CN202927793U - Heat conduction substrate structure used for LED (Light Emitting Diode) lamp - Google Patents
Heat conduction substrate structure used for LED (Light Emitting Diode) lamp Download PDFInfo
- Publication number
- CN202927793U CN202927793U CN2012206153030U CN201220615303U CN202927793U CN 202927793 U CN202927793 U CN 202927793U CN 2012206153030 U CN2012206153030 U CN 2012206153030U CN 201220615303 U CN201220615303 U CN 201220615303U CN 202927793 U CN202927793 U CN 202927793U
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- heat
- lamp
- heat conduction
- conduction substrate
- led lamp
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Abstract
The utility model relates to the field of LED (Light Emitting Diode) illumination, in particular to a heat conduction substrate structure used for an LED lamp. According to the utility model, the heat conduction substrate structure used for the LED lamp is arranged in the LED lamp, the LED lamp comprises a lamp cup, and a lamp cap and a translucent cover which are arranged on both ends of the lamp cup, wherein a circuit board, a radiator and a heat conduction substrate are arranged in the lamp cup in sequence, and LED lamp beads are arranged on the heat conduction substrate; radiating fins, which are corresponding with each other, are respectively arranged on the peripheries of the radiator and the lamp cup, a through heat dissipation channel is formed between the radiating fins, and the heat conduction substrate is provided with a central through hole and multiple screw holes. The heat conduction substrate structure provided by the utility model is applied to heat dissipation of the LED lamp.
Description
Technical field
The utility model relates to the LED lighting field, is specifically related to a kind of heat conduction substrate structure for the LED lamp.
Background technology
Because the LED light fixture has high brightness, the effect such as energy-conservation, use more and more in various occasions, but because the caloric value of LED light source is larger, often need heat radiation to guarantee its normal operation, existing LED light source generally arranges radiator after the LED light source when carrying out heat dissipation design, pass through radiator heat-dissipation, mainly pass through heat loss through radiation on radiator because the LED heat is transmitted to, thereby radiating effect is relatively poor.
The utility model content
The utility model provides a kind of good heat conduction substrate structure that is used for the LED lamp that dispels the heat, and improves by the structure to heat-conducting substrate, to solve the deficiency of prior art.
In order to solve the problems of the technologies described above, heat conduction substrate structure for the LED lamp of the present utility model, be located in the LED lamp, this LED lamp comprises Lamp cup and is installed on lamp holder and the diffuser at Lamp cup two ends, described Lamp cup inside is provided with circuit board, radiator and heat-conducting substrate successively, and heat-conducting substrate is provided with LED lamp pearl.Described radiator and Lamp cup periphery are respectively equipped with the radiating fin of mutual correspondence, form the ventilation slot that connects between described radiating fin, and corresponding ventilation slot forms heat dissipation channel (namely crossing the wind passage).Described heat-conducting substrate offers a central through hole and some screw holes.
Further, described heat-conducting substrate offers some vent openings along all sides, and is concrete, these some vent openings can be semicircle, circular, smaller part is circular, large semi-circular, the perhaps opening of other shapes such as square, trapezoidal.
Further, described central through hole is oval central through hole, offers central through hole, not only can increase area of dissipation, can also save material cost.
Further, described heat-conducting substrate is metal substrate, is preferably aluminium base.Simultaneously, described radiator preferably uses aluminium section bar or aluminium alloy to make.
LED bulb lamp of the present utility model has the radiator of heat radiation fin structure by employing, greatly increased surface area, and form heat dissipation channel between some radiating fins, the perforate that arranges on this heat dissipation channel and Lamp cup forms convection current, form a good heat dissipation channel, greatly increased radiating effect.
Description of drawings
Fig. 1 is the explosive view of LED lamp in embodiment;
Fig. 2 is the structural representation of the heat-conducting substrate in embodiment;
Fig. 3 is the stereogram after the assembling of heat-conducting substrate in embodiment and Lamp cup;
Fig. 4 is the top view after the assembling of heat-conducting substrate in embodiment and Lamp cup.
