CN202905791U - OLED panel encapsulation structure - Google Patents
OLED panel encapsulation structure Download PDFInfo
- Publication number
- CN202905791U CN202905791U CN 201220567440 CN201220567440U CN202905791U CN 202905791 U CN202905791 U CN 202905791U CN 201220567440 CN201220567440 CN 201220567440 CN 201220567440 U CN201220567440 U CN 201220567440U CN 202905791 U CN202905791 U CN 202905791U
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- substrate
- oled panel
- cap
- resin
- adhesion agent
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Abstract
The utility model provides an OLED panel encapsulation structure which comprises a substrate, an encapsulation cover and an adhesion agent between the substrate and the encapsulation cover. The adhesion agent is used for bonding the substrate and the encapsulation cover together; the adhesion agent includes a flexible state and the flexible adhesion agent is curable under certain conditions; and the adhesion agent of the OLED panel encapsulation structure is formed by curing the coated flexible adhesion agent. The OLED panel encapsulation structure has the following beneficial effects: the problems of insufficient bonding force or oxygen and moisture permeation after bonding due to the unsmooth edge of the glass encapsulation cover are overcome by using UV resin as the adhesion agent, the bonding force between the substrate and the encapsulation cover is larger due to the scattered UV resin; and the yield of OLED products is improved.
Description
Technical field
The utility model belongs to OLED encapsulation technology field, is specifically related to a kind of encapsulating structure of oled panel.
Background technology
In flat panel display, many merits such as display is frivolous with it for Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED), active illuminating, fast-response speed, wide viewing angle, rich color and high brightness, low-power consumption, high-low temperature resistant and to be known as by industry be third generation Display Technique after liquid crystal display (LCD).Active OLED(ActiveMatrix OLED, AMOLED) be also referred to as active matrix OLED, AMOLED is because driving by integrated thin-film transistor (TFT) and capacitor in each pixel and by the method that capacitor is kept voltage, thereby can realize large scale, resolution panels, be the emphasis of current research and the developing direction of following Display Technique.
The encapsulation of OLED of the prior art is by making cap with glass (Glass) or metal-made, described packaged glass (ENCAP Glass) lid by and substrate (Substrate) between be bonded together and realize encapsulation to OLED.Fig. 1 is existing two-layer oled panel encapsulating structure, and its mesexine is cap, and bottom is substrate, and described cap is in the same place with base plate bonding; Fig. 2 is the cutaway view of Fig. 1, and it is cap at the middle and upper levels, and bottom is substrate, and the edge of intermediate representation cap namely is used for the limit with base plate bonding.But usually because the limit of cap non-linear, make bonding not firm between cap and the substrate even may make packed organic material oxidized or be subjected to the impact of moisture.
The utility model content
The purpose of this utility model is to cause easily the thoroughly wet deficiency that affects luminous organic material and then cause the OLED quality to descend of oxygen and moisture because the cap adhesion strength is low in order to solve existing OLED encapsulation, has proposed a kind of oled panel encapsulating structure.
The technical solution of the utility model is: a kind of oled panel encapsulating structure, comprise substrate and cap, and characterized by further comprising the adhesive between substrate and the cap, described adhesive is used for described substrate and cap are bonded together;
Described adhesive comprises flexible state, and the adhesive of described flexible state can solidify under certain condition;
The adhesive of described oled panel encapsulating structure is to be cured by the flexible adhesives that is coated with to form.
Above-mentioned adhesive is the UV resin, and the viscosity of described UV resin is 200cP, and described UV resin can solidify under the irradiation of ultraviolet light.
Above-mentioned UV resin for substrate and cap are bonded together intersperses among between substrate and the cap by interval strip or the spot shape of 10 μ m.
The beneficial effects of the utility model: a kind of oled panel encapsulating structure of the present utility model, by using the UV resin as adhesive, overcome the saturating wet problem of the inadequate or bonding rear oxygen flow of bonding force that causes because of the edge out-of-flatness of glass packaging lid, UV resin by dispersive distribution makes the bonding dynamics of substrate and cap larger simultaneously, and then the yield of OLED product is risen.
Description of drawings
The existing OLED encapsulating structure of Fig. 1 schematic diagram.
The existing OLED encapsulating structure of Fig. 2 cutaway view.
Fig. 3 is OLED encapsulating structure schematic diagram of the present utility model.
Fig. 4 is OLED encapsulating structure cutaway view of the present utility model.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the utility model is further elaborated.
The purpose of this programme provides a kind of encapsulating structure of oled panel so that use the oled panel of this encapsulating structure can effectively prevent the not oxidized impact with being subjected to humidity of organic substance of oled panel.
The encapsulating structure of a kind of oled panel of present embodiment as shown in Figure 3, comprises substrate and cap, characterized by further comprising the adhesive between substrate and the cap, and described adhesive is used for described substrate and cap are bonded together;
Described adhesive comprises flexible state, and the adhesive of described flexible state can solidify under certain condition;
The adhesive of described oled panel encapsulating structure is to be cured by the flexible adhesives that is coated with to form.
Above-mentioned adhesive is the UV resin, and the viscosity of described UV resin is 200cP, and described UV resin can solidify under the irradiation of ultraviolet light.
Above-mentioned UV resin for substrate and cap are bonded together intersperses among between substrate and the cap by interval strip or the spot shape of 10 μ m.
As shown in Figure 3, the top layer is cap, and bottom is substrate, the UV resin of intermediate layer for filling; Fig. 4 is the cutaway view of Fig. 3, and it is the top layer of corresponding diagram 3 at the middle and upper levels.
Those of ordinary skill in the art will appreciate that embodiment described here is in order to help reader understanding's principle of the present utility model, should to be understood to that protection range of the present utility model is not limited to such special statement and embodiment.Those of ordinary skill in the art can make various other various concrete distortion and combinations that do not break away from the utility model essence according to disclosed these technology enlightenments of the utility model, and these distortion and combination are still in protection range of the present utility model.
Claims (3)
1. an oled panel encapsulating structure comprises substrate and cap, characterized by further comprising the adhesive between substrate and the cap, and described adhesive is used for described substrate and cap are bonded together;
Described adhesive comprises flexible state, and the adhesive of described flexible state can solidify under certain condition;
The adhesive of described oled panel encapsulating structure is to be cured by the flexible adhesives that is coated with to form.
2. a kind of oled panel encapsulating structure according to claim 1 is characterized in that described adhesive is the UV resin, and the viscosity of described UV resin is 200cP, and described UV resin can solidify under the irradiation of ultraviolet light.
3. a kind of oled panel encapsulating structure according to claim 2 is characterized in that described UV resin for substrate and cap are bonded together intersperses among between substrate and the cap by interval strip or the spot shape of 10 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220567440 CN202905791U (en) | 2012-10-31 | 2012-10-31 | OLED panel encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220567440 CN202905791U (en) | 2012-10-31 | 2012-10-31 | OLED panel encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202905791U true CN202905791U (en) | 2013-04-24 |
Family
ID=48126420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220567440 Expired - Fee Related CN202905791U (en) | 2012-10-31 | 2012-10-31 | OLED panel encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202905791U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014180038A1 (en) * | 2013-05-06 | 2014-11-13 | 深圳市华星光电技术有限公司 | Method for detecting oled panel packaging effect |
| US9171497B2 (en) | 2013-05-06 | 2015-10-27 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Method for inspecting packaging effectiveness of OLED panel |
-
2012
- 2012-10-31 CN CN 201220567440 patent/CN202905791U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014180038A1 (en) * | 2013-05-06 | 2014-11-13 | 深圳市华星光电技术有限公司 | Method for detecting oled panel packaging effect |
| US9171497B2 (en) | 2013-05-06 | 2015-10-27 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Method for inspecting packaging effectiveness of OLED panel |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130424 Termination date: 20201031 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |