CN107421974B - method for predicting wettability of low-melting-point element regulation brazing filler metal - Google Patents
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Abstract
The invention discloses a method for predicting the wettability of a low-melting-point element regulated brazing filler metal, which comprises the following steps of 1, measuring the content W M% (mass fraction) of each low-melting-point element in the brazing filler metal, 2, determining a melting temperature interval delta T M of the brazing filler metal, 3, expanding the content W M% of different low-melting-point elements in the step 1 by 100 times, respectively substituting melting temperature interval data delta T M in the step 2 into a prediction mathematical model S M, multiplying the values to obtain a value S M, 4, judging the wettability of the brazing filler metal according to the value SM in the step 3, wherein the smaller the value is, the better the wettability is, and the worse the wettability is on the contrary.
Description
the technical field is as follows: the invention belongs to the field of solder performance evaluation, and particularly relates to a prediction method for regulating and controlling the wettability of brazing filler metal by low-melting-point elements.
Background art:
the wettability is an important index for evaluating the performance of the brazing filler metal, and the quality of the wettability directly influences the joint filling capacity of the brazing filler metal and the quality and performance of a brazing joint, so that the service life and the reliability of a piece to be brazed are influenced. Solder wettability is therefore one of the key scientific issues in the study of brazing materials.
the low-melting-point element (the melting point is lower than 350 ℃) has the beneficial effects of reducing the melting temperature of the brazing filler metal and improving the wettability of the brazing filler metal, and for the brazing filler metal (the melting point is higher than 450 ℃), a certain amount of the low-melting-point element is added, so that the wettability and the joint filling capacity of the brazing filler metal can be effectively improved, the brazing seam tissue is refined, a brazing joint with high quality and excellent performance is obtained, and the industrial application range of the brazing filler metal is further widened.
The national standard GB/T11364-2008 'solder wettability test method' specifies a method for measuring the wettability of the solder, firstly, the melting temperature (interval) is obtained, and then, the wetting area (or wetting force or wetting angle) data of the solder is obtained by virtue of drawing software or an image analysis system through a large number of wetting tests such as solder and soldering flux dosage selection, heating of a wetting furnace, cooling and the like, so as to evaluate the wettability of the solder. Chinese patent 201310040275.3 discloses a method for improving solder wettability by compounding an ultrasonic field and an electrostatic field, which adopts the procedures of wetting test, sample photographing and drawing software calibration to analyze wetting angle and wetting area and judge solder wettability; although the wettability of the brazing filler metal can be effectively improved by the ultrasonic and electrostatic composite field, the wettability is judged to be good or bad through a large number of procedures of wetting tests, sample photographing and software calibration, the procedures are complex, the test cost is high, and the efficiency is low. The published Chinese patent 201510865787.2 adopts an L-shaped or V-shaped mother board, tests the wettability of the brazing filler metal by the creeping area or distance (height) of the brazing filler metal on the two sides of the L-shaped or V-shaped mother board, but needs to carry out the steps of manufacturing the L-shaped or V-shaped mother board, adding brazing flux, wetting, heat preservation, cooling, measuring the area or distance and the like, and has quite complex process procedures, high cost and very low test efficiency. Patent cn201410707428.x discloses a method for calculating the wetting speed of Sn-based solder and Cu substrate, which establishes a formula of the wetting speed by means of the relationship among the area of the wetting spot, the effective radius of the wetting spot and the time, but the image acquisition, the establishment of a time-wetting spot area relationship curve and a time-wetting spot effective radius relationship curve have huge test workload, poor accuracy and lower calculation efficiency. How to rapidly and efficiently predict the variation trend of the wettability of the brazing filler metal is one of the difficulties in the field of brazing.
the invention content is as follows:
Aiming at the defects and shortcomings of the prior art, the invention provides a method for predicting the wettability of the low-melting-point element regulated brazing filler metal by combining a melting temperature interval containing the low-melting-point element brazing filler metal, the content of the low-melting-point element and a prediction mathematical model, and the wettability of the low-melting-point element regulated brazing filler metal can be rapidly, efficiently and accurately predicted.
In order to achieve the purpose, the invention adopts the following technical scheme:
A method for predicting low-melting-point element regulation brazing filler metal wettability comprises the following steps:
step 1, measuring the content W M percent (mass fraction) of each low-melting-point element in the brazing filler metal;
Step 2, determining a melting temperature interval delta T M of the brazing filler metal;
step 3, expanding the content W M% of different low-melting-point elements in the step 1 by 100 times and respectively substituting the melting temperature interval data Delta T M in the step 2 into a prediction mathematical model S M to obtain a numerical value of S M;
wherein the predictive mathematical model S M is as follows:
in the formula, n is 1, 2 and 3. the brazing filler metal respectively contains one, two and three low-melting-point elements, each low-melting-point element is respectively substituted into a prediction mathematical model according to different contents of the low-melting-point elements, and then the low-melting-point elements are multiplied to obtain a value of S M;
And 4, judging the wettability of the solder according to the value of S M in the step 3, wherein the smaller the value, the better the wettability of the solder, and the worse the wettability.
further, the low melting point element In step 1 of the present invention is any one or two or more of In, Ga, Sn, Rb and P.
Furthermore, the mass percentages of In, Ga, Sn, Rb and P are respectively not more than 15.5%, 6.5%, 25%, 1.3% and 0.9%.
Further, the brazing filler metal is any one of silver-based brazing filler metal, copper-based brazing filler metal and nickel-based brazing filler metal.
Further, the base material used for predicting the wettability of the brazing filler metal in the present invention is any one of austenitic stainless steel, carbon steel and brass.
The invention has the following advantages and beneficial effects:
1) Through a large amount of experimental data, a mathematical model for predicting the wettability of the brazing filler metal is creatively established, only the low-melting-point element content and the brazing filler metal melting temperature range are needed, the influence rule of the low-melting-point elements with different contents on the wettability of the brazing filler metal can be predicted and analyzed, and the method is simple and feasible;
2) The method provided by the invention does not need to carry out any wetting test, calculate the wetting area or wetting angle or wetting force or spreading distance of the brazing filler metal, reduce the test workload and improve the working efficiency;
3) Compared with the traditional solder wettability experiment or prediction or calculation method, the method provided by the invention does not need to purchase wetting test equipment and does not need to use any drawing software or computer system, so that the solder wettability test cost is greatly reduced.
4) The prediction mathematical model established by the invention can be judged only according to the magnitude of the numerical value, the influence amplitude of the low-melting-point element on the wettability of the brazing filler metal is large, and the numerical calculation accuracy is high.
5) the invention successfully constructs a unified relational expression between the melting temperature range, the content of the low-melting-point element and the wettability of the brazing filler metal, and provides a theoretical basis for researching the wettability of the brazing filler metal in related fields.
The specific implementation mode is as follows:
Example 1: a method for predicting the wettability of Sn element regulated silver solder (AgCuZnSn, the Sn content is not more than 6.5%) on the surface of 304 stainless steel comprises the following steps:
Step 1, adopting an XRF-1800 type X-ray fluorescence spectrometer (XRF) to measure the content W M% (mass fraction) of Sn element in the brazing filler metal;
step 2, determining a solder melting temperature interval delta T M by using a thermal analyzer (DSC) model STA449F 3;
And step 3, expanding the content W M% of the low-melting-point element in the step 1 by 100 times and substituting the melting temperature interval data Delta T M in the step 2 into a prediction mathematical model S M.
Since it contains a low-melting-point element, n is 1.
And 4, judging the rule of the influence of the Sn element on the wettability of the solder according to the value of S M in the step 3, wherein the smaller the value, the better the wettability of the solder, and the worse the wettability.
In order to verify the accuracy of the prediction method, 210mg of AgCuZnSn solder is used as a solder, 40mm multiplied by 2.5mm 304 stainless steel is used as a base material, the base material is heated, kept warm and cooled in an RSL-950 wetting furnace, then the wetting area (represented by S and a test result) is measured by CAXA software, and the measured wetting area is compared with the prediction calculation result of the method. Specific data are shown in table 1:
As can be seen from Table 1, the S M value of the AgCuZnSn solder on the surface of 304 stainless steel is gradually reduced with the increase of the Sn content, which shows that the wettability is better and better, the test result shows that the wetting area of the solder is gradually increased with the increase of the Sn content, and the test result is in accordance with the prediction result of the invention.
Example 2: a method for predicting the wettability of an In-regulated silver solder (AgCuZnIn, In content not more than 5.5%) on the surface of 316 stainless steel has the same steps as In example 1.
The specific data are shown in the following table 2:
As can be seen from Table 2, the S M value of the AgCuZnIn solder on the surface of 316 stainless steel is gradually reduced along with the increase of the In content, which shows that the wettability is better and better, and the test result shows that the wetting area of the solder is gradually increased along with the increase of the In content, and the test result is In accordance with the prediction result of the invention.
Example 3: a method for predicting the wettability of Ga-controlled silver solder (AgCuZnGa, Ga content not more than 6.5%) on the surface of H62 brass comprises the same steps as in example 1.
The specific prediction data and test results are shown in table 3 below:
as can be seen from Table 3, the S M value of the AgCuZnGa solder on the surface of H62 brass is gradually reduced with the increase of the Ga content, which shows that the wettability is better and better, and the test result shows that the wetting area of the solder is gradually increased with the increase of the Ga content, and the test result is in accordance with the prediction result of the invention.
Example 4: a method for predicting the wettability of Sn and In element regulated silver solder (AgCuZnSnIn, the content of Sn and In is less than 7.0%) on the surface of H62 brass comprises the following steps:
Step 1, adopting an XRF-1800 type X-ray fluorescence spectrometer (XRF) to measure the content W M% (mass fraction) of Sn and In elements In the silver solder;
Step 2, determining a melting temperature interval delta T M of the silver solder by using a thermal analyzer (DSC) model STA449F 3;
And step 3, expanding the content W M% of the different low-melting-point elements in the step 1 by 100 times and substituting the melting temperature interval data Delta T M in the step 2 into a prediction mathematical model S M.
Since two elements are contained, n is 2.
And 4, judging the rule of the influence of the simultaneous addition of Sn and In elements on the wettability of the solder according to the magnitude of the numerical value S M In the step 3, wherein the smaller the numerical value, the better the wettability of the solder, and the worse the wettability.
The specific data are as follows:
According to the table 4, the S M value of the AgCuZnSnIn brazing filler metal on the surface of H62 brass is gradually reduced along with the increase of the Sn and In contents, which indicates that the wettability is better and better, and the test result shows that the wetting area of the brazing filler metal is gradually increased along with the increase of the Sn and In contents, and the test result is In accordance with the prediction result of the invention.
Example 5: a method for predicting the wettability of Sn and Ga element regulated silver solder (AgCuZnSnGa, Sn + Ga content less than 6.0%) on the surface of 316LN stainless steel has the same steps as example 4.
Specific data are shown in table 5:
As can be seen from Table 5, the S M value of the AgCuZnSnGa solder on the surface of 316LN stainless steel gradually decreases with the increase of the Sn and Ga contents, which shows that the wettability is better and better, and the test result shows that the wetting area of the solder gradually increases with the increase of the Sn and Ga contents, and the test result is in accordance with the prediction result of the invention.
Example 6: a method for predicting the wettability of the silver solder (AgCuZnInGa, In + Ga content less than 6.0%) regulated by the elements In and Ga on the surface of 316LN stainless steel has the same steps as the embodiment 4.
Specific data are shown in table 6:
As can be seen from Table 6, the value of S M of the AgCuZnInGa solder on the surface of 316LN stainless steel is gradually reduced with the increase of the contents of In and Ga, which shows that the wettability is better and better, and the test result shows that the wetting area of the solder is gradually increased with the increase of the contents of In and Ga, which is consistent with the prediction result of the invention.
example 7: a method for predicting the surface wettability of Sn, In and Ga element regulated silver solder (AgCuZnSn, Sn + In + Ga content less than 6.0%) on 316LN stainless steel comprises the following steps:
Step 1, adopting an XRF-1800 type X-ray fluorescence spectrometer (XRF) to measure W M% (mass fraction) of the contents of Sn, In and Ga elements In the silver solder;
Step 2, determining a melting temperature interval delta T M of the silver solder by using a thermal analyzer (DSC) model STA449F 3;
and step 3, expanding the Sn content W M% in the step 1 by 100 times and substituting the melting temperature interval data Delta T M in the step 2 into a prediction mathematical model S M.
