CN202925123U - Copper-and-nickel plating mirror surface process device for vacuum valve inside nuclear reactor - Google Patents

Copper-and-nickel plating mirror surface process device for vacuum valve inside nuclear reactor Download PDF

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Publication number
CN202925123U
CN202925123U CN 201220555720 CN201220555720U CN202925123U CN 202925123 U CN202925123 U CN 202925123U CN 201220555720 CN201220555720 CN 201220555720 CN 201220555720 U CN201220555720 U CN 201220555720U CN 202925123 U CN202925123 U CN 202925123U
Authority
CN
China
Prior art keywords
vacuum valve
mirror surface
copper
surface process
nuclear reactor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
CN 201220555720
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Chinese (zh)
Inventor
仇士学
张建峰
东永华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nantong Shenhai Science And Industrial Technology Co ltd
Original Assignee
Nantong Shenhai Science And Industrial Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nantong Shenhai Science And Industrial Technology Co ltd filed Critical Nantong Shenhai Science And Industrial Technology Co ltd
Priority to CN 201220555720 priority Critical patent/CN202925123U/en
Application granted granted Critical
Publication of CN202925123U publication Critical patent/CN202925123U/en
Anticipated expiration legal-status Critical
Withdrawn - After Issue legal-status Critical Current

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Abstract

The utility model relates to a copper-and-nickel plating mirror surface process device for a vacuum valve inside a nuclear reactor. The copper-and-nickel plating mirror surface process device is characterized by comprising the vacuum valve, the middle part of which is a hollow cavity, wherein a mirror surface is formed on the inner wall of the hollow cavity of the vacuum valve, fixtures are arranged on the upper end and lower end of the vacuum valve and are fixedly connected with the vacuum valve through bolts, multiple positive poles are arranged in the hollow cavity of the vacuum valve, the tops of the multiple positive poles are fixedly connected with the fixtures, and the multiple positive poles are glued to the mirror surface. The copper-and-nickel plating mirror surface process device has the advantages of ensuring a plating layer of each plane to be uniform and compact by adopting multi-angle multi-positive pole design, being good in coordination and electric conductivity by connection of the bolts and the cavity and ensuring the existence of liquid medicine flowing in the cavity; and the vacuum valve is protected by the fixtures to be prevented from being electroplated.

Description

Vacuum valve plating copper and nickel minute surface process unit in nuclear reactor
Technical field
The utility model relates to vacuum valve plating copper and nickel minute surface process unit in a kind of nuclear reactor, is applicable to the plating copper and nickel surface treatment work of vacuum valve.
Background technology
Vacuum valve is mainly used in the nuclear reactor of civil and military, electroplates to require to be the parcel plating product for the inner chamber plating copper and nickel, because having fluid, passes through this valve cavity, so the smooth finish to electroplating surface has very strict requirement, and existing plating is more crude, can not meet the requirements, vacuum valve because of the first copper facing of needs after nickel plating, the bonding force of coating is difficult point, and is existing relatively poor to the bonding force of copper layer and nickel dam, therefore, for addressing the above problem, the spy provides a kind of new technical scheme.
The utility model content
The purpose of this utility model is to provide vacuum valve plating copper and nickel minute surface process unit in a kind of nuclear reactor.
The technical solution adopted in the utility model is:
Vacuum valve plating copper and nickel minute surface process unit in nuclear reactor, comprise vacuum valve, described vacuum valve middle part is hollow cavity, the hollow cavity inwall of described vacuum valve is provided with minute surface, two ends, described vacuum valve up and down are provided with fixture, are fixedly connected with by mounting block between described fixture and vacuum valve, are provided with many anodes in the hollow cavity of described vacuum valve, described many anode tops are fixedly connected with fixture, and described many anodes and minute surface are fitted.
Described mounting block is bolt.
The utility model has the advantages that: adopt many anode design of multi-angle, guarantee each plane coating even compact; Adopt bolt to be connected with cavity, coordinate conduction good; The protection of vacuum valve frock, resistance plating guarantee to have in cavity liquid to flow simultaneously.
Description of drawings
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of vacuum valve in Fig. 1.
Wherein: 1, vacuum valve, 2, hollow cavity, 3, minute surface, 4, fixture, 5, bolt, 6, anode.
Embodiment
As depicted in figs. 1 and 2, vacuum valve plating copper and nickel minute surface process unit in nuclear reactor of the present utility model, comprise vacuum valve 1, vacuum valve 1 middle part is hollow cavity 2, and hollow cavity 2 inwalls of vacuum valve 1 are provided with minute surface 3, and vacuum valve is provided with fixture 4 in two ends Shang Xia 1, be fixedly connected with by bolt 5 between fixture 4 and vacuum valve 1, be provided with many anodes 6 in the hollow cavity 2 of vacuum valve 1, many anode 6 tops are fixedly connected with the fixture 4 of upper end, and many anodes 6 are fitted with minute surface 3.
The utility model has the advantages that: adopt many anode design of multi-angle, guarantee each plane coating even compact; Adopt bolt to be connected with cavity, coordinate conduction good; The protection of vacuum valve frock, resistance plating guarantee to have in cavity liquid to flow simultaneously.

