CN202814620U - Separated type pressure sensor - Google Patents
Separated type pressure sensor Download PDFInfo
- Publication number
- CN202814620U CN202814620U CN 201220330883 CN201220330883U CN202814620U CN 202814620 U CN202814620 U CN 202814620U CN 201220330883 CN201220330883 CN 201220330883 CN 201220330883 U CN201220330883 U CN 201220330883U CN 202814620 U CN202814620 U CN 202814620U
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- box
- circuit
- shell
- sensing head
- pressure sensing
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Abstract
The utility model discloses a separated type pressure sensor, comprising a pressure sensing head and a circuit box, wherein the pressure sensing head is connected with the circuit box through a shielding cable, the pressure sensing head comprises a base, a support, a housing, an adaptor plate and a film chip, the pressure sensing head is provided with a longitudinally-symmetrical structure, the circuit box comprises a box bottom and a box housing, the box housing is fixed at both ends of the box bottom, the box bottom is fixedly provided with a circuit board, and the box housing is provided with an electric connector. The separated type pressure sensor can perform real temperature compensation in real time on a super-high temperature medium, a super-low temperature medium or a medium with temperature sharply changed.
Description
Technical field
The utility model relates to sensor, particularly a kind of split type pressure transducer.
Background technology
Some as the guided missile high-temperature fuel gas spray the pressure survey of moment, pressure survey equitemperature drastic change occasion when the ultralow temperature medium fills tank, extremely low or the high and drastic change of a kind of not Yin Wendu of active demand and cause output error, the accuracy that impact is measured, energy is real-time, the split type pressure transducer of true temperature compensation.
Traditionally, the temperature compensation of pressure transducer generally be by the conventional method (such as Fig. 1) of series and parallel resistance on the presser sensor electric bridge carry out in real time, truly temperature compensation.The method has normally been sacrificed output sensitivity, the precision and stability of sensor, compensation effect is relatively poor, and the compensation difficulty is large, cost is high, often needs repeated multiple times compensation, test, just can obtain only compensating resistance resistance, simultaneously, compensating resistance under high, low temperature and jump in temperature environment, itself also can bring certain inefficacy may, develop a kind of split type pressure transducer for the energy real-time temperature compensation, have vital role for the pressure survey of these special occasions.
At present, for the medium of high, extremely low or jump in temperature, develop a kind of energy split type pressure transducer real-time, true, accurately temperature compensation and have important social value and economic outlook.
Summary of the invention
Technical problem to be solved in the utility model is, and is not enough for prior art, provide a kind of can to high, utmost point low temperature or the jump in temperature medium carries out truly, the split type pressure transducer of real-time temperature compensation.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: a kind of split type pressure transducer, comprise pressure sensing head and circuit box, the pressure sensing head is connected with circuit box by shielded cable, described pressure sensing head comprises pedestal, support, shell, card extender, thin film chip, and shell is fixed on the pedestal, and support, card extender and thin film chip are fixed in the enclosure space of pedestal and shell composition, support one end is connected with pedestal, and the other end is connected with card extender; Thin film chip one side is fixed on the pedestal, and opposite side is connected with card extender; Described pressure sensing head becomes up and down symmetrical structure; At the bottom of described circuit box comprises box, the box shell, the box shell is fixed on two ends at the bottom of the box, is fixed with circuit board at the bottom of the box, the box shell is provided with electric connector; Shielded cable one end is fixed on the pressure sensing head shell, and the other end is connected with electric connector; Described thin film chip comprises the platinum film resistor for preparing on the Wheatstone bridge for preparing on the strain regions and the non-strain regions.
Described circuit board comprises power circuit, amplifying circuit and filtering circuit, and power circuit is connected with amplifying circuit, Wheatstone bridge, and amplifying circuit is connected with filtering circuit, Wheatstone bridge, platinum film resistor.
The utility model is owing to be used for the non-strain regions that the reference temperature resistance of temperature compensation is arranged on sensing chip for sensor, be in the same temperature field with strain bridge, solved traditional sensors thermo-compensator and strain bridge and be not in the compensation invalidity problem that same temperature field causes; Amplifying circuit presses in the line function combinatorial operation with the pressure survey feeble signal of Wheatstone bridge output and the temperature measurement signal of platinum film resistor output, finish to the Wheatstone bridge signal in real time, truly, reliably temperature compensation, solved the sacrifice output sensitivity of traditional resistor network temperature compensation, compensate not real-time, compensate repeatedly the shortcoming that cost is high; The split-type design of circuit box and sensing head has guaranteed that sensor can be in superelevation, low temperature and jump in temperature environment; The utility model reliability is high, has improved production efficiency.
Description of drawings
Fig. 1 is this traditional pressure sensor temperature supplementary circuitry structural drawing;
Fig. 2 is the split type pressure sensor structure synoptic diagram of the utility model one embodiment;
Fig. 3 is the utility model one embodiment presser sensor head inner structure synoptic diagram;
Fig. 4 is the utility model one embodiment thin film chip sectional view;
Fig. 5 is the utility model one embodiment circuit box inner structure synoptic diagram;
Fig. 6 is the utility model one embodiment board circuit schematic diagram;
Wherein:
1: the pressure sensing head; 2: circuit box; 3: shielded cable; 11: pedestal; 12: thin film chip; 13: enameled wire; 14: support; 15: screw; 16: card extender; 17: shell; 18: trip bolt; 121: Wheatstone bridge; 122: platinum film resistor; 31: at the bottom of the box; 32: circuit board; 33: screw; 34: the box shell; 35: screw thread; 36: the quad seal pad; 221: power circuit; 222: amplifying circuit; 223: filtering circuit.
