CN202259199U - Porcelain plate for manufacturing semiconductor devices - Google Patents

Porcelain plate for manufacturing semiconductor devices Download PDF

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Publication number
CN202259199U
CN202259199U CN201120380436XU CN201120380436U CN202259199U CN 202259199 U CN202259199 U CN 202259199U CN 201120380436X U CN201120380436X U CN 201120380436XU CN 201120380436 U CN201120380436 U CN 201120380436U CN 202259199 U CN202259199 U CN 202259199U
Authority
CN
China
Prior art keywords
porcelain plate
groove
plate body
sides
semiconductor devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201120380436XU
Other languages
Chinese (zh)
Inventor
陈建民
陈建卫
陈磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henan Hongchang Electronics Co Ltd
Original Assignee
Henan Hongchang Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henan Hongchang Electronics Co Ltd filed Critical Henan Hongchang Electronics Co Ltd
Priority to CN201120380436XU priority Critical patent/CN202259199U/en
Application granted granted Critical
Publication of CN202259199U publication Critical patent/CN202259199U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to the technical field of manufacturing of semiconductors, in particular to a porcelain plate for manufacturing semiconductor devices. The porcelain plate comprises a porcelain plate body, and two sides of the porcelain plate body are provided with raised edges, raised points or grooves for holding crystal. According to a better scheme, intra-groove raised edges and intra-groove raised points are arranged in the grooves of the two sides of the porcelain plate body. The porcelain plate has the advantages that the production efficiency is higher and a mounting surface is not required to be identified in the semiconductor device manufacturing process.

Description

Make the porcelain plate of semiconductor device
Technical field
The utility model relates to technical field of manufacturing semiconductors, specifically relates to make the porcelain plate of semiconductor device.
Background technology
Semiconductor device is welded on crystal block and processes on the porcelain plate; More firm for what crystal block and porcelain plate were combined; On porcelain plate, have irregular structure or place the groove of crystal block, in the prior art, so irregular structure or the groove of placing crystal block are in a side of porcelain plate; Have the shortcoming of the trouble of installing, influenced production efficiency.
Summary of the invention
The purpose of the utility model is exactly to above-mentioned shortcoming, provides that a kind of production efficiency is higher, the porcelain plate of the manufacturing semiconductor device that need not distinguish installed surface,
The technical scheme that the utility model is taked is such, makes the porcelain plate of semiconductor device, comprises the porcelain plate body, it is characterized in that: the groove of all using protruding rib, raised points or placement crystal block in the both sides of porcelain plate body.
Preferable technical scheme is: in the groove of the both sides of porcelain plate body, barring of groove convex and groove convex starting point are arranged.
The beneficial effect of the utility model is: such porcelain plate has an advantage that production efficiency is higher, need not distinguish installed surface in making the semiconductor device process.
Description of drawings
Fig. 1 makes the structural representation of the porcelain plate of semiconductor device for the utility model.
Wherein: 1, porcelain plate body 2, groove 3, the barring of groove convex
Embodiment
Below in conjunction with accompanying drawing the utility model is described further.
As shown in Figure 1, the porcelain plate of manufacturing semiconductor device comprises porcelain plate body 1, it is characterized in that: the groove 2 of all using protruding rib, raised points or placement crystal block in the both sides of porcelain plate body 1.
Preferable technical scheme is: groove convex barring 3 and groove convex starting point are arranged in the groove 1 of the both sides of porcelain plate body, and opposite side is invisible not to be shown, opposite side is identical with the demonstration side.

Claims (2)

1. make the porcelain plate of semiconductor device, comprise the porcelain plate body, it is characterized in that: the groove of all using protruding rib, raised points or placement crystal block in the both sides of porcelain plate body.
2. porcelain plate according to claim 1 is characterized in that: in the groove of the both sides of porcelain plate body, barring of groove convex and groove convex starting point are arranged.
CN201120380436XU 2011-09-23 2011-09-23 Porcelain plate for manufacturing semiconductor devices Expired - Fee Related CN202259199U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201120380436XU CN202259199U (en) 2011-09-23 2011-09-23 Porcelain plate for manufacturing semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201120380436XU CN202259199U (en) 2011-09-23 2011-09-23 Porcelain plate for manufacturing semiconductor devices

Publications (1)

Publication Number Publication Date
CN202259199U true CN202259199U (en) 2012-05-30

Family

ID=46120398

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201120380436XU Expired - Fee Related CN202259199U (en) 2011-09-23 2011-09-23 Porcelain plate for manufacturing semiconductor devices

Country Status (1)

Country Link
CN (1) CN202259199U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120530

Termination date: 20120923