CN202835907U - Flexible magnetic strip gluing-type semiconductor refrigeration device - Google Patents
Flexible magnetic strip gluing-type semiconductor refrigeration device Download PDFInfo
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- CN202835907U CN202835907U CN 201220505722 CN201220505722U CN202835907U CN 202835907 U CN202835907 U CN 202835907U CN 201220505722 CN201220505722 CN 201220505722 CN 201220505722 U CN201220505722 U CN 201220505722U CN 202835907 U CN202835907 U CN 202835907U
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- semiconductor refrigeration
- flexible magnetic
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- magnetic strips
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Abstract
The utility model discloses a flexible magnetic strip gluing-type semiconductor refrigeration device which comprises a direct current power supply connector, semiconductor refrigeration pieces, guide wires, a flexible base body and flexible magnetic strips. The semiconductor refrigeration pieces are in serial connection through the guide wires, the head semiconductor refrigeration piece and the tail semiconductor refrigeration piece are connected with the direct current power supply connector through the guide wires, all the semiconductor refrigeration pieces are embedded in the flexible base body, and the edge of the flexible base body is composed of the flexible magnetic strips. When the direct current power supply connector is communicated with an external power supply, electric currents are supplied to the semiconductor refrigeration pieces through the guide wires. Then the semiconductor refrigeration pieces absorb heat at a cold end and release the heat from a hot end, and a refrigeration effect of the cold end is achieved. The flexible base body is attached to a surface with metal through the flexible magnetic strips, and therefore the semiconductor refrigeration pieces are fixed to the surface. The device can be effectively attached to the surface with the metal, installation and disassembly are convenient and reliable, refrigeration effects are achieved, and wide practical value is achieved.
Description
Technical field
The utility model belongs to the semiconductor refrigerating field, is specifically related to a kind of flexible magnetic strips attaching type semiconductor cooling device.
Background technology
Steam compression type refrigeration circulation and Adsorption Refrigeration Cycles are two kinds of mainstream technologys in air conditioner refrigerating field, have higher refrigerating capacity.But the volume of two kinds of systems is large especially, and certain noise is arranged, and particularly, the noise of steam compression type refrigeration circulation is very large, and cold-producing medium has more or less destruction to ozone layer, has destroyed regional ecological environment.
The principle of semiconductor refrigerating technology is Charles Bell note effect.Charles Bell note effect has been explained a special natural phenomena of Circuits System, when two kinds of metals form a pair of thermocouple, behind the logical upper direct current, will produce the heat absorption and release phenomenon at an even node place, and the direction of heat absorption and release is determined by galvanic direction.Semiconductor P-N knot has strong heat absorption and release effect, can produce local refrigeration or heats.Therefore, semiconductor refrigerating technology has certain industry and commercial value, can lower the temperature to structures such as Circuits System.In recent years, semiconductor refrigerating technology development.Although the ability of semiconductor refrigerating is less,, semiconductor chilling plate thickness is very thin, volume is very little, noiselessness, pollution-free, has steam compression type refrigeration circulation and the incomparable advantage of Adsorption Refrigeration Cycles.Therefore, at certain special occasions, semiconductor refrigerating technology is more useful than traditional air-conditioning technicals such as steam compression type refrigeration circulation and Adsorption Refrigeration Cycles.
Semiconductor chilling plate has a cold junction and a hot junction, and in order to lower the temperature to object, cold junction must fit tightly with object, perhaps reduces the purpose that temperature is reached for the object cooling in an airtight space.Usually, semiconductor chilling plate is fixed on the surface of object to be lowered the temperature by binding agent or screw etc.Obviously, these fixed forms are limited to very much, and both external sights of ectocrine cause again the inconvenience of installation and removal.
In fact, in a lot of the application, people only wish that semiconductor chilling plate is adsorbed on the surface to be lowered the temperature simply, and, need installation, convenient disassembly.For this reason, structure or the device in the urgent need to proposing novel semiconductor refrigerating.
Summary of the invention
The purpose of this utility model is for the deficiencies in the prior art, a kind of flexible magnetic strips attaching type semiconductor cooling device is provided, and this device can be fitted with the metal surface effectively, and installation and removal are convenient and reliable, thereby reach refrigeration, have widely practical value.
The utility model comprises dc source joint, semiconductor chilling plate, wire, flexible substrate, flexible magnetic strips; Be connected with series system by wire between a plurality of semiconductor chilling plates, and two semiconductor chilling plates of head and the tail are connected with the dc source joint by wire, all semiconductor chilling plates all are embedded in the flexible substrate, and the edge of flexible substrate is made of flexible magnetic strips.
Described semiconductor chilling plate is a kind of multilayer circuit structure that is comprised of semiconductor and metallic conduction material, the one side of cooling piece is that cold junction, another side are the hot junctions, its operation principle is Peltier effect, namely, P-type semiconductor and N-type semiconductor connected node place are a pair of special thermocouple, after passing into DC current, the direction that passes into because of direct current is different, will produce at galvanic couple node place a large amount of heat absorption and release phenomenons.Be connected with series system by wire between a plurality of semiconductor chilling plates, and two semiconductor chilling plates of head and the tail are connected with the dc source joint by wire, all semiconductor chilling plates all are embedded in the flexible substrate, and the edge of flexible substrate is made of flexible magnetic strips.
Behind dc source joint and extraneous power connection, electric current is the semiconductor chilling plate power supply through wire.Then, semiconductor chilling plate discharges with the heat absorption of cold junction and from its hot junction, reaches the effect of cold junction refrigeration, flexible substrate by flexible magnetic strips can with the metallic surface applying, thereby semiconductor chilling plate is fixed on this surface.Simultaneously, flexible substrate has certain heat-blocking action, can avoid heat to spread by flexible substrate.Except the effect of fitting with the metal surface, flexible magnetic strips is the Packed effect of tool also, prevents that hot-air from entering cold junction, affects refrigeration.
The beneficial effects of the utility model explanation:
(1) semiconductor chilling plate has larger rigidity, adopts a plurality of semiconductor chilling plates to be embedded on the flexible substrate, can improve the flexibility of whole device, reaches the effect with dimpling or nick application of a surface;
(2) magnetic stripe can fully be fitted with smooth metal surface, can not guarantee refrigerating plant is adsorbed on this surface, and prevent from carrying out convection current between the air in the space that hot outside and magnetic stripe seal, has improved refrigeration;
(3) this device is easy to use, and fitting in easy and metal surface, also takes off from the metal surface easily, do not injure the metal surface structure;
(4) compare with absorption type refrigerating with steam compression type refrigeration, the volume of semiconductor refrigerating mechanism is little, noiselessness, friction, has certain technical advantage, is applicable to special refrigeration occasion.In the applications such as automobile, has potential using value.
Description of drawings
Fig. 1 is the utility model schematic diagram;
Fig. 2 is the flexible effect schematic diagram of the utility model;
Fig. 3 is the application schematic diagram of the utility model on automobile;
Among the figure, dc source joint 1, semiconductor chilling plate 2, wire 3, flexible substrate 4, flexible magnetic strips 5.
The specific embodiment
Below, the utility model is described in further detail by reference to the accompanying drawings.
As shown in Figure 1, flexible magnetic strips attaching type semiconductor cooling device comprises dc source joint 1, a plurality of semiconductor chilling plate 2, wire 3, flexible substrate 4, flexible magnetic strips 5;
Be connected with series system by wire 3 between a plurality of semiconductor chilling plates 2, and two semiconductor chilling plates 2 of head and the tail are connected with dc source joint 1 by wire, all semiconductor chilling plates 2 all are embedded in the flexible substrate 4, and the edge of flexible substrate 4 is made of flexible magnetic strips 5.
Behind dc source joint 1 and extraneous power connection, electric current is semiconductor chilling plate 2 power supplies through wire 3.Then, semiconductor chilling plate 2 discharges with the heat absorption of cold junction and from its hot junction, reaches the effect of cold junction refrigeration.The principle of semiconductor refrigerating technology is Charles Bell note effect, namely, when two kinds of metals form a pair of thermocouple, behind the logical upper direct current, to produce the heat absorption and release phenomenon at an even node place, the direction of heat absorption and release determines by galvanic direction, and semiconductor P-N knot has strong heat absorption and release effect, can produce local refrigeration or heats.Flexible substrate 4 by flexible magnetic strips 5 can with fit with metallic surface, thereby semiconductor chilling plate 2 is fixed on this surface.Simultaneously, flexible substrate 4 has certain heat-blocking action, can avoid heat to pass through flexible substrate 4 diffusions.Except the effect of fitting with the metal surface, flexible magnetic strips 5 is the Packed effect of tool also, prevents that hot-air from entering cold junction, affects refrigeration.
Shown in Fig. 2 (a), 2 (b), Fig. 2 (a) is the open and flat schematic diagram of magnetic stripe attaching type semiconductor cooling device; Fig. 2 (b) is shape schematic diagram after the bending of magnetic stripe attaching type semiconductor cooling device.The flexible substrate of magnetic stripe attaching type semiconductor cooling device allows semiconductor chilling plate and contiguous semiconductor chilling plate to form that certain is arbitrarily angled, thereby makes whole device and the application of a surface with dimpling or nick, improves refrigeration.
As shown in Figure 3, the steel plate materials adhesive of flexible magnetic strips 5 and vehicle window frame is fitted flexible substrate 4 and automotive window; After dc source joint 1 and vehicle power are connected, electric current is semiconductor chilling plate 2 power supplies through wire 3, heat on the cold junction suction automobile windowpane of semiconductor chilling plate 2, and from its hot junction release, reduced the temperature of vehicle window, and then reduced the interior temperature of Automobile, be reached for the effect of automobile refrigerating.
Claims (1)
1. flexible magnetic strips attaching type semiconductor cooling device comprises dc source joint, semiconductor chilling plate, wire, flexible substrate, flexible magnetic strips, it is characterized in that:
Be connected with series system by wire between a plurality of semiconductor chilling plates, and two semiconductor chilling plates of head and the tail are connected with the dc source joint by wire, all semiconductor chilling plates all are embedded in the flexible substrate, and the edge of flexible substrate is made of flexible magnetic strips;
Described semiconductor chilling plate is a kind of multilayer circuit structure that is comprised of semiconductor and metallic conduction material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220505722 CN202835907U (en) | 2012-09-28 | 2012-09-28 | Flexible magnetic strip gluing-type semiconductor refrigeration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220505722 CN202835907U (en) | 2012-09-28 | 2012-09-28 | Flexible magnetic strip gluing-type semiconductor refrigeration device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202835907U true CN202835907U (en) | 2013-03-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220505722 Expired - Lifetime CN202835907U (en) | 2012-09-28 | 2012-09-28 | Flexible magnetic strip gluing-type semiconductor refrigeration device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202835907U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102901266A (en) * | 2012-09-28 | 2013-01-30 | 杭州电子科技大学 | Flexible magnetic strip attached type semiconductor refrigeration device |
-
2012
- 2012-09-28 CN CN 201220505722 patent/CN202835907U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102901266A (en) * | 2012-09-28 | 2013-01-30 | 杭州电子科技大学 | Flexible magnetic strip attached type semiconductor refrigeration device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130327 |