic leading-out terminals 121 with cathode end 122.Therefore, in element 1010 as a comparative example, with the cuboid element 10 of present embodiment similarly, also can reduce the difference in height of thickness direction Anodic leading-out terminal 1021 with cathode end 1022 of element 1010.
On the other hand, there is following difference between the cuboid element 10 of present embodiment and element as a comparative example 1010.As shown in Fig. 3 (a), in cuboid element 10, cathode end 22 is configured in the outermost shell place of cuboid element 10.That is, cathode end 22 exposes in the side of cuboid element 10 (bottom surface of cuboid element 10, the face of below in Fig. 3 (a)).On the other hand, in the element 1010 shown in Fig. 3 (c), cathode end 1022 is not configured in the outermost shell place of element 1010.That is, cathode end 1022 does not expose from the side (bottom surface of element 1010, the face of below in Fig. 3 (c)) of element 1010.Due to above-mentioned situation, as shown in Fig. 1, Fig. 3 (d), in the solid electrolytic capacitor 1 of present embodiment, lead frame draws the path of drawing that the path is shorter than lead frame in solid electrolytic capacitor 1001.Its result according to the solid electrolytic capacitor 1 of present embodiment, is compared with the solid electrolytic capacitor 1001 of same size, and the width of electrode foil and electrostatic capacitance value are further increased.
In addition, as shown in Fig. 3 (a), by cuboid element 10 being applied mold pressing processing, and when observing from the axis direction of volume core 10c, volume core 10c extends along the length direction of end face 10b.On the thickness direction (above-below direction of Fig. 3) of cuboid element 10, anode leading-out terminal 21 and cathode end 22 overlap with volume core 10c.Observe from the axis direction of volume core 10c, volume core 10c is along the length of the length direction of end face 10b (or the end face 10a) width greater than anode leading-out terminal 21 and cathode end 22.The part integral body that is positioned at cuboid element 10 in anode leading-out terminal 21 and cathode end 22 overlaps on the thickness direction of cuboid element 10 with volume core 10c.In other words, on the length direction of end face 10b (or end face 10a), the width of anode leading-out terminal 21 and cathode end 22 is less than the width of volume core 10c.Thus, when mold pressing, the suffered power of Cathode Foil 12 that can alleviate the anode foils 11 that is connecting anode leading-out terminal 21 and connect cathode end 22.And in cuboid element 10, anode leading-out terminal 21 overlaps on the thickness direction of cuboid element 10 with cathode end 22.In the utility model, anode leading-out terminal 21 overlaps with at least a portion of cathode end 22 and gets final product, and the degree that overlaps is not particularly limited, for example, preferably in cuboid element 10, half overlaps anode leading-out terminal 21 at least with cathode end 22, more preferably overlaps more than 2/3.In addition, in the present embodiment, two-terminal has identical width, but under the width different situations of two-terminal, take the shortest terminal of width as benchmark, calculates the coincidence degree of two-terminal.
Fig. 4 (a) is the cross-sectional view that schematically shows the element before the compression molding of the first execution mode, and Fig. 4 (b) is the cross-sectional view that schematically shows the element after the compression molding of the first execution mode.In Fig. 4, the symbol identical with the symbol in Fig. 1~Fig. 3 to the formation mark identical with Fig. 1~Fig. 3.
As shown in Fig. 4 (a), winding element 16 (element before compression molding) comprises relatively wide and larger volume core 10c.Winding element 16 shown in Fig. 4 (a) is to process by mold pressing to be the rectangular-shaped element 17 shown in Fig. 4 (b).Anode foils 11 is thicker than Cathode Foil 12.In the present embodiment, as shown in Fig. 4 (b), one-sided at the volume core 10c of element 17, anode leading-out terminal 21 is connected with the lateral surface of anode foils 11, and cathode end 22 is connected with the lateral surface of Cathode Foil 12.In addition, in the utility model, preferred cathode end 22 at least is connected in the lateral surface of Cathode Foil 12.Its reason is, cathode end 22 is easily exposed in the side of cuboid element 10, thereby shorten draw distance.
And, as shown in Fig. 4 (b), only configuring Cathode Foil 12, and the barrier film 13 of 1 between anode leading-out terminal 21 and cathode end 22.That is the electrode foil that, is configured between anode leading-out terminal 21 and cathode end 22 is 1.Therefore, can shorten the distance of thickness direction Anodic leading-out terminal 21 with cathode end 22 of cuboid element 10.In addition, in the utility model, the electrode foil that is configured between anode leading-out terminal 21 and cathode end 22 is not limited to this example.
And, as shown in Fig. 4 (b), on the thickness direction (above-below direction in figure) of element 17, only configuring 1 barrier film 13 in the outside of cathode end 22, and do not configuring anode foils 11 and Cathode Foil 12.Be configured in the barrier film 13 in the outside of cathode end 22 by dismounting, and cathode end 22 is exposed.Element before dismounting barrier film 13 is element 17 (with reference to Fig. 4 (b)), and the element after dismounting barrier film 13 is cuboid element 10 (with reference to Fig. 3 (a)).In addition, in the utility model, also can be at the outside of cathode end configuration multi-disc barrier film.In this case, can cathode end 22 be exposed by dismounting multi-disc barrier film.
Secondly, with reference to Fig. 5~Figure 12, the manufacture method of the solid electrolytic capacitor of present embodiment is described.
<step S1 〉
As shown in Figure 5, prepare anode foils 11 and the Cathode Foil 12 that severing becomes certain width.Specifically, anode foils 11 and Cathode Foil 12 are band shape.Anode foils 11 and Cathode Foil 12 are identical with described content, so, omit explanation herein.
<step S2 〉
As shown in Figure 5, electrode leading- out terminal 21,22 is engaged in anode foils 11 and Cathode Foil 12.Specifically, anode leading-out terminal 21 is engaged in anode foils 11, cathode end 22 is engaged in Cathode Foil 12.Anode leading-out terminal 21 comprises columniform exposed division 21a and flat connecting portion 21b.Cathode end 22 comprises columniform exposed division 22a and flat connecting portion 22b.The connecting portion 21b of anode leading-out terminal 21 engages with anode foils 11.The connecting portion 22b of cathode end 22 engages with Cathode Foil 12.Each electrode leading- out terminal 21,22 with electrode foil 11,12 to engage be to be undertaken by interlock or ultrasonic waves welding etc.
And, in step S2, make cathode end 22 be engaged in Cathode Foil 12, and with the Partial Resection of the end face 10a side of the cuboid element 1 that exposes from Cathode Foil 12 of cathode end 22.In the present embodiment, because the anode leading-out terminal 21 on the thickness direction of element 17 is shorter with the distance of cathode end 22, and the exposed division 21a of anode leading-out terminal 21 is thicker than connecting portion 21b, institute thinks and prevents anode leading- out terminal 21 and 22 short circuits of cathode end, and dismantles modestly the exposed division 22a of cathode end 22.Therefore, as shown in Figure 1, in cuboid element 10, cathode end 22 is not outstanding from the end face 10a of cuboid element 10.But, from preventing the short circuit viewpoint, if some amounts (unavoidable error when for example making) is outstanding, tolerable.
<step S3 〉
As shown in Figure 6, by with anode foils 11 and Cathode Foil 12 and be configured in anode foils 11 and Cathode Foil 12 between barrier film 13 reel after, cut off with length-specific, and form cylinder, and utilize anti-roll adhesive tape 14 that the end is fixed on cylindrical side.Herein, the relative anode foils 11 of Cathode Foil 12 is wound on the outside of wireline reel, and Cathode Foil 12 is positioned at cylindrical most peripheral place.Consist of according to this, the dielectric medium oxide scale film (making Cathode Foil 12 near the dielectric medium oxide scale film) that is formed on anode foils 11 by utilizing the lower Cathode Foil of resistance 12 to cover can make ESR reduce.And, than anode foils 11 softnesses, so reel by the outside that Cathode Foil 12 is configured in anode foils 11, just can alleviate moulded resin to the stress of element due to Cathode Foil 12.In addition, with respect to utilizing anti-roll adhesive tape 14 that the end is fixed on cylindrical side, also exist and utilize adhesive to paste and do not use the method for anti-roll adhesive tape.Thus, form winding element 16.At this moment, the connecting portion 22b of the connecting portion 21b of anode leading-out terminal 21 and cathode end 22 is positioned at the inside of winding element 16.And the exposed division 21a of anode leading-out terminal 21 exposes from an end of winding element 16.Barrier film 13 for example comprises natural fiber (cellulose) or chemical fibre.The natural fiber or the chemical fibre that can be used as barrier film 13 are not particularly limited.As chemical fibre, can use the synthetic fibers such as Fypro, acrylic fiber, vinylon fiber, polyimide fiber, nylon fiber.
<step S4 〉
As shown in Figure 7, winding element 16 is deformed into rectangular-shaped element 17 (with reference to Fig. 4 (a), (b)).Specifically, by winding element 16 is fixed on particular jig (not shown), applies load and make winding element 16 distortion, and form the rectangular-shaped element 17 of specific dimensions.Then, element 17 is fixed on bar.
And then present embodiment is to be in columned situation in the part that anode leading-out terminal 21 exposes from element 17, after winding element 16 is deformed into element 17, columned exposed division 21a by mold pressing, is configured as flat (or tabular).
<step S5 〉
Element 17 is changed into process and heat treatment.Specifically, element 17 is immersed in forming liquid in the forming liquid container, will changes into container as negative electrode, and with anode leading-out terminal 21 as anode, antianode paper tinsel 11 implements to change into processing.The solute that uses in forming liquid is the solutes such as inorganic acid salt such as organic acid salt with carboxylic acid group, phosphate.In the present embodiment, use ammonium adipate as forming liquid.This changes into and processes is to use with concentration as the ammonium adipate of the 0.5wt%~3wt% forming liquid as main body, carries out with the voltage of the proof voltage that is similar to the dielectric medium oxide scale film.Then, take out element 17 from forming liquid, heat-treat.Heat treatment be carry out in the temperature range of 200 ℃~300 ℃ a few minutes~about dozens of minutes.Repeat to change into for several times and the heat treatment action.By above-mentioned processing, and the metal that the cut that the valve metal that exposes on the cross section of anode foils 11 or connect because of terminal causes etc. cause exposes and forms oxide scale film on face.Thus, can form the more excellent dielectric medium oxide scale film of thermal endurance.
<step S6 〉
Form solid electrolyte layer (by anode foils 11 and Cathode Foil 12 surface and the solid electrolyte layer that keeps of barrier film 13 separately) between the anode foils 11 of described element and Cathode Foil 12.In the present embodiment, solid electrolyte is electroconductive polymer, and by as the 3,4-rthylene dioxythiophene of monomer with form as the chemical polymerization of the tosilate of oxidant.Specifically, at first, monomer solution for example becomes the concentration of 25wt% through the ethanol dilution.Element 17 is immersed in monomer solution, then, utilizes heat drying to remove ethanol as solvent, and residual monomer only.Preferred 40 ℃~60 ℃ of the temperature of heat drying for example can be made as 50 ℃.If temperature surpasses 60 ℃, near the boiling point of ethanol, can cause evaporation sharply so, cause monomer can't remain in equably element 17 inside.And if be below 40 ℃, evaporation needs elapsed time so.The volume that depends on element 17 drying time, with regard to element 17, preferred about 10 minutes~20 minutes.Secondly, oxidant is contained be immersed in the residual element 17 that monomer arranged, form 3,4-rthylene dioxythiophene.Described oxidant impregnation is to utilize decompression impregnation method and contain and be immersed in element 17.Use the butanol solution of tosilate 55wt% as oxidant, element 17 is immersed in oxidant, the impregnation of reducing pressure.Secondly, make element 17 be warming up to 180 ℃ from 30 ℃ of stages, by chemical polymerization, can form gathering-3,4-rthylene dioxythiophene as electroconductive polymer.In addition, the electroconductive polymer that is formed in element not only can adopt the method that forms by chemical polymerization in element, also can pass through pre-synthesis electroconductive polymer, element is immersed in the solution that is dispersed with electroconductive polymer in solvent, carry out drying and form, also can separately or use the well-known electroconductive polymer such as a plurality of polyanilines, polypyrrole, polythiophene and replace gathering-3,4-rthylene dioxythiophene.
<step S7 〉
As shown in Figure 8, cut off the redundance of anode leading-out terminal 21, as shown in Figure 9, make the electrode leading- out terminal 21,22 of cuboid element 10 be connected in lead frame 40.Lead frame 40 becomes bringing-out.
Utilize Figure 10, concrete method of attachment is described.
At first, in element 17, utilize laser to cut and get barrier film 13 and the solid electrolyte in the outside (back side) that is configured in cathode end 22.Thus, expose cathode end 22 in the side (bottom surface of element) of element, element 17 becomes cuboid element 10.
As shown in Figure 10 (a), in the present embodiment, cathode end 22 is positioned between end face 10a, 10b, wherein, exposes the part of end face 10b side.In addition, in the utility model, in the surface of cathode end, the ratio of exposed portions serve circumscribed not, also can expose cathode end at the end face from the cuboid element to the integral body of other end.
