CN202839561U - Semiconductor grain placing die frame - Google Patents
Semiconductor grain placing die frame Download PDFInfo
- Publication number
- CN202839561U CN202839561U CN 201220406640 CN201220406640U CN202839561U CN 202839561 U CN202839561 U CN 202839561U CN 201220406640 CN201220406640 CN 201220406640 CN 201220406640 U CN201220406640 U CN 201220406640U CN 202839561 U CN202839561 U CN 202839561U
- Authority
- CN
- China
- Prior art keywords
- die frame
- semiconductor grain
- semiconductor
- framed
- grain placing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The utility model relates to an appliance of the semiconductor production technology field, especially to a semiconductor grain placing die frame, comprising a die frame body on which a groove is arranged. The semiconductor grain placing die frame is characterized in that the die frame body is formed by pressing and extending an iron sheet, and the thickness of the die frame body is between 3 mm and 5 mm, so that the semiconductor grain placing die frame has the advantages of being convenient in use, high in production efficiency and low in cost, and being easy to place grain.
Description
Technical field
The utility model relates to the apparatus in semiconductor fabrication techniques field, specifically relates to a kind of semiconductor grain and puts framed.
Background technology
In the prior art, it is the framework that steel plate cuts into that semiconductor grain is put framed, and such framework height is higher, because semiconductor grain is less, crystal grain is not easy to be placed in the groove, has the low shortcoming of production efficiency during use.
Summary of the invention
The purpose of this utility model is exactly for above-mentioned shortcoming, provides a kind of semiconductor grain easy to use, that production efficiency is high, crystal grain is easily put to put framed.
The technical solution of the utility model is achieved in that a kind of semiconductor grain puts framedly, comprises framed body, has groove on the framed body, and it is characterized in that: described framed body is that the iron sheet calendering forms.
Further say, the thickness of described framed body is 3-5 millimeters.
The beneficial effects of the utility model are: such semiconductor grain put framed have advantages of easy to use, production efficiency is high, crystal grain is easily put, cost is low.
Description of drawings
Fig. 1 is that the utility model semiconductor grain is put framed structural representation.
Wherein: 1, framed body.
Embodiment
The utility model will be further described below in conjunction with accompanying drawing.
As shown in Figure 1, a kind of semiconductor grain is put framed, comprises framed body 1, has groove on the framed body 1, it is characterized in that: described framed body is that the iron sheet calendering forms.
Further say, the thickness of described framed body is 3-5 millimeters.
Claims (2)
1. a semiconductor grain is put framedly, comprises framed body, has groove on the framed body, and it is characterized in that: described framed body is that the iron sheet calendering forms.
2. semiconductor grain according to claim 1 is put framedly, and it is characterized in that: the thickness of described framed body is 3-5 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220406640 CN202839561U (en) | 2012-08-16 | 2012-08-16 | Semiconductor grain placing die frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220406640 CN202839561U (en) | 2012-08-16 | 2012-08-16 | Semiconductor grain placing die frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202839561U true CN202839561U (en) | 2013-03-27 |
Family
ID=47951203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220406640 Expired - Fee Related CN202839561U (en) | 2012-08-16 | 2012-08-16 | Semiconductor grain placing die frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202839561U (en) |
-
2012
- 2012-08-16 CN CN 201220406640 patent/CN202839561U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 Termination date: 20130816 |