CN203002310U - Novel stirring device for silicon wafer grinding fluid - Google Patents
Novel stirring device for silicon wafer grinding fluid Download PDFInfo
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- CN203002310U CN203002310U CN 201220733920 CN201220733920U CN203002310U CN 203002310 U CN203002310 U CN 203002310U CN 201220733920 CN201220733920 CN 201220733920 CN 201220733920 U CN201220733920 U CN 201220733920U CN 203002310 U CN203002310 U CN 203002310U
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- stirring
- arc convex
- circular
- convex surface
- convex surfaces
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Abstract
The utility model discloses a novel stirring device for silicon wafer grinding fluid. The novel stirring device comprises a stirring shaft and stirring blades, wherein stirring blades are vertically fixed at the lower end of the stirring shaft; each of the stirring blades comprises a connecting part; circular-arc convex surfaces are uniformly formed at the edges of the connecting parts; a stirring plate is correspondingly arranged on each circular-arc convex surface; the stirring plates are vertically connected with the circular-arc convex surfaces. The stirring blades comprise connecting parts, circular-arc convex surfaces are uniformly formed at the edges of the connecting parts, and the stirring plate is correspondingly arranged on each circular-arc convex surface, and the stirring plates are vertically connected with the circular-arc convex surfaces, so that longitudinal stirring and transverse stirring are formed by stirring through the circular-arc convex surfaces at the edges of the stirring plates as well as the stirring plates during the stirring process, the stirring area is increased and the flow direction of the particles is changed, and therefore, the particles in the grinding fluid are dispersed more uniformly and the cutting quality of the silicon wafers is greatly improved.
Description
Technical field
The utility model relates to a kind of agitating device, and particularly a kind of agitating device of grinding fluid for silicon chip, belong to the technical field that silicon chip is processed.
Background technology
In silicon chip working process, in order to guarantee the designing requirement of silicon chip, require silicon chip to grind.In prior art, to the desired lapping liquid of silicon chip processing, the general employing by hand stirred.It is inhomogeneous that the method easily makes lapping liquid stir on the one hand, manually changes on the other hand operation, and efficient is low, and labor intensity of operating staff is large.
Recently a kind of agitating device occurs, comprised paddle, shaft, described paddle be fixed into one vertical with described shaft, described paddle is lobate member.When the paddle of this structure stirs, the particle in lapping liquid is easily concentrated to the periphery of cylindrical shell, easily affected the quality of lapping liquid, thereby, greatly reduce the quality that silicon chip cuts.
The utility model content
Technical problem to be solved in the utility model is that a kind of agitating device of Novel silicon slice lapping liquid is provided for above drawback, this agitating device is simple in structure, stir, thereby, greatly improved the mixing quality of lapping liquid, thereby, guarantee the quality that silicon chip cuts.
In order to solve the problems of the technologies described above, the agitating device of a kind of Novel silicon slice lapping liquid of the utility model, comprise shaft, paddle, the lower end that is fixed on described shaft that described paddle is vertical, wherein, described paddle comprises the coupling part, and the edge of described coupling part evenly is provided with arc convex surface, each described arc convex surface is provided with corresponding stirring piece, and described stirring piece is connected with described arc convex surface is vertical.
The agitating device of above-mentioned Novel silicon slice lapping liquid, wherein, described stirring piece is comprised of some plates, and described plate is parallel to each other is fixed into one.
The agitating device of above-mentioned Novel silicon slice lapping liquid, wherein, the gap between described adjacent plate is 0.03mm.
The beneficial effects of the utility model:
Because described paddle comprises the coupling part, the edge of described coupling part evenly is provided with arc convex surface, and each described arc convex surface is provided with corresponding stirring piece, and described stirring piece is connected with described arc convex surface is vertical, during stirring, arc convex surface and stirring piece by the stirring piece edge stir, and form vertically with laterally to stir, and have not only increased the stirring area, and change the flow direction of particle, thereby, make the particle dispersion in lapping liquid more even, greatly improved the cut quality of silicon chip; In addition, described paddle is comprised of some plates, and described plate is parallel to each other is fixed into one, and the gap between described adjacent plate is 0.03mm, during stirring, particle passes the gap, confiscates with liquid and mixes, thereby, improved the dispersiveness of particle, improved the quality of lapping liquid.
Description of drawings
Fig. 1 is structural representation of the present utility model.
The specific embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
As shown in the figure, in order to solve the problems of the technologies described above, the agitating device of a kind of Novel silicon slice lapping liquid of the utility model, comprise shaft 2, paddle 1, the lower end that is fixed on described shaft 2 that described paddle 1 is vertical, described paddle 1 comprises coupling part 11, the edge of described coupling part 11 evenly is provided with arc convex surface 3, each described arc convex surface 3 is provided with corresponding stirring piece 4, described stirring piece 4 and described vertical connection of arc convex surface 3.Angle β between adjacent arc convex surface is 120 °.Described stirring piece 4 is comprised of some plates 41, and described plate 41 is parallel to each other is fixed into one, and the gap α between described adjacent plate 41 is 0.03mm.Coupling part 11 is round member, because described paddle 1 comprises coupling part 11, the edge of described coupling part 11 evenly is provided with arc convex surface 3, each described arc convex surface is provided with corresponding stirring piece, described stirring piece is connected with described arc convex surface is vertical, during stirring, arc convex surface and stirring piece by the stirring piece edge stir, form vertically with laterally and stir, not only increase the stirring area, and changed the flow direction of particle, thereby, make the particle dispersion in lapping liquid more even, greatly improved the cut quality of silicon chip; In addition, described paddle is comprised of some plates, and described plate is parallel to each other is fixed into one, and the gap between described adjacent plate is 0.03mm, during stirring, particle passes the gap, confiscates with liquid and mixes, thereby, improved the dispersiveness of particle, improved the quality of lapping liquid.
Claims (3)
1. the agitating device of Novel silicon slice lapping liquid, comprise shaft, paddle, the lower end that is fixed on described shaft that described paddle is vertical, it is characterized in that, described paddle comprises the coupling part, the edge of described coupling part evenly is provided with arc convex surface, and each described arc convex surface is provided with corresponding stirring piece, and described stirring piece is connected with described arc convex surface is vertical.
2. the agitating device of Novel silicon slice lapping liquid as claimed in claim 1, is characterized in that, described stirring piece is comprised of some plates, and described plate is parallel to each other is fixed into one.
3. the agitating device of Novel silicon slice lapping liquid as claimed in claim 2, is characterized in that, the gap between described adjacent plate is 0.03mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220733920 CN203002310U (en) | 2012-12-27 | 2012-12-27 | Novel stirring device for silicon wafer grinding fluid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220733920 CN203002310U (en) | 2012-12-27 | 2012-12-27 | Novel stirring device for silicon wafer grinding fluid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203002310U true CN203002310U (en) | 2013-06-19 |
Family
ID=48593946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220733920 Expired - Fee Related CN203002310U (en) | 2012-12-27 | 2012-12-27 | Novel stirring device for silicon wafer grinding fluid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203002310U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103055753A (en) * | 2012-12-27 | 2013-04-24 | 镇江市港南电子有限公司 | A novel stirring device for wafer polishing solutions |
-
2012
- 2012-12-27 CN CN 201220733920 patent/CN203002310U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103055753A (en) * | 2012-12-27 | 2013-04-24 | 镇江市港南电子有限公司 | A novel stirring device for wafer polishing solutions |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20141227 |
|
| EXPY | Termination of patent right or utility model |