CN202759004U - Microstrip substrate type isolator - Google Patents
Microstrip substrate type isolator Download PDFInfo
- Publication number
- CN202759004U CN202759004U CN 201220419250 CN201220419250U CN202759004U CN 202759004 U CN202759004 U CN 202759004U CN 201220419250 CN201220419250 CN 201220419250 CN 201220419250 U CN201220419250 U CN 201220419250U CN 202759004 U CN202759004 U CN 202759004U
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- CN
- China
- Prior art keywords
- microstrip
- permanent magnet
- microwave ferrite
- microstrip circuit
- ferrite substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a microstrip substrate type isolator, which comprises a pedestal, a microwave ferrite substrate, a film resistance layer, a microstrip circuit and a permanent magnet, the film resistance layer and the circuit are arranged on the upper surface of the microwave ferrite substrate, a pin of the microstrip circuit is arranged on the film resistance layer, the permanent magnet is arranged on the microstrip circuit, the permanent magnet axis and the microstrip circuit disc axis are overlapped, the bottom of the microwave ferrite substrate is fixedly connected to the upper surface of the pedestal, the microstrip substrate type isolator has the advantages of small volume and simple structure, and is suitable for surface mounting and microcircuit integrating, each performance index can satisfy the requirement, and the reliability is high.
Description
Technical field
The utility model relates to a kind of isolator for field of mobile communication, is specifically related to a kind of microstrip substrate formula isolator.
Background technology
Existing mounted type spacer structures comprises housing and cover plate, and housing is formed with circular cylindrical cavity, and the sidewall of housing has port, and position relative with port on housing sidewall is provided with boss, has through hole on the boss; In the circular cylindrical cavity of housing, place permanent magnet, even magnetic conducting strip, ferrite, axis conductor and temperature-compensating sheet, and be stamped cover plate, and the port that the axis conductor passes on the housing sidewall stretches out outside the chamber; The port pin insulator is installed in the through hole of housing sidewall boss, the port pin is packed in the port pin insulator, and port pin and axis conductor are electrically connected, and this structure processing consumptive material is many, volume is larger, complex structure, be not suitable for surface mount, to be not easy to microcircuit integrated.
The utility model content
The utility model purpose: the purpose of this utility model is for the deficiencies in the prior art, provides a kind of volume little, simple in structure, is applicable to the integrated microstrip substrate formula isolator of surface mount and microcircuit.
Technical scheme: a kind of microstrip substrate formula isolator described in the utility model, comprise base, Microwave Ferrite Substrates, thin film resistive layer, microstrip circuit and permanent magnet, the upper surface of described Microwave Ferrite Substrates is provided with thin film resistive layer and microstrip circuit, a pin of described microstrip circuit is arranged on the thin film resistive layer, thin film resistive layer is used for the absorbing microwave signal, be provided with permanent magnet on the described microstrip circuit, the axis overlaid of the axis of described permanent magnet and the disk of microstrip circuit, the bottom surface of described Microwave Ferrite Substrates is fixedly connected with the upper surface of base.
Further improve technique scheme, described thin film resistive layer is arranged on the upper surface of Microwave Ferrite Substrates by thin-film technique, has increased the adhesive force of thin film resistive layer, guarantees the thin film resistive layer non-scale.
Further, described microstrip circuit is by the upper surface of photoetching technique plating at Microwave Ferrite Substrates.
Further, described Microwave Ferrite Substrates is the spinel ferrite, and described permanent magnet is the samarium cobalt permanent magnet body, and described base is made by magnetic metal materials processing.
Further, described permanent magnet is glued on the microstrip circuit by epoxy resin, and described Microwave Ferrite Substrates is weldingly fixed on the upper surface of base by welding stage.
The utility model compared with prior art, its beneficial effect is: microstrip substrate formula isolator described in the utility model is long-pending little, simple in structure, is applicable to surface mount and microcircuit is integrated, its property indices all can meet the demands, reliability is high.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the schematic diagram after the utility model assembling.
Embodiment
The below is elaborated to technical solutions of the utility model, but protection range of the present utility model is not limited to described embodiment.
As illustrated in fig. 1 and 2, a kind of microstrip substrate formula isolator, comprise magnetic metal base 1, thin film resistive layer 2, microstrip circuit 3, spinelle Microwave Ferrite Substrates 4 and samarium cobalt permanent magnet body 5, described thin film resistive layer 2 is arranged on the upper surface of spinelle Microwave Ferrite Substrates 4 by thin-film technique, described microstrip circuit 3 is by the upper surface of photoetching technique plating at spinelle Microwave Ferrite Substrates 4, a pin of described microstrip circuit 3 covers on the thin film resistive layer 2, described samarium cobalt permanent magnet body 5 is glued on the microstrip circuit 3 by epoxy resin, described samarium cobalt permanent magnet, the axis overlaid of the disk of 5 axis and microstrip circuit 3, the upper surface of the bottom surface of described spinelle Microwave Ferrite Substrates 4 and magnetic metal base 1 is welded and fixed by welding stage.
Above-mentioned microstrip substrate formula isolator is long-pending little, simple in structure, is applicable to surface mount and microcircuit is integrated, and its property indices all can meet the demands, and reliability is high.
The key technical indexes of this isolator such as following table:
| Frequency range | 30.5-31.3GHz |
| Forward loss | ≤1.0dB |
| Reverse isolation | ≥18dB |
| Standing-wave ratio | ≤1.4 |
| Temperature range | -40℃~+50℃ |
| Direction | Forward |
| Forward loss under the temperature | ≤1.1dB |
| Reverse isolation under the temperature | ≥17dB |
| Joint form | W→W |
| |
5×5×3.5mm |
As mentioned above, although the specific preferred embodiment of reference has represented and has explained the utility model that it shall not be construed as the restriction to the utility model self.Under the spirit and scope prerequisite of the present utility model that does not break away from the claims definition, can make in the form and details various variations to it.
Claims (5)
1. microstrip substrate formula isolator, it is characterized in that, comprise base, Microwave Ferrite Substrates, thin film resistive layer, microstrip circuit and permanent magnet, the upper surface of described Microwave Ferrite Substrates is provided with thin film resistive layer and microstrip circuit, a pin of described microstrip circuit is arranged on the thin film resistive layer, be provided with permanent magnet on the described microstrip circuit, the axis overlaid of the axis of described permanent magnet and the disk of microstrip circuit, the bottom surface of described Microwave Ferrite Substrates is fixedly connected with the upper surface of base.
2. microstrip substrate formula isolator according to claim 1 is characterized in that, described thin film resistive layer is arranged on the upper surface of Microwave Ferrite Substrates by thin-film technique.
3. microstrip substrate formula isolator according to claim 1 is characterized in that, described microstrip circuit is by the upper surface of photoetching technique plating at Microwave Ferrite Substrates.
4. microstrip substrate formula isolator according to claim 1 is characterized in that, described Microwave Ferrite Substrates is the spinel ferrite, and described permanent magnet is the samarium cobalt permanent magnet body, and described base is made by magnetic metal materials processing.
5. microstrip substrate formula isolator according to claim 1 is characterized in that described permanent magnet is glued on the microstrip circuit by epoxy resin, and described Microwave Ferrite Substrates is weldingly fixed on the upper surface of base by welding stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220419250 CN202759004U (en) | 2012-08-23 | 2012-08-23 | Microstrip substrate type isolator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220419250 CN202759004U (en) | 2012-08-23 | 2012-08-23 | Microstrip substrate type isolator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202759004U true CN202759004U (en) | 2013-02-27 |
Family
ID=47738169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220419250 Expired - Fee Related CN202759004U (en) | 2012-08-23 | 2012-08-23 | Microstrip substrate type isolator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202759004U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106785300A (en) * | 2017-01-03 | 2017-05-31 | 西南应用磁学研究所 | Microstrip isolator bonding jig |
-
2012
- 2012-08-23 CN CN 201220419250 patent/CN202759004U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106785300A (en) * | 2017-01-03 | 2017-05-31 | 西南应用磁学研究所 | Microstrip isolator bonding jig |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130227 Termination date: 20190823 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |