CN202796304U - Inductance package structure - Google Patents
Inductance package structure Download PDFInfo
- Publication number
- CN202796304U CN202796304U CN 201220222855 CN201220222855U CN202796304U CN 202796304 U CN202796304 U CN 202796304U CN 201220222855 CN201220222855 CN 201220222855 CN 201220222855 U CN201220222855 U CN 201220222855U CN 202796304 U CN202796304 U CN 202796304U
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- Prior art keywords
- roll
- assembling structure
- inductive bank
- structure according
- bank assembling
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Abstract
The utility model provides an inductance package structure comprising a rubber shade, a spool, a coil wound on the spool, and a rubber body. The rubber shade comprises a sealing bottom, a wall portion surrounding the sealing bottom and an opening top which is corresponding to the sealing bottom. A containing slot is formed between the sealing bottom and the wall portion. The spool is arranged inside the containing slot of the rubber shade. The bottom of the spool is fixed on the sealing bottom. The rubber body is filled in gaps, except for the spool and the coil, of the containing slot. The inductance package structure is capable of improving package and production percents of pass and production rates of an inductance and lowering manufacturing cost.
Description
Technical field
The utility model relates to a kind of inductive bank assembling structure.
Background technology
Existing inductance mainly is used on the mainboards such as display, TV, computer, and filtering and function of shielding are arranged.The structure of existing inductance is comprised of square through hole nickel core magnetic cover, nickel core I-shaped roll, enamelled wire and both positive and negative polarity guide card.The packaging technology of existing inductance is: enamelled wire is on nickel core I-shaped roll, two the end of a thread of enamelled wire are welded on the contact of both positive and negative polarity guide card, then integral body is put into through hole nickel core magnetic cover, with sealing pouring adhesive that the internal diameter of the bottom external diameter of nickel core I-shaped roll and through hole nickel core magnetic cover is bonding, put into baking box after fixing with anchor clamps again and toast with 120 ℃ ~ 180 ℃ temperature, after sealing pouring adhesive solidifies fully, finish.And inductance is attached on the mainboard wiring board and will through 265 ℃ ~ 272 ℃ high temperature furnace, inductance could be welded on the mainboard and uses with chip mounter.
There are following three shortcomings in existing inductance:
One) because through hole nickel core magnetic cover is to form with alloyed powder compacting sinterings such as nickel and iron, very large fragility is arranged, be squeezed when carrying and assembling and all can cause explosion, cause fraction defective high.
Two) because there is very large fragility in through hole nickel core magnetic cover, in footpath and the assembling of nickel core I-shaped roll within it, encapsulating, bonding, the baking-curing process, because sealing pouring adhesive has the characteristic of expanding with heat and contract with cold, can impact and explosion occurs through hole nickel core magnetic cover internal diameter.
Three) the inductance finished product is being attached to chip mounter on the mainboard wiring board, during through the welding of 265 ℃ ~ 272 ℃ high temperature furnaces, and the thermal shock that can be expanded with heat and contract with cold again and cause a part of inductance explosion.
In summary, existing inductance technology obviously exists inconvenience and defective in actual use, and the industry Related Technical Issues is felt puzzlement all the time deeply, so be necessary to be improved.
The utility model content
For above-mentioned defective, the purpose of this utility model is to provide a kind of inductive bank assembling structure, and it can improve the assembling of inductance, qualification rate and the productivity ratio of production, and reduces manufacturing cost.
To achieve these goals, the utility model provides a kind of inductive bank assembling structure, includes:
The glue cover comprises closed bottom, surrounds the wall section of described closed bottom and the open top corresponding with described closed bottom, forms tank between described closed bottom and the described wall section;
Roll is located in the tank of described glue cover, and described closed bottom is fixed in the bottom of described roll;
Coil is surrounded on the described roll;
Colloid is filled in the gap except described roll and described coil in the described tank.
According to inductive bank assembling structure described in the utility model, described glue cover by resistant to elevated temperatures plastic material through injection mo(u)lding.
According to inductive bank assembling structure described in the utility model, described glue cover is square glue cover.
According to inductive bank assembling structure described in the utility model, described roll is the I shape roll.
According to inductive bank assembling structure described in the utility model, described I shape roll is made by the nickel core.
According to inductive bank assembling structure described in the utility model, described coil is enamelled wire.
According to inductive bank assembling structure described in the utility model, the surface of described coil is provided with magnetic glue, and described colloid is sealing pouring adhesive.
According to inductive bank assembling structure described in the utility model, described sealing pouring adhesive and described magnetic glue are through the baking-curing moulding.
According to inductive bank assembling structure described in the utility model, described roll is positioned at the centre of the described tank of described glue cover.
According to inductive bank assembling structure described in the utility model, be fixed with the positive and negative electrode guide card on the described roll, two the end of a thread of described coil are connected with described positive and negative electrode guide card respectively.
The utility model utilization has the high-temperature-resistant shielding glue cover at the end to replace existing through hole nickel core magnetic cover, the improvement of fit structure and material, can improve the assembling of inductance, qualification rate and the productivity ratio of production, avoid paster to add the problem that man-hour, the baking explosion occured, guarantee the stay in grade of product.Particularly, the glue cover of the utility model inductance has following advantage:
1) the available mold injection molding of glue cover, its technique is simple, and high productivity and cost are low;
2) the high temperature resistant plastic material that the use of glue cover can be anti-280 ℃ can at high temperature be worked for a long time;
3) material character of glue cover is thermoplasticity, and material is former flexible, adds the glue cover along with temperature is expanded with heat and contract with cold, and glue cover inwall is not subjected to thermal shock, thereby explosion can not occur.
Description of drawings
Fig. 1 is the cutaway view of the utility model inductive bank assembling structure; And
Fig. 2 is the cutaway view of the glue cover of the utility model inductive bank assembling structure.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
As depicted in figs. 1 and 2, the utility model provides a kind of inductive bank assembling structure 100, includes glue cover 10, roll 20, coil 30 and colloid 40, wherein:
Described glue cover 10, the wall section 12 and the open top 13 corresponding with closed bottom 11 that comprise closed bottom 11, surround this closed bottom 11 form tank 14 between described closed bottom 11 and the wall section 12.Described glue cover 10 is for there being the high-temperature-resistant shielding glue cover at the end.Preferably, through injection mo(u)lding, and glue cover 10 is preferably square glue cover to glue cover 10 by resistant to elevated temperatures plastic material.
Described roll 20 be located in the tank 14 of glue cover 10, and closed bottom 11 is fixed in the bottom of roll 20.Preferably, roll 20 is the I shape roll, and described I shape roll is made by the nickel core.Be more preferably, roll 20 is positioned at the centre of the tank 14 of glue cover 10.
Described coil 30 is surrounded on the roll 20.Coil 30 is preferably enamelled wire.The surface of coil 30 is provided with magnetic glue, and described magnetic glue is through the baking-curing moulding.
Described colloid 40 is filled in the gap except roll 20 and coil 30 in the tank 14.Described colloid 40 is preferably sealing pouring adhesive, and described sealing pouring adhesive is through the baking-curing moulding.
Preferably, be fixed with positive and negative electrode guide card 50 on the described roll 20, two the end of a thread of described coil 30 are connected with positive and negative electrode guide card 50 respectively.
The utility model inductive bank assembling structure 100 is by the improvement of structure and material, and the fraction defective that reduce assembling, generates so that paster processing can not toasted explosion again, and then is guaranteed the mainboard stay in grade.
The packaging technology of the utility model inductive bank assembling structure 100 is: coil 30 is on roll 20,30 liang of the end of a thread of coil are welded on positive and negative electrode guide card 50 contacts, magnetic glue (packaging plastic) is enclosed in coil 30 on the roll 20, entirely covers to reach the effect of shielding.Integral body is put into the square high-temperature plastic cover 10 that the end is arranged again, allow the bottom of roll 20 and the bottom of glue cover 10 fit, click and enter with sealing pouring adhesive more bonding, fixing with anchor clamps at last after, put into 120 ℃ ~ 180 ℃ of baking box bakings to magnetic glue and sealing pouring adhesive all fully curing molding get final product.
In sum, the utility model utilization has the high-temperature-resistant shielding glue cover at the end to replace existing through hole nickel core magnetic cover, the improvement of fit structure and material, can improve the assembling of inductance, qualification rate and the productivity ratio of production, avoid paster to add the problem that man-hour, the baking explosion occured, guaranteed the stay in grade of product.Particularly, the glue cover of the utility model inductance has following advantage:
1) the available mold injection molding of glue cover, its technique is simple, and high productivity and cost are low;
2) the high temperature resistant plastic material that the use of glue cover can be anti-280 ℃ can at high temperature be worked for a long time;
3) material character of glue cover is thermoplasticity, and material is former flexible, adds the glue cover along with temperature is expanded with heat and contract with cold, and glue cover inwall is not subjected to thermal shock, thereby explosion can not occur.
Certainly; the utility model also can have other various embodiments; in the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the utility model.
Claims (10)
1. an inductive bank assembling structure is characterized in that, includes:
The glue cover comprises closed bottom, surrounds the wall section of described closed bottom and the open top corresponding with described closed bottom, forms tank between described closed bottom and the described wall section;
Roll is located in the tank of described glue cover, and described closed bottom is fixed in the bottom of described roll;
Coil is surrounded on the described roll;
Colloid is filled in the gap except described roll and described coil in the described tank.
2. inductive bank assembling structure according to claim 1 is characterized in that, described glue cover by resistant to elevated temperatures plastic material through injection mo(u)lding.
3. inductive bank assembling structure according to claim 1 is characterized in that, described glue cover is square glue cover.
4. inductive bank assembling structure according to claim 1 is characterized in that, described roll is the I shape roll.
5. inductive bank assembling structure according to claim 4 is characterized in that, described I shape roll is made by the nickel core.
6. inductive bank assembling structure according to claim 1 is characterized in that, described coil is enamelled wire.
7. inductive bank assembling structure according to claim 1 is characterized in that, the surface of described coil is provided with magnetic glue, and described colloid is sealing pouring adhesive.
8. inductive bank assembling structure according to claim 7 is characterized in that, described sealing pouring adhesive and described magnetic glue are through the baking-curing moulding.
9. inductive bank assembling structure according to claim 1 is characterized in that, described roll is positioned at the centre of the described tank of described glue cover.
10. each described inductive bank assembling structure is characterized in that according to claim 1 ~ 9, is fixed with the positive and negative electrode guide card on the described roll, and two the end of a thread of described coil are connected with described positive and negative electrode guide card respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220222855 CN202796304U (en) | 2012-05-17 | 2012-05-17 | Inductance package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220222855 CN202796304U (en) | 2012-05-17 | 2012-05-17 | Inductance package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202796304U true CN202796304U (en) | 2013-03-13 |
Family
ID=47823516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220222855 Expired - Fee Related CN202796304U (en) | 2012-05-17 | 2012-05-17 | Inductance package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202796304U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931201A (en) * | 2018-09-20 | 2020-03-27 | 昆山同凯电子有限公司 | Sheet type bar-shaped inductor assembly structure |
-
2012
- 2012-05-17 CN CN 201220222855 patent/CN202796304U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931201A (en) * | 2018-09-20 | 2020-03-27 | 昆山同凯电子有限公司 | Sheet type bar-shaped inductor assembly structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20130517 |