Embodiment
Such as Fig. 2-shown in Figure 5, the utility model one embodiment comprises pressure sensing head and circuit box, the pressure sensing head is connected with circuit box by shielded cable, described pressure sensing head comprises pedestal, support, shell, card extender, thin film chip, shell is fixed on the pedestal, support, card extender and thin film chip are fixed in the enclosure space of pedestal and shell composition, and support one end is connected with pedestal, and the other end is connected with card extender; Thin film chip one side is fixed on the pedestal, and opposite side is connected with card extender by enameled wire; Described pressure sensing head becomes up and down symmetrical structure; At the bottom of described circuit box comprises box, the box shell, the box shell is fixed on two ends at the bottom of the box, is fixed with circuit board at the bottom of the box, the box shell is provided with two electric connectors; Shielded cable one end is fixed on the pressure sensing head shell, and the other end is connected with electric connector; Thin film chip comprises the platinum film resistor for preparing on the Wheatstone bridge for preparing on the strain regions and the non-strain regions; The box shell seals by the quad seal pad on being fixed at the bottom of the box by screw thread.
Circuit board comprises power circuit, amplifying circuit and filtering circuit, power circuit and amplifying circuit, Wheatstone bridge connects, amplifying circuit and filtering circuit, Wheatstone bridge, platinum film resistor connects, power circuit provides 5V voltage for numeral conditioning power supply and Wheatstone bridge, amplifying circuit carries out the combination of function computing with the pressure survey feeble signal of Wheatstone bridge output and the temperature measurement signal of platinum film resistor output by certain software, finish to the signal of Wheatstone bridge in real time, truly, reliably temperature compensation is exported normalized voltage signal by filtering circuit.
Claims (5)
1. split type pressure transducer, comprise pressure sensing head and circuit box, the pressure sensing head is connected with circuit box by shielded cable, it is characterized in that, described pressure sensing head comprises pedestal, support, shell, card extender, thin film chip, and shell is fixed on the pedestal, and support, card extender and thin film chip are fixed in the enclosure space of pedestal and shell composition, support one end is connected with pedestal, and the other end is connected with card extender; Thin film chip one side is fixed on the pedestal, and opposite side is connected with card extender; Described pressure sensing head becomes up and down symmetrical structure; At the bottom of described circuit box comprises box, the box shell, the box shell is fixed on two ends at the bottom of the box, is fixed with circuit board at the bottom of the box, the box shell is provided with electric connector; Shielded cable one end is fixed on the pressure sensing head shell, and the other end is connected with electric connector; Described thin film chip comprises Wheatstone bridge on the strain regions and the platinum film resistor on the non-strain regions.
2. split type pressure transducer according to claim 1, it is characterized in that, described circuit board comprises power circuit, amplifying circuit and filtering circuit, and power circuit is connected with amplifying circuit, Wheatstone bridge, and amplifying circuit is connected with filtering circuit, Wheatstone bridge, platinum film resistor.
3. split type pressure transducer according to claim 1 is characterized in that, described electric connector quantity is two.
4. split type pressure transducer according to claim 1 is characterized in that, described thin film chip is connected with card extender by enameled wire.
5. split type pressure transducer according to claim 1 is characterized in that, seals by the quad seal pad between at the bottom of described circuit box box shell and the box.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220330883 CN202814620U (en) | 2012-07-10 | 2012-07-10 | Separated type pressure sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201220330883 CN202814620U (en) | 2012-07-10 | 2012-07-10 | Separated type pressure sensor |
Publications (1)
Publication Number | Publication Date |
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CN202814620U true CN202814620U (en) | 2013-03-20 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 201220330883 Expired - Lifetime CN202814620U (en) | 2012-07-10 | 2012-07-10 | Separated type pressure sensor |
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CN (1) | CN202814620U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104218144A (en) * | 2013-06-03 | 2014-12-17 | 三星电机株式会社 | Piezoelectric device package and method of fabricating the same |
CN111964811A (en) * | 2020-10-20 | 2020-11-20 | 南京沃天科技有限公司 | Anti-interference pressure transmitter |
-
2012
- 2012-07-10 CN CN 201220330883 patent/CN202814620U/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104218144A (en) * | 2013-06-03 | 2014-12-17 | 三星电机株式会社 | Piezoelectric device package and method of fabricating the same |
CN104218144B (en) * | 2013-06-03 | 2017-07-04 | 三星电机株式会社 | Piezoelectric device encapsulation and preparation method thereof |
US9929337B2 (en) | 2013-06-03 | 2018-03-27 | Samsung Electro-Mechanics Co., Ltd. | Piezoelectric device package and method of fabricating the same |
CN111964811A (en) * | 2020-10-20 | 2020-11-20 | 南京沃天科技有限公司 | Anti-interference pressure transmitter |
CN111964811B (en) * | 2020-10-20 | 2021-01-19 | 南京沃天科技有限公司 | Anti-interference pressure transmitter |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20130320 |