Since the brazing filler metal contains three low-melting-point elements, n is 3.
and 4, judging the influence rule of the simultaneous addition of Sn, In and Ga elements on the wettability of the solder according to the magnitude of the numerical value S M In the step 3, wherein the smaller the numerical value, the better the wettability of the solder, and the worse the wettability.
Specific data are shown in table 7:
As can be seen from Table 7, the S M value of the AgCuZnSnInGa solder on the surface of 316LN stainless steel gradually decreases with the increase of the Sn, In and Ga contents, which shows that the wettability is better and better, and the test result shows that the wetting area of the solder gradually increases with the increase of the Sn, In and Ga contents, and the test result is In accordance with the prediction result of the invention.
example 8: a method for predicting the wettability of Rb element regulated silver solder (AgCuZnRb, Rb content not more than 1.3%) on the surface of 304 stainless steel comprises the same steps as in example 1.
specific data are shown in table 8:
according to the results in Table 8, the S M value of the AgCuZnRb brazing filler metal on the surface of 304 stainless steel is gradually reduced along with the increase of the Rb content, which indicates that the wettability is better and better, and the test results show that the wetting area of the brazing filler metal is gradually increased along with the increase of the Rb content, and the test results are consistent with the prediction results of the invention.
example 9: a method for predicting the wettability of a P element-regulated silver solder (AgCuZnP, the P content is not more than 0.9%) on the surface of H62 brass has the same steps as example 1.
specific data are shown in table 9:
According to the results in Table 9, the S M value of the AgCuZnP brazing filler metal on the H62 brass surface is reduced and then increased along with the increase of the P content, which shows that the wettability of the AgCuZnP brazing filler metal is improved and then deteriorated, the test results show that the wetting area of the brazing filler metal is increased and then reduced along with the increase of the P content, and the test results are in accordance with the prediction trend of the invention.
Example 10: the implementation steps of the method for predicting the wettability of the Sn and P element-regulated silver solder (AgCuZnSnP, wherein the Sn content and the P content are respectively not more than 4.5 percent and 0.6 percent) on the surface of H62 brass are the same as those of the embodiment 4.
Specific data are shown in table 10:
According to the results in the table 10, the S M value of the AgCuZnSnP solder on the surface of H62 brass is reduced and then increased along with the increase of the Sn and P contents, which shows that the wettability of the AgCuZnSnP solder is improved and then becomes poor, the test results show that the wetting area of the solder is increased and then reduced along with the increase of the Sn and P contents, and the test results are consistent with the prediction trend of the invention.
example 11: the implementation steps of the method for predicting the wettability of the Sn and Rb element-regulated silver solder (AgCuZnSnRb, wherein the Sn content and the Rb content are respectively not more than 4.0 percent and 0.8 percent) on the surface of 304 stainless steel are the same as those in example 4.
Specific data are shown in table 11:
according to the results in the table 11, the S M value of the AgCuZnSnRb solder on the surface of 304 stainless steel is reduced and then increased along with the increase of the Sn and Rb contents, which shows that the wettability of the AgCuZnSnRb solder is improved and then deteriorated, the test results show that the wetting area of the solder is increased and then reduced along with the increase of the Sn and Rb contents, and the test results are in accordance with the prediction trend of the invention.
Example 12: the implementation steps of the method for predicting the wettability of the Sn, P and Rb element-regulated silver solder (AgCuZnSnPRb, the contents of Sn, P and Rb are respectively not more than 4.0%, 0.6% and 0.6%) on the surface of 304 stainless steel are the same as those in example 7.
Specific data are shown in table 12:
According to the results in Table 12, the S M value of the AgCuZnSnPRb solder on the surface of 304 stainless steel is reduced and then increased along with the increase of the contents of Sn, P and Rb, which shows that the wettability of the AgCuZnSnPRb solder is improved and then deteriorated, the test results show that the wetting area of the solder is increased and then reduced along with the increase of the contents of Sn, P and Rb, and the test results are in accordance with the prediction results of the invention.
example 13: the implementation steps of the method for predicting the wettability of the In and Rb element-regulated silver solder (AgCuZnInRb, wherein the In content and the Rb content are respectively not more than 4.0 percent and 0.9 percent) on the surface of 304 stainless steel are the same as those In the example 4.
specific data are shown in table 13:
According to the results In Table 13, the S M value of the AgCuZnInRb brazing filler metal on the surface of 304 stainless steel is reduced and then increased along with the increase of the In and Rb contents, which shows that the wettability of the AgCuZnInRb brazing filler metal is improved and then deteriorated, the test results show that the wetting area of the brazing filler metal is increased and then reduced along with the increase of the In and Rb contents, and the test results are In accordance with the prediction results of the invention.
example 14: a method for predicting the wettability of an In and P element-regulated silver solder (AgCuZnInP, wherein the In content and the P content are respectively not more than 4.0 percent and 0.6 percent) on the surface of 304 stainless steel is implemented by the same steps as example 4.
Specific data are shown in table 14:
according to the results In Table 14, the S M value of the AgCuZnInP solder on the surface of 304 stainless steel is reduced and then increased along with the increase of the In and P contents, which shows that the wettability of the AgCuZnInP solder is improved and then deteriorated, the test results show that the wetting area of the solder is increased and then reduced along with the increase of the In and P contents, and the test results are In accordance with the prediction results of the invention.
example 15: the implementation steps of the method for predicting the wettability of the In, P and Rb element-regulated silver solder (AgCuZnInPRb, the contents of In, P and Rb are respectively not more than 4.0%, 0.6% and 0.6%) on the surface of 304 stainless steel are the same as those In example 7.
specific data are shown in table 15:
According to the results In Table 15, the S M value of the AgCuZnInPRb solder on the surface of 304 stainless steel is reduced and then increased along with the increase of the contents of In, P and Rb, which shows that the wettability of the AgCuZnInPRb solder is improved and then deteriorated, the test results show that the wetting area of the solder is increased and then reduced along with the increase of the contents of In, P and Rb, and the test results are In accordance with the prediction results of the invention.
Example 16: the implementation steps of the method for predicting the wettability of Ga and Rb element-regulated silver solder (AgCuZnGaRb, the contents of Ga and Rb are respectively not more than 4.05 percent and 0.85 percent) on the surface of 316L stainless steel are the same as those in the example 4.
specific data are shown in table 16:
According to the results in Table 16, the S M value of the AgCuZnGaRb solder on the surface of 316L stainless steel is reduced and then increased along with the increase of the contents of Ga and Rb, which shows that the wettability of the AgCuZnGaRb solder is improved and then deteriorated, the test result shows that the wetting area of the solder is increased and then reduced along with the increase of the contents of Ga and Rb, and the test result is in accordance with the prediction result of the invention.
Example 17: the implementation steps of the method for predicting the wettability of the Ga and P element-regulated silver solder (AgCuZnGaP, the contents of Ga and P are respectively not more than 4.05 percent and 0.6 percent) on the surface of 316L stainless steel are the same as those of the example 4.
specific data are shown in table 17:
from the results in Table 17, it can be seen that the S M value of the AgCuZnGaP solder on the surface of 316L stainless steel is reduced and then increased along with the increase of the contents of Ga and P, which shows that the wettability of the AgCuZnGaP solder is improved and then deteriorated, and the test results show that the wetting area of the solder is increased and then reduced along with the increase of the contents of Ga and P.
Example 18: the implementation steps of the method for predicting the wettability of Ga, P and Rb element-regulated silver solder (AgCuZnGaRb, the contents of Ga, P and Rb are respectively not more than 4.05 percent, 0.6 percent and 0.6 percent) on the surface of Q235 carbon steel are the same as those in example 7.
Specific data are shown in table 18:
from the results in Table 18, it can be seen that the S M value of the AgCuZnGaRb solder on the surface of Q235 carbon steel is reduced and then increased with the increase of the contents of Ga, P and Rb, which indicates that the wettability of the AgCuZnGaRb solder is improved and then deteriorated, and the test results show that the wetting area of the solder is increased and then reduced with the increase of the contents of Ga, P and Rb.
Example 19: a method for predicting the wettability of Rb and P element regulated silver solder (AgCuZnRbP, wherein the Rb content and the P content are respectively not more than 1.05 percent and 0.6 percent) on the surface of 201 stainless steel is the same as the step of example 4.
Specific data are shown in table 19:
according to the results in Table 19, the S M value of the AgCuZnRbP brazing filler metal on the surface of 201 stainless steel is reduced and then increased along with the increase of the content of Rb and P, which shows that the wettability of the AgCuZnRbP brazing filler metal is improved and then deteriorated, the test results show that the wetting area of the brazing filler metal is increased and then reduced along with the increase of the content of Rb and P, and the test results are consistent with the prediction results of the invention.
example 20: the implementation steps of the method for predicting the wettability of the Sn, In and Rb element-regulated silver solder (AgCuZnSnInRb, the contents of Sn, In and Rb are respectively not more than 2.9%, 2.6% and 0.6%) on the surface of H62 brass are the same as those In example 7.
Specific data are shown in table 20:
According to the results In Table 20, the S M value of the AgCuZnSnInRb solder on the H62 brass surface is gradually reduced along with the increase of the Sn, In and Rb contents, which shows that the wettability is better and better, the test results show that the wetting area of the solder is gradually increased along with the increase of the Sn, In and Rb contents, and the test results are In accordance with the prediction results of the invention.
example 21: the implementation steps of the method for predicting the wettability of the Sn, In and P element-regulated silver solder (AgCuZnSnInP solder, the contents of Sn, In and P are respectively not more than 2.9%, 2.0% and 0.6%) on the surface of Q275 carbon steel are the same as those In example 7.
specific data are shown in table 21:
According to the results In Table 21, the S M value of the AgCuZnSnInP solder on the surface of Q275 carbon steel is gradually reduced with the increase of the Sn, In and P contents, which shows that the wettability is better and better, and the test results show that the wetting area of the solder is gradually increased with the increase of the Sn, In and P contents, and the test results are In accordance with the prediction results of the invention.
Example 22: the implementation steps of the method for predicting the wettability of the Ga, Sn and P element-regulated silver solder (AgCuZnGaSnP solder, the contents of Ga, Sn and P are respectively less than 3.0%, 3.0% and 0.6%) on the surface of 304 stainless steel are the same as those in example 7.
Specific data are shown in table 22:
According to the results in Table 22, the S M value of the AgCuZnGaSnP solder on the surface of 304 stainless steel is gradually reduced with the increase of the contents of Ga, Sn and P, which shows that the wettability is better and better, and the test results show that the wetting area of the solder is gradually increased with the increase of the contents of Ga, Sn and P, and the test results are in accordance with the prediction results of the invention.
Example 23: the implementation steps of the method for predicting the wettability of the Ga, Sn and Rb element-regulated silver solder (AgCuZnGaSnRb solder, the contents of Ga, Sn and Rb are respectively less than 3.0%, 3.0% and 0.6%) on the surface of 304 stainless steel are the same as those in example 7.
Specific data are shown in table 23:
According to the results in Table 23, the S M value of the AgCuZnGaSnRb solder on the surface of 304 stainless steel is gradually reduced with the increase of the contents of Ga, Sn and Rb, which shows that the wettability is better and better, and the test results show that the wetting area of the solder is gradually increased with the increase of the contents of Ga, Sn and P, and the test results are in accordance with the prediction results of the invention.
Example 24: the implementation steps of the method for predicting the wettability of the Ga, In and P element-regulated silver solder (AgCuZnGaInP solder, the contents of Ga, In and P are respectively less than 3.0%, 3.0% and 0.6%) on the surface of 201 stainless steel are the same as those In example 7.
Specific data are shown in table 24:
According to the results In Table 24, the S M value of the AgCuZnGaInP solder on the surface of 201 stainless steel is reduced along with the increase of the contents of Ga, In and P, which shows that the wettability is better and better, and the test results show that the wetting area of the solder is gradually increased along with the increase of the contents of Ga, In and P, and the test results are In accordance with the prediction results of the invention.
example 25: the implementation steps of the method for predicting the wettability of Ga, In and Rb element-regulated silver solder (AgCuZnGaInRb solder, the contents of Ga, In and Rb are respectively less than 3.0%, 3.0% and 0.6%) on the surface of 201 stainless steel are the same as those In example 7.
specific data are shown in table 25:
According to the results In Table 25, the S M value of the AgCuZnGaInRb solder on the surface of 201 stainless steel is gradually reduced along with the increase of the contents of Ga, In and Rb, which shows that the wettability is better and better, and the test results show that the wetting area of the solder is gradually increased along with the increase of the contents of Ga, In and Rb, and the test results are In accordance with the prediction results of the invention.
example 26: a method for predicting the wettability of Sn element-regulated copper solder (CuZnSn solder, the Sn content is less than 5%) on the surface of H68 brass is implemented by the same steps as example 1.
specific data are shown in table 26:
According to the results in Table 26, the S M value of the CuZnSn solder on the surface of H68 brass is gradually reduced with the increase of Sn content, which shows that the wettability is better and better, the test result shows that the wetting area of the CuZnSn solder is gradually increased with the increase of Sn content, and the test result is in accordance with the prediction result of the invention.
Example 27: a method for predicting the wettability of a P element-regulated copper solder (CuNiP solder, the content of P is less than 8%) on the surface of H80 brass is implemented by the same steps as example 1.
Specific data are shown in table 27:
according to the results in Table 27, the S M value of the CuNiP brazing filler metal on the surface of H80 brass is gradually reduced with the increase of the P content, which shows that the wettability is better and better, and the test results show that the wetting area of the brazing filler metal is gradually increased with the increase of the P content, and the test results are consistent with the prediction results of the invention.
Example 28: the implementation steps of the method for predicting the wettability of the Sn and P element-regulated copper solder (CuSnP solder, the contents of Sn and P are respectively less than 5 percent and 8 percent) on the surface of H80 brass are the same as those of the embodiment 4.
Specific data are shown in table 28:
According to the results in Table 28, the S M value of the CuSnP brazing filler metal on the surface of H80 brass is reduced and then increased along with the increase of the Sn and P contents, which shows that the wettability of the CuSnP brazing filler metal is improved and then deteriorated, and the test results show that the wetting area of the CuSnP brazing filler metal is increased and then reduced along with the increase of the Sn and P contents.
example 29: the implementation steps of the method for predicting the wettability of the Sn and Rb element regulated nickel solder (NiCrSnRb solder, the contents of Sn and Rb are respectively less than 3 percent and 1.2 percent) on the surface of 304 stainless steel are the same as those of the embodiment 4.
Specific data are shown in table 29:
according to the results in Table 29, the S M value of the NiCrSnRb solder on the surface of 304 stainless steel is reduced and then increased along with the increase of the Sn and Rb contents, which shows that the wettability is improved and then deteriorated, the test results show that the wetting area of the solder is increased and then reduced along with the increase of the Sn and Rb contents, and the test results are in accordance with the prediction results of the invention.
example 30: a method for predicting the wettability of an In-regulated silver solder (AgCuIn, the In content is not less than 10% and not more than 15.5%) on the surface of 316 stainless steel has the same steps as In example 1.
The specific data are shown in table 30 below:
As can be seen from Table 30, the value of S M of the AgCuIn brazing filler metal on the surface of 316 stainless steel is gradually reduced with the increase of the In content, which indicates that the wettability is better and better, and the test result shows that the wetting area of the brazing filler metal is gradually increased with the increase of the In content, and the test result is In accordance with the prediction result of the invention.
Example 31: a method for predicting the wettability of Sn element regulated silver solder (AgCuSn, the Sn content is not less than 10% and not more than 25%) on the surface of 316LN stainless steel has the same steps as example 1.
the specific data are shown in table 31 below:
as can be seen from Table 31, the value of S M of the AgCuSn brazing filler metal on the surface of 316LN stainless steel is gradually increased along with the increase of the Sn content, which indicates that the wettability is better and better, and the test result shows that the wetting area of the brazing filler metal is gradually increased along with the increase of the Sn content, and the test result is in accordance with the prediction result of the invention.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the overall concept of the present invention, and these should also be considered as the protection scope of the present invention.
Claims (5)
1. A method for predicting low-melting-point element to regulate and control the wettability of brazing filler metal is characterized by comprising the following steps: the method comprises the following steps:
step 1, measuring the content W M percent (mass fraction) of each low-melting-point element in the brazing filler metal;
Step 2, determining a melting temperature interval delta T M of the brazing filler metal;
step 3, expanding the content W M% of different low-melting-point elements in the step 1 by 100 times and respectively substituting the melting temperature interval data Delta T M in the step 2 into a prediction mathematical model S M, and multiplying to obtain a numerical value of S M;
Wherein the predictive mathematical model S M is as follows:
In the formula, n is 1, 2 and 3. the brazing filler metal respectively contains one, two and three low-melting-point elements, and each low-melting-point element is respectively substituted into a prediction mathematical model S M according to different contents of the low-melting-point elements and then multiplied to obtain a value of S M;
and 4, judging the wettability of the solder according to the value of S M in the step 3, wherein the smaller the value, the better the wettability of the solder, and the worse the wettability.
2. The method for predicting wettability of a brazing filler metal by a low-melting-point element according to claim 1, wherein: the low melting point element In the step 1 is any one or two or more of In, Ga, Sn, Rb and P.
3. the method for predicting wettability of a brazing filler metal by a low-melting-point element according to claim 1, wherein: the mass percentages of the low-melting-point elements In, Ga, Sn, Rb and P In the step 1 are respectively not more than 15.5%, 6.5%, 25%, 1.3% and 0.9%.
4. the method for predicting wettability of a brazing filler metal by a low-melting-point element according to claim 1, wherein: the brazing filler metal is any one of silver-based brazing filler metal, copper-based brazing filler metal and nickel-based brazing filler metal.
5. the method for predicting wettability of a brazing filler metal by a low-melting-point element according to claim 1, wherein: the base material used for predicting the wettability of the brazing filler metal is any one of austenitic stainless steel, carbon steel and brass.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000111468A (en) * | 1998-09-30 | 2000-04-21 | Fujikura Ltd | Device for measuring solder wettability |
| CN202974803U (en) * | 2012-12-28 | 2013-06-05 | 汕尾市栢林电子封装材料有限公司 | Solder wettability tester |
| CN103128454A (en) * | 2013-02-01 | 2013-06-05 | 河南科技大学 | Method and device for improving wettability of brazing filler metal and method and device thereof for detection experiments |
| CN105699256A (en) * | 2014-11-28 | 2016-06-22 | 中国科学院金属研究所 | A method of calculating a wetting speed for Sn-based solder and a Cu substrate |
-
2017
- 2017-08-24 CN CN201710737899.9A patent/CN107421974B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000111468A (en) * | 1998-09-30 | 2000-04-21 | Fujikura Ltd | Device for measuring solder wettability |
| CN202974803U (en) * | 2012-12-28 | 2013-06-05 | 汕尾市栢林电子封装材料有限公司 | Solder wettability tester |
| CN103128454A (en) * | 2013-02-01 | 2013-06-05 | 河南科技大学 | Method and device for improving wettability of brazing filler metal and method and device thereof for detection experiments |
| CN105699256A (en) * | 2014-11-28 | 2016-06-22 | 中国科学院金属研究所 | A method of calculating a wetting speed for Sn-based solder and a Cu substrate |
Non-Patent Citations (5)
| Title |
|---|
| Ag-Au-Ge 钎料润湿性的研究;崔大田等;《矿冶工程》;20060228;第88-90页 * |
| An alternative thermal approach to evaluate the wettability of solder alloys;W.L.R. Santos et al.;《Applied Thermal Engineering》;20160629;第431-440页 * |
| Zn-Cu-Sn_Bi系锌基高温软钎料的组织与性能;邢飞等;《焊接学报》;20150531;第36卷(第5期);第77-80页 * |
| 低温铝基硬钎料基体成分的计算机辅助设计;董仕节等;《湖北汽车工业学院学报》;19961231;第12-16页 * |
| 电子钎料润湿性测量表征方法研究;孙韡等;《江西师范大学学报》;20050930;第29卷(第5期);第397-399页 * |
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