CN202974803U - Solder wettability tester - Google Patents
Solder wettability tester Download PDFInfo
- Publication number
- CN202974803U CN202974803U CN 201220745454 CN201220745454U CN202974803U CN 202974803 U CN202974803 U CN 202974803U CN 201220745454 CN201220745454 CN 201220745454 CN 201220745454 U CN201220745454 U CN 201220745454U CN 202974803 U CN202974803 U CN 202974803U
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- China
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- definition camera
- solder
- worktable
- heated substrates
- tester according
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Abstract
The utility model discloses a solder wettability tester which comprises a worktable, wherein a testing device and an observation device are arranged on the worktable; the testing device comprises a heating substrate (1); a testing substrate (2) is arranged on the heating substrate (1); an object to be tested is arranged on the testing substrate (2); a sealing cover (3) is arranged at the periphery of the heating substrate (1); the lower end of the sealing cover is provided with an air inlet (4) and an air outlet (5) through which gas can go in and out; the observation device is a high definition camera (6); the high definition camera is arranged on the worktable through a vertical guide rail (7); and the position of the high definition camera on the vertical guide rail can be adjustable. The solder wettability tester is simple in structure, very easy to operate and very intuitive in observation, and the wettability of the preformed solder piece can be well qualitatively analyzed.
Description
Technical field
The utility model relates to the solder property testing, particularly a kind of solder tester.
Background technology
Existing traditional solder instrument is all to adopt the wettability equilibrium method to carry out the test of solder performance, this kind method step complexity, and equipment needed thereby is expensive, and requires the scolder test volume larger.Present metal preformed solder sheet commonly used, volume is little, and becomes certain size, in the situation that do not change its shape and weight is difficult to utilize current wetting instrument to carry out wetting observation to it.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of solder instrument of easy to use, the wetting state that is applicable to preformed solder sheet test.
For solving the problems of the technologies described above, the utility model is realized by the following technical solutions:
A kind of solder tester, comprise worktable, described worktable is provided with proving installation and observation device, described proving installation comprises heated substrates, test base is set on heated substrates, determinand is positioned on test base, and heated substrates encloses seal closure outward, and the seal closure lower end is provided with air intake opening and the gas outlet for the gas turnover.
Described observation device is high-definition camera, and described high-definition camera is installed on worktable by vertical guide rail, and high-definition camera position on vertical guide rail is adjustable.
Preferably, described high-definition camera is connected with monitor terminal; Described heated substrates is connected to the outer temperature curve controller of seal closure.
Further preferred, described air intake opening connects the nitrogen input media, and described gas outlet connects air extractor.
Compared with prior art, the equipment that the utility model has the advantage of is simple, and it is very easy to operate, and observes very intuitively, can well analyze qualitatively the wetting state of preformed solder sheet.
Description of drawings
Accompanying drawing 1 is the structural representation of solder instrument described in the utility model.
Embodiment
For the ease of those skilled in the art's understanding, below in conjunction with specific embodiment and accompanying drawing, the utility model theory of constitution is further described in detail:
As shown in Figure 1, the solder instrument that the utility model discloses, comprise worktable, and be located at proving installation and observation device on worktable, described proving installation comprises heated substrates 1, heated substrates 1 heats by connecting temperature curve controller 9, test base 2 is set on heated substrates 1, and determinand is positioned on test base 2, the outer seal closure 3 that encloses of heated substrates 1, seal closure 3 adopts transparent quartz covers, and the seal closure lower end is provided with air intake opening 4 and the gas outlet 5 for the gas turnover.
Described observation device is high-definition camera 6, and described high-definition camera 6 is installed on worktable by vertical guide rail 7, and high-definition camera 6 position on vertical guide rail is adjustable, and connects monitor terminal 8.
During concrete enforcement, first scolder Pb37Sn63 to be measured is positioned on test base 2, covers quartz cover, then by regulating the height of high-definition camera 6 on vertical guide rail 7, until to shooting effect the best of scolder; Then close the air intake opening 4 of seal closure, gas outlet 5 connects air extractor, will be evacuated in seal closure, then is filled with nitrogen from air intake opening 4.After being full of nitrogen in seal closure, regulating temperature curve controller 9 heated substrates 1 is heated to 220 ℃~240 ℃, the high speed high-definition camera is taken the variable condition of scolder continuously, transfers to monitor terminal 8, analyzes the wetting state of scolder.
Need to prove, not breaking away under the utility model design prerequisite its any subtle change of doing and being equal to replacement, all should belong to protection domain of the present utility model.
Claims (6)
1. solder tester, comprise worktable, described worktable is provided with proving installation and observation device, it is characterized in that: described proving installation comprises heated substrates (1), test base (2) is set on heated substrates (1), determinand is positioned on test base (2), the outer seal closure (3) that encloses of heated substrates (1), and the seal closure lower end is provided with air intake opening (4) and gas outlet (5) for the gas turnover.
2. solder tester according to claim 1, it is characterized in that: described observation device is high-definition camera (6), and described high-definition camera is installed on worktable by vertical guide rail (7), and high-definition camera position on vertical guide rail is adjustable.
3. solder tester according to claim 2, it is characterized in that: described high-definition camera is connected with monitor terminal (8).
4. solder tester according to claim 1 is characterized in that: described heated substrates (1) is connected to the outer temperature curve controller (9) of seal closure.
5. solder tester according to claim 1, is characterized in that: described air intake opening connection nitrogen input media.
6. solder tester according to claim 1, is characterized in that: described gas outlet connection air extractor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220745454 CN202974803U (en) | 2012-12-28 | 2012-12-28 | Solder wettability tester |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220745454 CN202974803U (en) | 2012-12-28 | 2012-12-28 | Solder wettability tester |
Publications (1)
Publication Number | Publication Date |
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CN202974803U true CN202974803U (en) | 2013-06-05 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 201220745454 Expired - Lifetime CN202974803U (en) | 2012-12-28 | 2012-12-28 | Solder wettability tester |
Country Status (1)
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CN (1) | CN202974803U (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104241154A (en) * | 2013-06-14 | 2014-12-24 | 无锡华润安盛科技有限公司 | Flip chip welding spot wettability judgment method and chip welding method |
CN105699256A (en) * | 2014-11-28 | 2016-06-22 | 中国科学院金属研究所 | A method of calculating a wetting speed for Sn-based solder and a Cu substrate |
CN106181101A (en) * | 2016-07-13 | 2016-12-07 | 江苏科技大学 | A kind of observation instantaneous high-temperature wetting areas assay device |
CN107421974A (en) * | 2017-08-24 | 2017-12-01 | 华北水利水电大学 | A kind of method for predicting low melting point element regulation and control hard solder wetability |
CN107505231A (en) * | 2017-09-04 | 2017-12-22 | 南昌大学 | The equipment at triple line movement and dynamic moisture angle during a kind of real-time synchronization monitoring brazing filler metal melts |
CN107561108A (en) * | 2017-08-24 | 2018-01-09 | 华北水利水电大学 | A kind of Forecasting Methodology of low melting point element regulation and control silver solder wetability |
CN110320132A (en) * | 2019-07-03 | 2019-10-11 | 郑州机械研究所有限公司 | A kind of solder wetting sprawls test method |
-
2012
- 2012-12-28 CN CN 201220745454 patent/CN202974803U/en not_active Expired - Lifetime
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104241154A (en) * | 2013-06-14 | 2014-12-24 | 无锡华润安盛科技有限公司 | Flip chip welding spot wettability judgment method and chip welding method |
CN105699256A (en) * | 2014-11-28 | 2016-06-22 | 中国科学院金属研究所 | A method of calculating a wetting speed for Sn-based solder and a Cu substrate |
CN106181101A (en) * | 2016-07-13 | 2016-12-07 | 江苏科技大学 | A kind of observation instantaneous high-temperature wetting areas assay device |
CN107421974A (en) * | 2017-08-24 | 2017-12-01 | 华北水利水电大学 | A kind of method for predicting low melting point element regulation and control hard solder wetability |
CN107561108A (en) * | 2017-08-24 | 2018-01-09 | 华北水利水电大学 | A kind of Forecasting Methodology of low melting point element regulation and control silver solder wetability |
CN107421974B (en) * | 2017-08-24 | 2019-12-10 | 华北水利水电大学 | method for predicting wettability of low-melting-point element regulation brazing filler metal |
CN107561108B (en) * | 2017-08-24 | 2021-04-27 | 华北水利水电大学 | Prediction method for regulating wettability of silver solder by low-melting-point element |
CN107505231A (en) * | 2017-09-04 | 2017-12-22 | 南昌大学 | The equipment at triple line movement and dynamic moisture angle during a kind of real-time synchronization monitoring brazing filler metal melts |
CN110320132A (en) * | 2019-07-03 | 2019-10-11 | 郑州机械研究所有限公司 | A kind of solder wetting sprawls test method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term |
Granted publication date: 20130605 |
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CX01 | Expiry of patent term |