CN202905780U - Connection structure for LED optical module and radiator - Google Patents
Connection structure for LED optical module and radiator Download PDFInfo
- Publication number
- CN202905780U CN202905780U CN 201220602649 CN201220602649U CN202905780U CN 202905780 U CN202905780 U CN 202905780U CN 201220602649 CN201220602649 CN 201220602649 CN 201220602649 U CN201220602649 U CN 201220602649U CN 202905780 U CN202905780 U CN 202905780U
- Authority
- CN
- China
- Prior art keywords
- led chip
- heat conduction
- radiator
- heat
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
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Abstract
The utility model discloses a connection structure for an LED optical module and a radiator. The connection structure comprises a heat conduction substrate and a LED chip base; the heat conduction substrate and a heat conduction column are fixedly connected via a heat conduction bolt; a through hole is processed on the LED chip base, and the bore diameter of the through hole is larger than the outer diameter of the head part of the heat conduction bolt; an LED chip is welded in the through hole of the LED chip base; the bottom plane of the LED chip and the head part surface of the heat conduction bolt are fit together; and the heat conduction substrate and the LED chip base are fit together. The connection structure for an LED optical module and a radiator has the advantages of quick heat conduction, high heat radiation efficiency, low manufacturing cost and wide application range.
Description
Technical field
The utility model relates to a kind of syndeton, refers in particular to the syndeton of a kind of LED optics module and radiator.
Background technology
As everyone knows, LED lamp heat dissipation capacity is large, if heat radiation is not smooth, perhaps radiator structure is unreasonable, will have a strong impact on performance and the useful life of LED lamp.
The utility model content
Problem to be solved in the utility model is the deficiency that overcomes in the background technology, provides the syndeton of a kind of LED optics module and radiator, this radiator structure, the heat that guarantees led chip in time conducts, this structure heat conduction is fast, and radiating efficiency is high, low cost of manufacture.
For addressing the above problem, the utility model is taked following technical scheme:
The syndeton of LED optics module of the present utility model and radiator, comprise heat-conducting substrate and led chip base, heat-conducting substrate and heating column are fixed together by the heat conduction screw, be processed with through hole on the described led chip base, its aperture is greater than the head outer diameter of heat conduction screw, led chip is welded in the through hole of led chip base, the head surface of the baseplane of described led chip and heat conduction screw fits together, heat-conducting substrate and led chip base fit together, and guarantee that the heat of led chip in time and fast conducts.
A corrective measure of this programme is, in through hole, scribbles heat-conducting metal glue between the head surface of the baseplane of led chip and heat conduction screw.
The syndeton of a kind of LED optics module of the present utility model and radiator, owing to having adopted the baseplane of led chip and the head surface of heat conduction screw to fit together, heat-conducting substrate and led chip base fit together, guaranteed that heat in time and fast conducts, so this syndeton, heat conduction is fast, and radiating efficiency is high, has low cost of manufacture, advantage applied widely.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
As shown in Figure 1, the syndeton of a kind of LED optics module of the present utility model and radiator, comprise heat-conducting substrate 1 and led chip base 2, heat-conducting substrate 1 and heating column 12 are fixed together by heat conduction screw 11, be processed with through hole 21 on the described led chip base 2, its aperture is greater than the head outer diameter of heat conduction screw 11, and led chip 22 is welded in the through hole 21 of led chip base 2, and the head surface of the baseplane of described led chip 22 and heat conduction screw 11 fits together.
In through hole 21, between the head surface of the baseplane of led chip 22 and heat conduction screw 11, scribble heat-conducting metal glue.
Described heat-conducting substrate 1 and led chip base 2 fit together.
Claims (3)
1. the syndeton of a LED optics module and radiator, comprise heat-conducting substrate (1) and led chip base (2), it is characterized in that: heat-conducting substrate (1) and heating column (12) are fixed together by heat conduction screw (11), be processed with through hole (21) on the described led chip base (2), its aperture is greater than the head outer diameter of heat conduction screw (11), led chip (22) is welded in the through hole (21) of led chip base (2), and the head surface of the baseplane of described led chip (22) and heat conduction screw (11) fits together.
2. the syndeton of a kind of LED optics module according to claim 1 and radiator, it is characterized in that: in through hole (21), between the head surface of the baseplane of led chip (22) and heat conduction screw (11), scribble heat-conducting metal glue.
3. the syndeton of a kind of LED optics module according to claim 1 and radiator, it is characterized in that: described heat-conducting substrate (1) and led chip base (2) fit together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220602649 CN202905780U (en) | 2012-11-11 | 2012-11-11 | Connection structure for LED optical module and radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220602649 CN202905780U (en) | 2012-11-11 | 2012-11-11 | Connection structure for LED optical module and radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202905780U true CN202905780U (en) | 2013-04-24 |
Family
ID=48126411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220602649 Expired - Fee Related CN202905780U (en) | 2012-11-11 | 2012-11-11 | Connection structure for LED optical module and radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202905780U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811629A (en) * | 2012-11-11 | 2014-05-21 | 顾仁法 | Connection structure for LED (Light Emitting Diode) optical module and radiator |
-
2012
- 2012-11-11 CN CN 201220602649 patent/CN202905780U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811629A (en) * | 2012-11-11 | 2014-05-21 | 顾仁法 | Connection structure for LED (Light Emitting Diode) optical module and radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160408 Address after: 4, building 518000, building H, Tai Wan Industrial Park, Shiyan Road, Shiyan City, Guangdong, Baoan District, Shenzhen Patentee after: SHENZHEN KINLIGHT TECHNOLOGY CO., LTD. Address before: 214107 Jiangsu city of Wuxi Province Yang Jian Zhen Wan Shan Cun Zhang Geng Xiang Xi Xishan District No. 19 Patentee before: Gu Renfa |
|
| DD01 | Delivery of document by public notice |
Addressee: SHENZHEN KINLIGHT TECHNOLOGY CO., LTD. Document name: Notification to Pay the Fees |
|
| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: SHENZHEN KINLIGHT TECHNOLOGY CO., LTD. Document name: Notification of Termination of Patent Right |
|
| DD01 | Delivery of document by public notice | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130424 Termination date: 20181111 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |