CN202936475U - Magnetron sputtering device for coating flexible wire surface - Google Patents
Magnetron sputtering device for coating flexible wire surface Download PDFInfo
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- CN202936475U CN202936475U CN 201220663176 CN201220663176U CN202936475U CN 202936475 U CN202936475 U CN 202936475U CN 201220663176 CN201220663176 CN 201220663176 CN 201220663176 U CN201220663176 U CN 201220663176U CN 202936475 U CN202936475 U CN 202936475U
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- flexible wire
- magnetron sputtering
- rolling
- rotating shaft
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Abstract
The utility model discloses a magnetron sputtering device for coating a flexible wire surface, wherein the magnetron sputtering device comprises a loading chamber, a magnetron sputtering coating chamber and a winding room which are connected in vacuum, wherein a first rotating shaft is arranged inside the loading chamber; a second rotating shaft is arranged inside the winding room; the output end of the second rotating shaft is connected with a power device for evenly rotating the second rotating shaft; one end of a flexible wire is arranged on the first rotating shaft; the other end of the flexible wire is fixed on the second rotating shaft; and at least three sputtering targets are evenly distributed in a ring by taking the flexible wire as the center on the magnetron sputtering coating chamber. The flexible wire evenly moves by the rotating shaft which evenly rotates inside the winding room by the flexible wire which orderly penetrates through the loading chamber, the magnetron sputtering coating chamber and the winding room; the flexible wire can be continuously coated; the production efficiency is improved; the flexible wire is coated by a magnetron sputtering coating technology, so that the film is more stable and reliable; and a plurality of spluttering targets are evenly arranged around the flexible wire inside the magnetron sputtering coating chamber, so that the outer surface of the flexible wire can be subjected to complete coating work, and the film is even.
Description
Technical field
The utility model relates to the vacuum coating film equipment technical field, relates in particular to a kind of magnetic control sputtering device for the flexible wire surface coating.
Background technology
The flexible wire general reference has crooked curved wire rod around ability, such as cable, polymkeric substance wire rod, metal wire etc.For wear resistance or erosion resistance or the aesthetics that increases flexible wire, usually surperficial by arc spraying or immersion plating one deck or multilayer resist at flexible wire, have wear-resisting, corrosion-resistant or decorate texts to reach flexible wire.For example, Chinese patent literature CN 1664159 A disclose a kind of " electric arc spraying-coating devcie ", and this device comprises: the wire rod feedway, and it has the promotion delivery section that two spraying plating wire rods are sent; Spray torch, it has described two spraying plating wire rods that relaying sends from described wire rod feedway and is transported to stretching delivery section on workpiece, and carries out arc spraying; Guide pipe, it carries out the conveying guiding of described two spraying plating wire rods between described wire rod feedway and described spray torch, it is characterized in that, the internal diameter of described guide pipe from the connection side of described wire rod feedway to specified length is common internal diameter, from being the internal diameter larger than common internal diameter to the internal diameter to the connection side of described spray torch here.Thus, provide a kind of and can carry the spraying plating wire rod with certain speed all the time, therefore can make the film formed electric arc spraying-coating devcie of uniform spraying plating.Although this device can carry out sputtered film to wire surface, but this apparatus structure is complicated, the less stable of film, can not be attached to for a long time the flexible wire surface, and because wire cross-section is long-pending little, can waste a lot of materials during arc spraying, make production cost high, and bring difficulty for the subsequent disposal depositing materials.
At present, magnetron sputtering technology is the vacuum coating technology method of current widespread use, be widely used in the industrial fields such as optics, microelectronics, wear-resisting, corrosion-resistant, decoration, in order to reliable and stable thin film coating to be provided, can be the characteristic that certain aspect is provided by coated product.Therefore in order to solve the defective of present flexible wire plated film, magnetron sputtering technology can be applied on flexible wire, but present magnetic control sputtering device has following defective: 1, can only be to single individual plated film, as glass, drill bit, mobile phone shell etc., and can not carry out plated film to continuous wire rod; 2, because magnetron sputtering does not possess the diffraction function, single target can only to the single plane plated film, lack multiaspect plated film ability.Therefore need to improve magnetic control sputtering device, could carry out continuous stable plated film to flexible wire.
The utility model content
A purpose of the present utility model is, a kind of magnetic control sputtering device for the flexible wire surface coating is provided, and can realize that magnetron sputtering is carried out on the flexible wire surface is coated with function film, increases the stability of film.
A purpose of the present utility model is, a kind of magnetic control sputtering device for the flexible wire surface coating is provided, and can produce continuously, makes flexible wire energy continuous coating, enhances productivity.
A purpose of the present utility model is, a kind of magnetic control sputtering device for the flexible wire surface coating is provided, and can carry out complete plated film work on the surface of flexible wire, and the even film layer that is coated with.
For reaching above-mentioned purpose, the utility model by the following technical solutions:
a kind of magnetic control sputtering device for the flexible wire surface coating, comprise the load chamber that is used for loading flexible wire to be plated that vacuum is connected, for the magnetron sputtering plating chamber of flexible wire being carried out plated film and for the rolling chamber that the flexible wire of completing plated film is carried out rolling, be provided for the first rotating shaft that flexible wire is unreeled in described load chamber, indoor the second rotating shaft that is provided for the flexible wire rolling of described rolling, the output terminal of described the second rotating shaft is connected with the power set that it is evenly rotated, one end of described flexible wire is arranged in the first rotating shaft, the other end passes described load chamber successively, the magnetron sputtering plating chamber is fixed in the second indoor rotating shaft of described rolling, centered by flexible wire on described magnetron sputtering plating chamber uniform at least three sputtering targets of annular.
Preferably, described magnetron sputtering plating chamber comprises the pretreatment chamber that being used for of setting gradually process the flexible wire surface, a plurality of coating chambers that flexible wire are coated with multilayer film, and the vacuum transition chamber between adjacent coating chamber, the quantity of coating chamber and vacuum transition chamber is to decide according to the rete number that the flexible wire surface is coated with.
A kind of preferred version as the magnetic control sputtering device that is used for the flexible wire surface coating, the First Transition chamber is set between described load chamber and described magnetron sputtering plating chamber, described load chamber arranges the load chamber wire guide near a side in described First Transition chamber, between described rolling chamber and described magnetron sputtering plating chamber, the second adapter cavity is set, described rolling chamber arranges rolling chamber wire guide near a side of described the second adapter cavity.
As a kind of preferred version of the magnetic control sputtering device that is used for the flexible wire surface coating, the center of the center of the center of described load chamber wire guide, the emission of a plurality of sputtering target and rolling chamber wire guide all overlaps with the axial line of described flexible wire.
As a kind of preferred version of the magnetic control sputtering device that is used for the flexible wire surface coating, set gradually heating chamber and the 3rd adapter cavity between described the second adapter cavity and described rolling chamber.
As a kind of preferred version of the magnetic control sputtering device that is used for the flexible wire surface coating, described sputtering target is three, and annular spread is on described magnetron sputtering plating chamber, and these three sputtering targets are consistent with distance between flexible wire.
As a kind of preferred version of the magnetic control sputtering device that is used for the flexible wire surface coating, described sputtering target is four, and annular spread is on described magnetron sputtering plating chamber, and these four sputtering targets are consistent with distance between flexible wire.
As a kind of preferred version of the magnetic control sputtering device that is used for the flexible wire surface coating, described load chamber, First Transition chamber, magnetron sputtering plating chamber, the second adapter cavity, heating chamber, the 3rd adapter cavity and rolling chamber are circular chamber or square chamber or shaped chamber.It is for better distribution sputtering target that circular chamber is adopted in the magnetron sputtering plating chamber, but also can adopt square chamber or shaped chamber, as long as sputtering target to the distance of flexible wire unanimously.
A kind of preferred version as the magnetic control sputtering device that is used for the flexible wire surface coating, also comprise the vacuum pump unit, described vacuum pump unit and described load chamber, First Transition chamber, magnetron sputtering plating chamber, the second adapter cavity, heating chamber, the 3rd adapter cavity or rolling chamber are connected, by the vacuum pump unit, each chamber is vacuumized.
As a kind of preferred version of the magnetic control sputtering device that is used for the flexible wire surface coating, described magnetron sputtering plating is provided for filling the gas distribution system that plated film is used gas on the chamber.
As a kind of preferred version of the magnetic control sputtering device that is used for the flexible wire surface coating, be provided for the snap close of fixing flexible wire in described the second rotating shaft.Snap close herein is in order to guarantee that flexible wire does not come off by the second rotating shaft rotation rolling the time, to guarantee working properly the carrying out of rolling of the second rotating shaft, and can also guarantee that flexible wire by the first rotating shaft and the second rotating shaft tension, guarantees that plated film is even.
The beneficial effects of the utility model are:
1, indoor by flexible wire being located in successively load chamber, magnetron sputtering plating chamber and rolling, and make flexible wire uniformly by the magnetron sputtering plating chamber by the rotating shaft of the indoor even rotation of rolling, continuable like this to the flexible wire plated film, enhance productivity;
2, utilize magnetron sputtering technology to flexible wire vacuum plating, make rete more reliable and more stable;
3, around flexible wire, a plurality of sputtering targets are set evenly magnetron sputtering plating is indoor, can carry out plated film to the complete outside surface of flexible wire, a plurality of sputtering targets are consistent with distance between flexible wire, make the rete that is coated with more even;
4, by between the second adapter cavity and rolling chamber, heating chamber being set, can the flexible wire that plated film is completed be heated, make the rete shaping speed on surface faster, stability is higher.
That contrast prior art, this magnetron sputtering plating chamber have advantages of is simple in structure, easy to operate, 360 degree direction plated films, even film layer and stable, production rate is fast, processing quality is high.
Description of drawings
Fig. 1 is the structural representation of the described magnetic control sputtering device for the flexible wire surface coating of embodiment one;
Fig. 2 is the A-A cross-sectional schematic of magnetron sputtering plating chamber in Fig. 1;
Fig. 3 is the fundamental diagram of embodiment one described magnetic control sputtering device;
Fig. 4 is the structural representation of the described magnetic control sputtering device for the flexible wire surface coating of embodiment two;
Fig. 5 is the B-B cross-sectional schematic of magnetron sputtering plating chamber in Fig. 4;
Fig. 6 is the fundamental diagram of embodiment two described magnetic control sputtering devices.
In figure:
1, load chamber; 2, magnetron sputtering plating chamber; 3, rolling chamber; 4, sputtering target; 5, vacuum pump unit; 6, gas distribution system; 7, First Transition chamber; 8, the second adapter cavity; 9, load chamber wire guide; 10, rolling chamber wire guide; 11, the first rotating shaft; 12, the second rotating shaft; 13, snap close; 14, flexible wire; 15 heating chambers; 16, the 3rd adapter cavity.
Embodiment
Embodiment one:
as shown in Fig. 1～3, the magnetic control sputtering device that is used for the flexible wire surface coating described in this embodiment, comprise the load chamber 1 that sets gradually, magnetron sputtering plating chamber 2 and rolling chamber 3, First Transition chamber 7 is set between load chamber 1 and magnetron sputtering plating chamber 2, between magnetron sputtering plating chamber 2 and rolling chamber 3, the second adapter cavity 8 is set, and load chamber 1, First Transition chamber 7, magnetron sputtering plating chamber 2, the second adapter cavity 8, internal communication between rolling chamber 3, and carry out encapsulation process in the junction, on magnetron sputtering plating chamber 2, vacuum pump unit 5 is set, this vacuum pump unit 5 makes load chamber 1, First Transition chamber 7, magnetron sputtering plating chamber 2, the second adapter cavity 8, be vacuum state in rolling chamber 3, so that normally the carrying out of filming process.
Load chamber 1 is used for loading flexible wire 14 to be plated, the interior rotation of load chamber 1 arranges the first rotating shaft 11, rolling chamber 3 is used for the flexible wire 14 of completing plated film is carried out rolling, rolling chamber 3 is interior arranges the second rotating shaft 12, the second rotating shaft 12 is carried out rotation work by power set, in the present embodiment, power set is motor.
Load chamber 1 arranges load chamber wire guide 9 near a side in First Transition chamber 7, rolling chamber 3 arranges rolling chamber wire guide 10 near a side of the second adapter cavities 8, one end of flexible wire 14 is arranged in the first rotating shaft 11, the rolling chamber wire guide 10 that the other end passes on load chamber wire guide 9 on load chamber 1, First Transition chamber 7, magnetron sputtering plating chamber 2, the second adapter cavity 8, rolling chamber 3 successively is fixed in the second rotating shaft 12 at last, for flexible wire 14 is not come off, be fixedly welded with a snap close 13 in the second rotating shaft 12.
2 is circular chamber in the magnetron sputtering plating chamber, and on it, that 4, four sputtering targets of four sputtering targets 4 are set is consistent to the distance of flexible wire 14 for annular, also is provided for filling plated film with the gas distribution system 6 of gas on magnetron sputtering plating chamber 2.
For the conveniently assemble and disassemble wire rod, all offer chamber door on load chamber 1 and rolling chamber 3, be provided with sealing-ring between chamber door and load chamber 1 and rolling chamber 3, in case leak-stopping gas.
Algorithm:
One, flexible wire 14 to be coated is wound around rolling, and is placed in the first rotating shaft 11;
Two, then an end of flexible wire 14 is extracted out, and passed according to this load chamber wire guide 9 on load chamber 1, First Transition chamber 7, magnetron sputtering plating chamber 2, the second adapter cavity 8, rolling chamber wire guide 10 and be fixed on the snap close 13 of the second rotating shaft 12;
Three, then each chamber of good seal opens vacuum pump unit 5 with the air extraction of inside, makes the inner vacuum state that forms;
Four, open simultaneously 4 pairs of gas distribution system 6 and sputtering targets flexible wire 14 surfaces and carry out plated film, electric motor starting, drive the second rotating shaft 12 and rotate simultaneously, makes flexible wire 14 rolling at the uniform velocity that plated film completes in the second rotating shaft 12;
Five, after the whole plated films of flexible wire 14 in the first rotating shaft 11 are completed, close gas distribution system 6 and sputtering target 4, motor quits work simultaneously, by injecting air in 5 pairs of vacuum chambers of vacuum pump unit;
Six, open rolling chamber 3, the flexible wire 14 that plated film and rolling are completed takes out;
Seven, repeating step one to step 6, carries out repeatedly continuous plated film production.
Embodiment two:
as shown in Fig. 4～6, the magnetic control sputtering device that is used for the flexible wire surface coating described in this embodiment, comprise the load chamber 1 that sets gradually, magnetron sputtering plating chamber 2 and rolling chamber 3, First Transition chamber 7 is set between load chamber 1 and magnetron sputtering plating chamber 2, set gradually the second adapter cavity 8 between magnetron sputtering plating chamber 2 and rolling chamber 3, heating chamber 15, the 3rd adapter cavity 16, and load chamber 1, First Transition chamber 7, magnetron sputtering plating chamber 2, the second adapter cavity 8, heating chamber 15, the 3rd adapter cavity 16, internal communication between rolling chamber 3, and carry out encapsulation process in the junction, vacuum pump unit 5 is set on load chamber 1, this vacuum pump unit 5 makes load chamber 1, First Transition chamber 7, magnetron sputtering plating chamber 2, the second adapter cavity 8, heating chamber 15, the 3rd adapter cavity 16, be vacuum state in rolling chamber 3, so that normally the carrying out of filming process.
Load chamber 1 is used for loading flexible wire 14 to be plated, the interior rotation of load chamber 1 arranges the first rotating shaft 11, rolling chamber 3 is used for the flexible wire 14 of completing plated film is carried out rolling, rolling chamber 3 is interior arranges the second rotating shaft 12, the second rotating shaft 12 is carried out rotation work by power set, in the present embodiment, power set is motor.
Load chamber 1 arranges load chamber wire guide 9 near a side in First Transition chamber 7, rolling chamber 3 arranges rolling chamber wire guide 10 near a side of the 3rd adapter cavities 16, one end of flexible wire 14 is arranged in the first rotating shaft 11, the other end passes successively load chamber wire guide 9 on load chamber 1, First Transition chamber 7, magnetron sputtering plating chamber 2, the second adapter cavity 8, heating chamber 15, the 3rd adapter cavity 16, rolling chamber wire guide 10 and is fixed in the second rotating shaft 12, for flexible wire 14 is not come off, be fixedly welded with a snap close 13 in the second rotating shaft 12.
2 is circular chamber in the magnetron sputtering plating chamber, and on it, that 4, three sputtering targets of three sputtering targets 4 are set is consistent to the distance of flexible wire 14 for annular, also is provided for filling plated film with the gas distribution system 6 of gas on magnetron sputtering plating chamber 2.
For the conveniently assemble and disassemble wire rod, all offer chamber door on load chamber 1 and rolling chamber 3, be provided with sealing-ring between chamber door and load chamber 1 and rolling chamber 3, in case leak-stopping gas.
Algorithm:
One, flexible wire 14 to be coated is wound around rolling, and is placed in the first rotating shaft 11;
Two, then an end of flexible wire 14 is extracted out, and passed according to this load chamber wire guide 9 on load chamber 1, First Transition chamber 7, magnetron sputtering plating chamber 2, the second adapter cavity 8, heating chamber 15, the 3rd adapter cavity 16, rolling chamber wire guide 10 and be fixed in the second rotating shaft 12;
Three, then each chamber of good seal opens vacuum pump unit 5 with the air extraction of inside, makes the inner vacuum state that forms;
Four, open simultaneously 4 pairs of gas distribution system 6 and sputtering targets flexible wire 14 surfaces and carry out plated film, electric motor starting, drive the second rotating shaft 12 and rotate simultaneously, makes flexible wire 14 rolling at the uniform velocity that plated film completes in the second rotating shaft 12;
Five, after the whole plated films of flexible wire 14 in the first rotating shaft 11 are completed, close gas distribution system 6 and sputtering target 4, motor quits work simultaneously, by injecting air in 5 pairs of vacuum chambers of vacuum pump unit;
Six, open rolling chamber 3, the flexible wire 14 that plated film and rolling are completed takes out;
Seven, repeating step one to step 6, carries out repeatedly continuous plated film production.
Sputtering target 4 on magnetron sputtering plating chamber 2 is not limited to described three or four of above-described embodiment, and its quantity is as the criterion with actual needs, and for example, sputtering target also can be five or six.
Magnetron sputtering plating chamber 2 can also be the composite film coating chamber, can comprise the pretreatment chamber that being used for of setting gradually process the flexible wire surface, a plurality of coating chambers that flexible wire are coated with multilayer film, and the vacuum transition chamber between adjacent coating chamber, the quantity of coating chamber and vacuum transition chamber is to decide according to the rete number that the flexible wire surface is coated with.
The shape of load chamber 1, First Transition chamber 7, magnetron sputtering plating chamber 2, the second adapter cavity 8, heating chamber 15, the 3rd adapter cavity 16 and rolling chamber 3 can be circle, also can be for square or be abnormity.It is for better distribution sputtering target 4 that circular chamber is adopted in magnetron sputtering plating chamber 2, but also can adopt square chamber or shaped chamber, as long as sputtering target 4 to the distance of flexible wire 14 unanimously.
Know-why of the present utility model has below been described in conjunction with specific embodiments.These are described just in order to explain principle of the present utility model, and can not be interpreted as by any way the restriction to the utility model protection domain.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present utility model, within these modes all will fall into protection domain of the present utility model.
Claims (10)
1. magnetic control sputtering device that is used for the flexible wire surface coating, it is characterized in that, comprise the load chamber that is used for loading flexible wire to be plated that vacuum is connected, for the magnetron sputtering plating chamber of flexible wire being carried out plated film and for the rolling chamber that the flexible wire of completing plated film is carried out rolling, be provided for the first rotating shaft that flexible wire is unreeled in described load chamber, indoor the second rotating shaft that is provided for the flexible wire rolling of described rolling, the output terminal of described the second rotating shaft is connected with the power set that it is evenly rotated, one end of described flexible wire is arranged in the first rotating shaft, the other end passes described load chamber successively, the magnetron sputtering plating chamber is fixed in the second indoor rotating shaft of described rolling, centered by flexible wire on described magnetron sputtering plating chamber uniform at least three sputtering targets of annular.
2. the magnetic control sputtering device for the flexible wire surface coating according to claim 1, it is characterized in that, the First Transition chamber is set between described load chamber and described magnetron sputtering plating chamber, described load chamber arranges the load chamber wire guide near a side in described First Transition chamber, between described rolling chamber and described magnetron sputtering plating chamber, the second adapter cavity is set, described rolling chamber arranges rolling chamber wire guide near a side of described the second adapter cavity.
3. the magnetic control sputtering device for the flexible wire surface coating according to claim 2, it is characterized in that, the center of the center of the center of described load chamber wire guide, a plurality of sputtering target emission and rolling chamber wire guide all overlaps with the axial line of described flexible wire.
4. the magnetic control sputtering device for the flexible wire surface coating according to claim 2, is characterized in that, sets gradually heating chamber and the 3rd adapter cavity between described the second adapter cavity and described rolling chamber.
5. the magnetic control sputtering device for the flexible wire surface coating according to claim 3, is characterized in that, described sputtering target is three, and annular spread is on described magnetron sputtering plating chamber, and these three sputtering targets are consistent with distance between flexible wire.
6. the magnetic control sputtering device for the flexible wire surface coating according to claim 3, is characterized in that, described sputtering target is four, and annular spread is on described magnetron sputtering plating chamber, and these four sputtering targets are consistent with distance between flexible wire.
7. the magnetic control sputtering device for the flexible wire surface coating according to claim 4, it is characterized in that, described load chamber, First Transition chamber, magnetron sputtering plating chamber, the second adapter cavity, heating chamber, the 3rd adapter cavity and rolling chamber are circular chamber or square chamber or shaped chamber.
8. the magnetic control sputtering device for the flexible wire surface coating according to claim 7, it is characterized in that, also comprise the vacuum pump unit, described vacuum pump unit and described load chamber, First Transition chamber, magnetron sputtering plating chamber, the second adapter cavity, heating chamber, the 3rd adapter cavity or rolling chamber are connected, by the vacuum pump unit, each chamber is vacuumized.
9. according to claim 1～8 arbitrary described magnetic control sputtering devices for the flexible wire surface coating, is characterized in that, described magnetron sputtering plating is provided for filling the gas distribution system that plated film is used gas on the chamber.
10. according to claim 1～8 arbitrary described magnetic control sputtering devices for the flexible wire surface coating, is characterized in that, is provided for the snap close of fixing flexible wire in described the second rotating shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220663176 CN202936475U (en) | 2012-12-05 | 2012-12-05 | Magnetron sputtering device for coating flexible wire surface |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220663176 CN202936475U (en) | 2012-12-05 | 2012-12-05 | Magnetron sputtering device for coating flexible wire surface |
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| Publication Number | Publication Date |
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| CN202936475U true CN202936475U (en) | 2013-05-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201220663176 Expired - Fee Related CN202936475U (en) | 2012-12-05 | 2012-12-05 | Magnetron sputtering device for coating flexible wire surface |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103014641A (en) * | 2012-12-05 | 2013-04-03 | 广东志成冠军集团有限公司 | Magnetron sputtering device for coating flexible wire surface |
| CN112708866A (en) * | 2020-12-23 | 2021-04-27 | 青岛大学 | Flexible substrate continuous coating machine based on magnetron sputtering technology and coating method thereof |
-
2012
- 2012-12-05 CN CN 201220663176 patent/CN202936475U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103014641A (en) * | 2012-12-05 | 2013-04-03 | 广东志成冠军集团有限公司 | Magnetron sputtering device for coating flexible wire surface |
| CN103014641B (en) * | 2012-12-05 | 2015-11-04 | 广东志成冠军集团有限公司 | For the magnetic control sputtering device of flexible wire surface coating |
| CN112708866A (en) * | 2020-12-23 | 2021-04-27 | 青岛大学 | Flexible substrate continuous coating machine based on magnetron sputtering technology and coating method thereof |
| CN112708866B (en) * | 2020-12-23 | 2023-03-28 | 青岛大学 | Flexible substrate continuous coating machine based on magnetron sputtering technology and coating method thereof |
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| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130515 Termination date: 20151205 |
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| EXPY | Termination of patent right or utility model |