Claims (2)

1. vacuum valve plating copper and nickel minute surface process unit in nuclear reactor, it is characterized in that: comprise vacuum valve, described vacuum valve middle part is hollow cavity, the hollow cavity inwall of described vacuum valve is provided with minute surface, two ends, described vacuum valve up and down are provided with fixture, are fixedly connected with by mounting block between described fixture and vacuum valve, are provided with many anodes in the hollow cavity of described vacuum valve, described many anode tops are fixedly connected with fixture, and described many anodes and minute surface are fitted.
2. vacuum valve plating copper and nickel minute surface process unit in nuclear reactor according to claim 1, it is characterized in that: described mounting block is bolt.
CN 201220555720 2012-08-28 2012-10-29 Copper-and-nickel plating mirror surface process device for vacuum valve inside nuclear reactor Withdrawn - After Issue CN202925123U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220555720 CN202925123U (en) 2012-08-28 2012-10-29 Copper-and-nickel plating mirror surface process device for vacuum valve inside nuclear reactor

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201220428673 2012-08-28
CN201220428673.3 2012-08-28
CN 201220555720 CN202925123U (en) 2012-08-28 2012-10-29 Copper-and-nickel plating mirror surface process device for vacuum valve inside nuclear reactor

Publications (1)

Publication Number Publication Date
CN202925123U true CN202925123U (en) 2013-05-08

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Family Applications (2)

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CN 201220555720 Withdrawn - After Issue CN202925123U (en) 2012-08-28 2012-10-29 Copper-and-nickel plating mirror surface process device for vacuum valve inside nuclear reactor
CN201210417034.1A Active CN102888633B (en) 2012-08-28 2012-10-29 Process unit for forming copper-plated nickel-plated mirror surface of vacuum valve in nuclear reactor

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201210417034.1A Active CN102888633B (en) 2012-08-28 2012-10-29 Process unit for forming copper-plated nickel-plated mirror surface of vacuum valve in nuclear reactor

Country Status (1)

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CN (2) CN202925123U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102888633A (en) * 2012-08-28 2013-01-23 南通市申海工业技术科技有限公司 Process unit for forming copper-plated nickel-plated mirror surface of vacuum valve in nuclear reactor
CN104818514A (en) * 2015-05-07 2015-08-05 哈尔滨飞机工业集团有限责任公司 Chromium-plated tooling

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110747496B (en) * 2019-11-27 2024-06-21 山西汾西重工有限责任公司 Electroplating tool for truncated cone-shaped thin-wall shell with annular inner cavity reinforcing ribs

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62227100A (en) * 1986-03-28 1987-10-06 Kubota Ltd Method for plating valve body of ball valve
JPS63137196A (en) * 1986-11-28 1988-06-09 Matsushita Refrig Co Device for plating of inner wall of heat transfer pipe
JP4219562B2 (en) * 1999-04-13 2009-02-04 セミトゥール・インコーポレイテッド System for electrochemical processing of workpieces
CN2403792Y (en) * 2000-01-28 2000-11-01 杨聚泰 Apparatus for auxiliary anode spraying zinc liquid electroplating steel conduit inwall
JP5195072B2 (en) * 2008-06-25 2013-05-08 スズキ株式会社 Cylinder block plating apparatus and method
CN201753369U (en) * 2010-03-29 2011-03-02 富葵精密组件(深圳)有限公司 Electroplating device
CN202323071U (en) * 2011-11-15 2012-07-11 大连经济技术开发区大山表面处理有限公司 Hard chromium electroplating device of iron ring inner cavity
CN202925123U (en) * 2012-08-28 2013-05-08 南通市申海工业技术科技有限公司 Copper-and-nickel plating mirror surface process device for vacuum valve inside nuclear reactor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102888633A (en) * 2012-08-28 2013-01-23 南通市申海工业技术科技有限公司 Process unit for forming copper-plated nickel-plated mirror surface of vacuum valve in nuclear reactor
CN102888633B (en) * 2012-08-28 2015-06-17 南通市申海工业技术科技有限公司 Process unit for forming copper-plated nickel-plated mirror surface of vacuum valve in nuclear reactor
CN104818514A (en) * 2015-05-07 2015-08-05 哈尔滨飞机工业集团有限责任公司 Chromium-plated tooling

Also Published As

Publication number Publication date
CN102888633A (en) 2013-01-23
CN102888633B (en) 2015-06-17

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C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20130508

Effective date of abandoning: 20150617

RGAV Abandon patent right to avoid regrant