In the situation that cathode end 22 comprises the nickel-clad copper mother metal, utilize laser to cut and get barrier film 13 and solid electrolyte.Its purpose is to reduce contact resistance.In addition, in the situation that cathode end 22 comprises the silver-plated copper mother metal, utilize too laser to cut and get barrier film 13 and solid electrolyte.
As shown in Figure 10 (b), be pin (not shown) the perforation lead frame 40a of cone-shaped by making front end, and form jut 41 on lead frame 40a.Jut 41 is the peripheries that form the pin when utilizing pin to connect.Jut 41 forms when being connected with anode leading-out terminal 21 towards anode leading-out terminal 21.The quantity of jut 41 is not particularly limited.In addition, Figure 10 (b) is that expression has cathode end junction surface 50 in lead frame 40b.
Secondly, as shown in Figure 10 (c), the mode that contacts with the jut 41 of lead frame 40a with anode leading-out terminal 21, and, mode so that the cathode end junction surface 50 in cathode end 22 (with reference to Figure 10 (a)) that exposes in the side of cuboid element 10 and lead frame 40b contacts is configured in cuboid element 10 on lead frame 40.
Then, as shown in Figure 10 (d), by the method for attachment of the intermetallic combinations such as laser welding or electric resistance welding, and make anode leading-out terminal 21 be engaged in lead frame 40a.For example comprise aluminium at anode leading-out terminal 21, and lead frame 40 comprises in the situation of copper, during welding, 21 meltings of anode leading-out terminal.And, utilize conductive adhesive, make cathode end 22 be engaged in lead frame 40b.
<step S8 〉
As Figure 11, Figure 12 and shown in Figure 1, pack by the cuboid element 10 that is connected with lead frame 40 being carried out mold pressing, and form package body 30, then, will expose to cut off to the lead frame 40 of outside from package body 30 and remove, complete chip-type solid electrolytic capacitor device 1.
[the second execution mode]
Below, the inscape mark prosign identical with the inscape of the solid electrolytic capacitor 1 of the first execution mode described.And, also be fit to the part of the second execution mode for the explanation in the first execution mode, the description thereof will be omitted.
Utilize Figure 13~Figure 16 that the second execution mode is described.
Figure 13 is the summary longitudinal section that schematically shows the solid electrolytic capacitor of the second execution mode.
As shown in figure 13, also in the second execution mode, with the first execution mode similarly, cathode end 22 is configured in the outermost shell place of cuboid element 10.That is, cathode end 22 exposes in the side of cuboid element 10 (bottom surface of cuboid element 10, the face of below in Figure 13).And cathode end 22 that this exposes is connected with lead frame 40b.
In the second execution mode, different from the first execution mode, cathode end 22 has the shape that is bent.
Below, the manufacture method of the solid electrolytic capacitor of the second execution mode is described.Step till step S1~step S6 is because of identical with the first execution mode, and omission explanation herein.
<step S7 〉
When the electrode leading- out terminal 21,22 with cuboid element 10 was connected with lead frame 40, target leading-out terminal 22 carried out bending process.
Figure 14 and Figure 15 are the schematic diagrames of the element after the compression molding of the second execution mode.
As shown in figure 14, in the element 17 of the time point that winding element 16 (element before compression molding is with reference to Fig. 4 (a)) is carried out mold pressing processing, cathode end 22 not yet has the shape that is bent.In element 17, carry out bending process by target leading-out terminal 22 and obtain cuboid element 10 shown in Figure 15.Element before bent cathode leading-out terminal 22 is element 17 (with reference to Figure 14), and the element after bent cathode leading-out terminal 22 is cuboid element 10 (with reference to Figure 15).
Bending process is to carry out as follows.
As shown in figure 14, in the element 17 before bending process, cathode end 22 exposes from the end face of element.And, also in the second execution mode, with the first execution mode similarly, the outside of cathode end 22 in element 17 is configuring 1 barrier film 13 (with reference to Fig. 4 (b)).Below, this 1 barrier film 13 is called outermost shell place barrier film.When carrying out bending process, (along the limit of the length direction of end face) as broken line take the limit of outermost shell place barrier film, the part of exposing from the end face of element in folding cathode end 22.Thus, expose cathode end 22 in the side (bottom surface of element) of element.
With the first execution mode similarly, in the situation that cathode end 22 comprises the nickel-clad copper mother metal, the solid electrolyte of cathode end 22 that utilizes laser to cut to learn from else's experience folding.In addition, also in the situation that cathode end 22 comprises the silver-plated copper mother metal, utilize laser to cut and get solid electrolyte.
After this, utilize the method identical with the first execution mode, anode leading-out terminal 21 is connected with lead frame 40a, and the cathode end that will expose in the side of cuboid element 10 22 is connected (with reference to Figure 10 (b)~Figure 10 (d)) with lead frame 40b.
<step S8 〉
As Figure 16, Figure 12 and shown in Figure 13, pack by the cuboid element 10 that is connected with lead frame 40 being carried out mold pressing, and form package body 30, then, will be exposed to 40 cut-outs of outside lead frame from package body 30 to remove, complete chip-type solid electrolytic capacitor device 1.
As shown in figure 13, in solid electrolytic capacitor 1, the side (bottom surface of cuboid element 10, the face of below in Figure 13) of exposing cathode end 22 in the side of cuboid element 10 comprises through folding cathode end 22 and outermost shell place barrier film.Cathode end 22 and the distance of the distance of rolling up core 10c greater than outermost shell place's barrier film and volume core 10c that warp is folding.Therefore, have jump through the surface of the surface of folding cathode end 22 and outermost shell place barrier film, but, in this manual, for simplicity, 1 face that two planes is considered as consisting of the cuboid element describes.
In the present embodiment, the outside that is not exposed to the part (without folding part) of side in cathode end 22 is only configuring 1 barrier film 13, and does not configure anode foils 11 and Cathode Foil 12.That is, be exposed to the part of side in cathode end 22 and the part do not exposed between only clip 1 barrier film.But, also can clip the multi-disc barrier film between the part (through folding part) that is exposed to the side in cathode end 22 and the part of not exposing (without the part that folds).
Described execution mode is better embodiment of the present utility model, but the utility model is not carried out any restriction.If those skilled in the art of the present utility model in scope of the present utility model, can utilize described method and technology contents to carry out various changes to the utility model so, perhaps, the variable more equal mode of executing.Therefore, only otherwise break away from content of the present utility model, according to the utility model, the institute that execution mode carries out is changed, displacement and the modification of equipollent all belonged in scope of the present utility model.
embodiment 1 〉
As embodiment 1, make the solid electrolytic capacitor 1 shown in described the first execution mode (6.3V, 100 μ F) (Fig. 1).The packing box of this solid electrolytic capacitor 1 is of a size of 7.3mm * 4.3mm * 2.8mm.Using surface thickness after implementing Nickel Plating Treatment is the copper frame material of 100 μ m, as lead frame 40 (40a and 40b).In addition, during fabrication, with lead frame 40a with before anode leading-out terminal 21 (aluminum anode lug) is connected, make pin connect in lead frame 40a link position with anode leading-out terminal 21, thus, form jut 41 at described link position.Use front end as quadrangle cone shape
Figure DEST_PATH_GDA00003008143800151
Pin as pin.Utilize inverter type resistance welding machine to carry out being connected of lead frame 40a and anode leading-out terminal 21.And, with lead frame 40b with before cathode end 22 (nickel-clad copper mother metal cathode tab) is connected, utilize laser to cut and get barrier film 13 and the solid electrolyte in the outside (back side) that is configured in cathode end 22.Thus, the nickel plating surface of cathode end 22 is exposed in the side of cuboid element 10.Then, utilize conductive adhesive (silver slurry), carry out lead frame 40b and expose being connected at cathode end 22 of the side of cuboid element 10.
<embodiment 2 〉
As embodiment 2, make the solid electrolytic capacitor 1 shown in described the second execution mode (6.3V, 100 μ F) (Figure 13).With lead frame 40b with before cathode end 22 (silver-plated copper mother metal cathode tab) is connected, (along the limit of the length direction of end face) as broken line take the limit of outermost shell place barrier film, the part that folding cathode end 22 exposes from the end face of element.Thus, cathode end 22 is exposed in the side (bottom surface) of cuboid element 10.And, utilize laser to cut and get barrier film 13 and the solid electrolyte that is configured in through the outside (back side) of folding cathode end 22, silver-plated surface is exposed.Except described aspect, make solid electrolytic capacitor 1 (Figure 13) in the mode identical with embodiment 1.
<comparative example 1 〉
As a comparative example 1, make in the past solid electrolytic capacitor 101 (6.3V, 100 μ F) (Figure 17).The size of the packing box of this solid electrolytic capacitor 101 and embodiment 1~2 are all 7.3mm * 4.3mm * 2.8mm.Using the surface is that the copper frame material of 100 μ m is as lead frame through implementing Nickel Plating Treatment and thickness.In addition, during fabrication, before lead frame and anode leading-out terminal (aluminum anode lug) and cathode end (aluminum cathode lug) are connected, make pin connect in lead frame link position with anode leading-out terminal and cathode end, thus, form jut at described link position.Use front end as quadrangle cone shape
Figure DEST_PATH_GDA00003008143800152
Pin as pin.Utilize inverter type resistance welding machine to carry out being connected of lead frame and anode leading-out terminal and cathode end.
<comparative example 2 〉
Replace except making solid electrolytic capacitor 1001 (Fig. 3 (d)) (6.3V, 100 μ F) implementing comparative example 2 in the mode identical with comparative example 1 solid electrolytic capacitor 101 in comparative example 1.The size of the packing box of this solid electrolytic capacitor 1001 and embodiment 1~2 are all 7.3mm * 4.3mm * 2.8mm.
To the solid electrolytic capacitor 101 of the solid electrolytic capacitor 1 of embodiment 1~2, comparative example 1, and the solid electrolytic capacitor 1001 of comparative example 2 carry out Performance Ratio.This result of expression in table 1.In addition, Tan δ represents to lose tangent of an angle.LC represents leakage current.ESR represents equivalent series resistance.
[table 1]
? Electrostatic capacitance Tanδ LC(μA) ESR(mΩ) Anode foils long (mm) Anode foils wide (mm)
Embodiment 1 151 0.011 92 5.5 22 5.0
Embodiment 2 154 0.013 96 6.7 22 5.0
Comparative example 1 105 0.015 85 9.5 22 3.6
Comparative example 2 126 0.013 83 7.8 22 4.3
As shown in table 1, the solid electrolytic capacitor 1 of embodiment 1~2 is compared with the solid electrolytic capacitor 101 of comparative example 1, electrostatic capacitance increases approximately 50%, compare with the solid electrolytic capacitor 1001 of comparative example 2, electrostatic capacitance also increases approximately 20%, can confirm low resistance (improvement of ESR), thereby confirm clearly validity of the present utility model.

Claims (7)

1. solid electrolytic capacitor comprises:
The cuboid element, make by anode foils, Cathode Foil, and the winding element that forms of membrane winding between anode foils and Cathode Foil be flat rectangular-shaped, form solid electrolyte;
The anode leading-out terminal is connected with described anode foils;
Cathode end is connected with described Cathode Foil; And
Package body is packed described cuboid element;
The volume core of described anode leading-out terminal and both relatively described cuboid elements of described cathode end is configured in one-sided,
Described cathode end is configured in the outermost shell place of described cuboid element.
2. solid electrolytic capacitor according to claim 1, wherein
Comprise respectively the lead frame with described anode leading-out terminal and described cathode end sub-connection in described package body,
Described lead frame is by conductive adhesive and described cathode end sub-connection.
3. solid electrolytic capacitor according to claim 1 and 2, wherein
Described cathode end attached bag contains copper base metal.
4. solid electrolytic capacitor according to claim 3, wherein
Described cathode end forms through nickel or silver plating.
5. solid electrolytic capacitor according to claim 1 and 2, wherein
The thickness of described anode leading-out terminal outside described cuboid element is greater than the thickness of described cathode end.
6. solid electrolytic capacitor according to claim 3, wherein
The thickness of described anode leading-out terminal outside described cuboid element is greater than the thickness of described cathode end.
7. solid electrolytic capacitor according to claim 4, wherein
The thickness of described anode leading-out terminal outside described cuboid element is greater than the thickness of described cathode end.
CN201220538506.4U 2012-10-19 2012-10-19 Solid electrolytic capacitor Expired - Fee Related CN203013534U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103366960A (en) * 2013-07-23 2013-10-23 日科能高电子(苏州)有限公司 Solid electrolytic capacitor
CN103779085A (en) * 2012-10-19 2014-05-07 尼吉康株式会社 Solid electrolytic capacitor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103779085A (en) * 2012-10-19 2014-05-07 尼吉康株式会社 Solid electrolytic capacitor
CN103779085B (en) * 2012-10-19 2017-03-01 尼吉康株式会社 Solid electrolytic capacitor
CN103366960A (en) * 2013-07-23 2013-10-23 日科能高电子(苏州)有限公司 Solid electrolytic capacitor

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