CN202826103U - Silicon block cutting device - Google Patents
Silicon block cutting device Download PDFInfo
- Publication number
- CN202826103U CN202826103U CN 201220533565 CN201220533565U CN202826103U CN 202826103 U CN202826103 U CN 202826103U CN 201220533565 CN201220533565 CN 201220533565 CN 201220533565 U CN201220533565 U CN 201220533565U CN 202826103 U CN202826103 U CN 202826103U
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- China
- Prior art keywords
- guide wheel
- silico briquette
- wire
- cutter sweep
- line body
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Abstract
The utility model discloses a silicon block cutting device which is used for cutting a silicon block into silicon slices. The silicon block cutting device comprises at least two guide wheels and wire bodies, wherein a plurality of wire grooves which are even in density are arranged on the outer side surface of each guide wheel, the wire bodies are sequentially arranged in the wire grooves in a spiral winding mode to form a top wire net and a bottom wire net which do not intersect, the distance between every two adjacent wire grooves of the guide wheel at the wire paying-off end is longer than the distance between every two adjacent wire grooves of the guide wheel at the wire winding-up end, the wire paying-off end is an end where the wire bodies move away from the guide wheels relatively, and the wire winding-up end is an end where the wire bodies are coiled in the guide wheels relatively. According to the silicon block cutting device, trapezoidal wire nets are formed, and therefore the thickness deviation of cutting of the silicon slices can be reduced, and the silicon block cutting device is high in practicability and simple and feasible in structural design.
Description
Technical field
The utility model relates to the silico briquette manufacture field, relates in particular to a kind of silico briquette cutter sweep.
Background technology
At present, in the silico briquette slice process of field of solar energy, adopt line cutting technology more.The conventional mode that parallel nets-mortar cuts that adopts as shown in Figure 1.The principle of this mode is: steel wire 1 order is wrapped on two guide wheels at least, forms parallel nets.Wherein, establish the uniform wire casing of slot pitch on the guide wheel, and the cable slot on each guide wheel is apart from equating that all wire casing is used for accommodating steel wire 1.Slurry nozzle arranges the both sides of silico briquette 2, and it is sprayed on mortar on the parallel nets, and guide wheel rotary actuation steel wire 1 drives mortar in the silico briquette 2, grinding and cutting silico briquette 2.Simultaneously, silico briquette 2 relative gauzes slowly pass parallel nets, then pass through the grinding cutting processing, silico briquette 2 cuttings are made the silicon chip of same thickness.
In cutting process, when adopting the mode of parallel nets-mortar cutting, cutting abrasive material on the steel wire 1 exists certain wearing and tearing, be mainly manifested in the steel wire 1 at unwrapping wire end guide wheel place and the steel wire 1 at take-up end guide wheel place, the steel wire 1 cutting abrasive wear at unwrapping wire end guide wheel place is little, cause silicon chip 2 thickness relatively thin, on the contrary the steel wire 1 at take-up end guide wheel place.
Thereby, 2 cuttings produce varied in thickness to the steel wire 1 at unwrapping wire end guide wheel and take-up end guide wheel place to silicon chip inevitably, section also can increase by thickness with the minimizing of abrasive material, cause the silicon wafer thickness that makes inconsistent, this also is that the silicon chip integral thickness changes the main cause of (total thickness variation is called for short TTV).
At present, the TTV value of the most of silicon chips that cut in this way is between 15-40 μ m, and the TTV value is defective above 30 μ m in the industry.Therefore, this silico briquette cutter sweep also has improved space.
The utility model content
The purpose of this utility model is a kind of silico briquette cutter sweep that reduces the cutting silicon wafer thickness deviation.
In order to solve the problems of the technologies described above, the utility model provides a kind of silico briquette cutter sweep, be used for silico briquette is processed into silicon chip, comprise at least two guide wheels and line body, the outer surface of described guide wheel arranges the wire casing of some even densities, described line body successively helical form around being arranged in the described wire casing, consist of the gauze of disharmony of QI of the upper and the lower fork, it is characterized in that, the cable slot of unwrapping wire end guide wheel apart from value greater than the cable slot of take-up end guide wheel apart from value, described unwrapping wire end is respectively described line body relative separation and the relative line end that is involved in described guide wheel with described take-up end.Described trapezoidal gauze as shown in Figure 2.Those skilled in the art should know that described up/down state is under the use state, and the gauze of conventional direction definition is with respect to the position of silico briquette cutter sweep.
Wherein, described line body is one or more, during wiring every respectively successively helical form around being arranged in the different described wire casings.
Wherein, the outline of the figure of adjacent two described guide wheels and described gauze formation therebetween is trapezoidal.
Wherein, the described trapezoidal right-angled trapezium that comprises, isosceles trapezoid.
Wherein, described silico briquette cutter sweep is established one group of described guide wheel, and one group of described guide wheel is two cylinders, and described cylinder can be pressed specific direction and rotate under drive unit, and its central axis is parallel to each other and all be parallel to horizontal plane.
Wherein, described silico briquette cutter sweep is established two or more sets described guide wheels, and every group of described guide wheel is two cylinders, and described cylinder can be pressed specific direction and rotate under drive unit, and every group of described cylindrical central axis is parallel to each other and all be parallel to horizontal plane.
Wherein, the body direction of motion along the line, the figure that the described cylindrical kernel of section axle point that is linked in sequence successively consists of is trapezoidal.
Wherein, described line body comprises steel wire or diamond wire.
Wherein, described silico briquette cutter sweep also comprises slurry nozzle, and described slurry nozzle is established a plurality of, lays respectively at described silico briquette both sides.
The utility model adopts the guide wheel of different slots distance to arrange gauze, and wherein, unwrapping wire end guide wheel is large slot pitch guide wheel, take-up end guide wheel be sulculus apart from guide wheel, adjacent two guide wheels are trapezoidal with the outline of therebetween described gauze.Adopt effectively wearing and tearing and the disengaging of free stock material on Avoids or reduces when cutting line body of device of the present utility model, and the silicon chip integral thickness that causes changes, thereby reach and significantly reduce silicon chip integral thickness changing value (total thickness variation, abbreviation TTV) effect, make the average T TV value of silicon chip, remain on below the 8-10 μ m.
Description of drawings
Fig. 1 is existing parallel nets schematic diagram;
Fig. 2 is the trapezoidal gauze schematic diagram that the utility model adopts;
Fig. 3 is the structural representation of the utility model embodiment 1;
Fig. 4 is the structural representation of the utility model embodiment 2.
The specific embodiment
Referring to Fig. 3, a kind of silico briquette cutter sweep 100 that present embodiment provides is used for grinding and cutting silico briquette 200.Pallet 110 glueds joint in silico briquette 200 tops, is used for fixedly silico briquette 200.
Silico briquette cutter sweep 100 comprises the first guide wheel 10, the second guide wheel 11, line body 20 and slurry nozzle 30.
The first guide wheel 10 and two cylinders of described the second guide wheel 11 for being set up in parallel, these two cylindrical kernel of section axis are parallel to each other and all be parallel to horizontal plane.On the periphery of the first guide wheel 10 and the second guide wheel 11, establish the wire casing of some even densities, its slot pitch value is respectively the first setting value and the second setting value.In the present embodiment, the first guide wheel 10 and the second guide wheel 11 all rotate along the clockwise direction among the figure, and the first guide wheel 10 is unwrapping wire end guide wheel, and the second guide wheel 11 is take-up end guide wheel, and the unwrapping wire end is respectively line body relative separation and the relative line end that is involved in guide wheel with the take-up end.The first setting value is 360 μ m, and the second setting value is 320 μ m.
During 20 wiring of line body, helical form forms up and down two gauzes around on the wire casing that is arranged on the first guide wheel 10 and the second guide wheel 11 successively.Line body 20 can be pressed specific direction and rotate under the drive of the first guide wheel 10 and the second guide wheel 11, and then drives 31 pairs of silico briquettes of mortar 200 and carry out grinding and cutting, and silico briquette 200 is arranged in the gauze that line body 20 consists of.In the present embodiment, the first guide wheel 10 and the second guide wheel 11 are isosceles trapezoid with the outline of the figure that the gauze of every line body therebetween consists of.In other embodiments, because the length that makes silicon chip is much larger than thickness, the first guide wheel 10 and the second guide wheel 11 also can be irregular with the outline of the figure that the gauze of every line body therebetween consists of, and comprise right-angled trapezium.In the present embodiment, line body 20 is a steel wire, and what line body 20 can be under the drive of the first guide wheel 10 and the second guide wheel 11 indicates in by figure moves clockwise.Among other embodiment, steel wire can adopt diamond wire to substitute, and line body 20 also can be many, and helical form is around being arranged in the different wire casings successively for every line body, and adjacent two guide wheels are trapezoidal with the outline of the figure that the gauze of every line body therebetween consists of.Described up/down state is under the use state, the definition of conventional direction.
The both sides of silico briquette 200 are located at described slurry nozzle 30 intervals, are used for spraying mortar 31, and silico briquette 200 is carried out grinding and cutting.
In the present embodiment, establish a silico briquette 200, two trapezoidal gauzes cut it up and down, and wherein silico briquette 200 is between the first guide wheel 10 and the second guide wheel 11, and slurry nozzle 30 is disposed on the both sides of silico briquette 200.During 100 running of silico briquette cutter sweep, silico briquette 200 moves downward by direction as shown in the figure, line body 20 under the driving of the first guide wheel 10 and the second guide wheel 11, in the direction of the clock motion, mortar is driven in the silico briquette 200, realized the grinding and cutting process to silico briquette 200.Embodiment 2
Referring to Fig. 4, present embodiment provides a kind of silico briquette cutter sweep 300, is used for cutting silico briquette 400, and pallet 310 glueds joint in silico briquette 400 tops, is used for fixedly silico briquette 400 in cutting process.
Silico briquette cutter sweep 300 comprises the first guide wheel 210, the second guide wheel 211, the 3rd guide wheel 212, four guide idler 213, line body 220 and slurry nozzle 230.Axis is parallel to each other and all is parallel to the cylinder of horizontal plane centered by the first guide wheel 210, the second guide wheels, 211, the three guide wheels 212 and the four guide idler 213.The body direction of motion along the line, their figure of kernel of section axle point formation of being linked in sequence successively is rectangle.In other embodiments, described figure also can be trapezoidal.
On the periphery of the first guide wheel 210, the second guide wheel 211, the 3rd guide wheel 212 and four guide idler 213, establish the wire casing of some even densities, and their slot pitch value is respectively the first setting value, the second setting value, the 3rd setting value and the 4th setting value.In the present embodiment, the first guide wheel 210, the second guide wheel 211, the 3rd guide wheel 212 and four guide idler 213 all rotate along the clockwise direction among the figure, the first guide wheel 210 is unwrapping wire end guide wheel, the second guide wheel 211 is take-up end guide wheel, the 3rd guide wheel 212 is unwrapping wire end guide wheel, four guide idler 213 is take-up end guide wheel, and the unwrapping wire end is respectively line body relative separation and the relative line end that is involved in guide wheel with the take-up end.The first setting value is greater than described the second setting value, and described the 3rd setting value is greater than described the 4th setting value.In the present embodiment, the first setting value is 360 μ m, and the second setting value is 320 μ m, and the 3rd setting value is 360 μ m, and the 4th setting value is 320 μ m.
During line body 220 wiring, successively around on the wire casing that is arranged on the first guide wheel 210, the second guide wheels, 211, the three guide wheels 212 and four guide idler 213, up and down four gauzes of formation wherein can be used for cutting two gauzes up and down of being of silico briquette 400.Line body 220 can be pressed specific direction and rotate under the drive of the first guide wheel 210, the second guide wheel 211, the 3rd guide wheel 212 and four guide idler 213, and then drives 231 pairs of silico briquettes of mortar 400 and carry out grinding and cutting, and described silico briquette 400 is arranged in the gauze that line body 220 consists of.In the present embodiment, the outline of the figure that the gauze of adjacent two guide wheels and its top-stitching body consists of is isosceles trapezoid.In other embodiments, because the silicon chip length that makes is much larger than thickness, thickness error is less with respect to length, and the outline of figure also can be irregular, comprises right-angled trapezium.In the present embodiment, line body 220 is a steel wire, and line body 220 can rotate along the clockwise direction shown in the figure under the drive of the first guide wheel 210, the second guide wheel 211, the 3rd guide wheel 212 and four guide idler 213.Among other embodiment, steel wire can adopt diamond wire to substitute, and line body 20 also can be many, and helical form is around being arranged in the different wire casings successively for every line body, and adjacent two guide wheels are trapezoidal with the outline of the figure that the gauze of every line body therebetween consists of.Described up/down state is under the normal condition, and gauze is with respect to the position of silico briquette cutter sweep.Described up/down state is under the use state, the definition of conventional direction.
The both sides of silico briquette 400 are located at described slurry nozzle 230 intervals, are used for spraying mortar 231, and silico briquette 400 is carried out grinding and cutting.
In the present embodiment, establish four silico briquettes 400, two gauzes cut it up and down.Wherein two silico briquettes 400 are between the first guide wheel 210 and the second guide wheel 211, and two other silico briquette 400 is between the 3rd guide wheel 212 and four guide idler 213, and slurry nozzle 230 is disposed on the both sides of silico briquette 400.During 300 running of silico briquette cutter sweep, silico briquette 400 is by moving downward shown in the figure, and line body 220 by moving clockwise shown in the figure, drives mortar in the silico briquette 400 under the driving of four guide wheels, has realized the grinding and cutting process to silico briquette 400.
To sum up, in the silico briquette cutter sweep of above-mentioned two embodiment, if guide wheel is respectively 2 and 4, in other embodiments, guide wheel can be more than 2 groups, every group of guide wheel is two cylinders, and described cylinder can be pressed specific direction and rotate under drive unit, and every group of cylindrical central axis is parallel to each other and all be parallel to horizontal plane.The body direction of motion along the line, the figure that the described cylindrical kernel of section axle point that is linked in sequence successively consists of is trapezoidal, preferred, this figure is rectangle.Adjacent per two guide wheels and gauze therebetween, the outline of formation figure is trapezoidal, slurry nozzle all can be set to carry out the silico briquette cutting in gauze.
Embodiment of the present utility model, utilize the guide wheel of different slots distance to arrange gauze, the slot pitch value of unwrapping wire end guide wheel is greater than the slot pitch value of take-up end guide wheel, thereby so that the outline of adjacent two guide wheels and gauze therebetween is trapezoidal, effectively Avoids or reduces the wearing and tearing of free stock material and the variation of the silicon chip integral thickness that disengaging causes on when cutting line body, make the average T TV value of silicon chip, remain on below the 8-10 μ m.
The above is preferred embodiment of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also are considered as protection domain of the present utility model.
Claims (9)
1. silico briquette cutter sweep, be used for silico briquette is processed into silicon chip, comprise at least two guide wheels and line body, the outer surface of described guide wheel arranges the wire casing of some even densities, described line body successively helical form consists of the gauze of disharmony of QI of the upper and the lower fork around being arranged in the described wire casing, it is characterized in that, the cable slot of unwrapping wire end guide wheel apart from value greater than the cable slot of take-up end guide wheel apart from value, described unwrapping wire end is respectively described line body relative separation and the relative line end that is involved in described guide wheel with described take-up end.
2. a kind of silico briquette cutter sweep as claimed in claim 1 is characterized in that, described line body is one or more, during wiring every respectively successively helical form around being arranged in the different described wire casings.
3. a kind of silico briquette cutter sweep as claimed in claim 1 is characterized in that, the outline of the figure that adjacent two described guide wheels and described gauze therebetween consist of is trapezoidal.
4. a kind of silico briquette cutter sweep as claimed in claim 3 is characterized in that, described trapezoidal right-angled trapezium, the isosceles trapezoid of comprising.
5. a kind of silico briquette cutter sweep as claimed in claim 1, it is characterized in that described silico briquette cutter sweep is established one group of described guide wheel, one group of described guide wheel is two cylinders, described cylinder can be pressed specific direction and rotate under drive unit, its central axis is parallel to each other and all be parallel to horizontal plane.
6. a kind of silico briquette cutter sweep as claimed in claim 1, it is characterized in that, described silico briquette cutter sweep is established two or more sets described guide wheels, every group of described guide wheel is two cylinders, described cylinder can be pressed specific direction and rotate under drive unit, every group of described cylindrical central axis is parallel to each other and all be parallel to horizontal plane.
7. a kind of silico briquette cutter sweep as claimed in claim 6 is characterized in that, the body direction of motion along the line, and the figure that the described cylindrical kernel of section axle point that is linked in sequence successively consists of is trapezoidal.
8. a kind of silico briquette cutter sweep as claimed in claim 1 is characterized in that, described line body comprises steel wire or diamond wire.
9. a kind of silico briquette cutter sweep as claimed in claim 1 is characterized in that, described silico briquette cutter sweep also comprises slurry nozzle, and described slurry nozzle is established a plurality of, lays respectively at described silico briquette both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220533565 CN202826103U (en) | 2012-10-18 | 2012-10-18 | Silicon block cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220533565 CN202826103U (en) | 2012-10-18 | 2012-10-18 | Silicon block cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202826103U true CN202826103U (en) | 2013-03-27 |
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ID=47937889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220533565 Expired - Fee Related CN202826103U (en) | 2012-10-18 | 2012-10-18 | Silicon block cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202826103U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102950659A (en) * | 2012-10-18 | 2013-03-06 | 江西赛维Ldk太阳能高科技有限公司 | Silicon block cutting device |
-
2012
- 2012-10-18 CN CN 201220533565 patent/CN202826103U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102950659A (en) * | 2012-10-18 | 2013-03-06 | 江西赛维Ldk太阳能高科技有限公司 | Silicon block cutting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130327 Termination date: 20191018 |
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| CF01 | Termination of patent right due to non-payment of annual fee |