The specific embodiment
Now with the specific embodiment, the utility model is further illustrated by reference to the accompanying drawings.
As a specific embodiment, as Figure 1-Figure 4, heat conduction substrate structure for the LED lamp of the present utility model, be applied in the LED lamp, this LED lamp comprises Lamp cup 2 and is installed on lamp holder 1 and the diffuser 6 at Lamp cup 2 two ends, Lamp cup 2 inside are provided with circuit board 3, radiator 4 and heat-conducting substrate 5, and heat-conducting substrate 5 is provided with LED lamp pearl 9.Radiator 4 and heat-conducting substrate 5 are by screw 7 lockings.The end of lamp holder 1 also has electrode 8.
Being shaped as of the matrix 41 of radiator 4 is cylindrical, and its matrix 41 peripheries evenly are provided with some radiating fins 42, form heat dissipation channel between some radiating fins 42.Lamp cup 2 peripheries are provided with second radiating fin 21 corresponding with radiating fin 42 equally, and radiating fin 42 and the second radiating fin 21 are mutually corresponding, form the ventilation slot that connects, and corresponding ventilation slot forms heat dissipation channel (namely crossing the wind passage).Above-mentioned radiating fin 42 and the second radiating fin 21 realize increasing area of dissipation by increasing surface area.
Heat-conducting substrate 5 offers the screw hole 52 of an oval-shaped central through hole 51 and 3 assembling use.Heat-conducting substrate 5 offers 3 semicircular vent openings 53 along all sides, certainly this vent openings 53 opening that can also be other shapes.
Wherein, heat-conducting substrate 5 aluminium substrates, radiator 4 aluminium section bars or aluminum alloy materials are made.
Although specifically show and introduced the utility model in conjunction with preferred embodiment; but the those skilled in the art should be understood that; within not breaking away from the spirit and scope of the present utility model that appended claims limits; can make a variety of changes the utility model in the form and details, be protection domain of the present utility model.
Claims (5)
1. a heat conduction substrate structure that is used for the LED lamp, be located in the LED lamp, and this LED lamp comprises Lamp cup and be installed on lamp holder and the diffuser at Lamp cup two ends, and described Lamp cup inside is provided with circuit board, radiator and heat-conducting substrate successively, and heat-conducting substrate is provided with LED lamp pearl; Described radiator and Lamp cup periphery are respectively equipped with the radiating fin of mutual correspondence, form the heat dissipation channel that connects between described radiating fin, and it is characterized in that: described heat-conducting substrate offers a central through hole and some screw holes.
2. heat conduction substrate structure according to claim 1, it is characterized in that: described heat-conducting substrate offers some vent openings along all sides.
3. heat conduction substrate structure according to claim 2, it is characterized in that: described vent openings is semicircle vent openings.
4. heat conduction substrate structure according to claim 1, it is characterized in that: described central through hole is oval central through hole.
5. heat conduction substrate structure according to claim 1, it is characterized in that: described heat-conducting substrate is aluminium base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206153030U CN202927793U (en) | 2012-11-20 | 2012-11-20 | Heat conduction substrate structure used for LED (Light Emitting Diode) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206153030U CN202927793U (en) | 2012-11-20 | 2012-11-20 | Heat conduction substrate structure used for LED (Light Emitting Diode) lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202927793U true CN202927793U (en) | 2013-05-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012206153030U Expired - Fee Related CN202927793U (en) | 2012-11-20 | 2012-11-20 | Heat conduction substrate structure used for LED (Light Emitting Diode) lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202927793U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105402618A (en) * | 2015-12-04 | 2016-03-16 | 江阴乐圩光电股份有限公司 | Led lamp |
-
2012
- 2012-11-20 CN CN2012206153030U patent/CN202927793U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105402618A (en) * | 2015-12-04 | 2016-03-16 | 江阴乐圩光电股份有限公司 | Led lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130508 Termination date: 20151120 |
|
| EXPY | Termination of patent right or utility model |