CN202753511U - Double-faced copper cladding base material structure for light-emitting diode (LED) soft light bar - Google Patents
Double-faced copper cladding base material structure for light-emitting diode (LED) soft light bar Download PDFInfo
- Publication number
- CN202753511U CN202753511U CN2012203062951U CN201220306295U CN202753511U CN 202753511 U CN202753511 U CN 202753511U CN 2012203062951 U CN2012203062951 U CN 2012203062951U CN 201220306295 U CN201220306295 U CN 201220306295U CN 202753511 U CN202753511 U CN 202753511U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- layer
- led
- adhesive layer
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 239000000463 material Substances 0.000 title abstract description 16
- 238000005253 cladding Methods 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 239000011889 copper foil Substances 0.000 claims abstract description 61
- 239000010410 layer Substances 0.000 claims abstract description 48
- 239000012790 adhesive layer Substances 0.000 claims abstract description 29
- 239000011159 matrix material Substances 0.000 claims description 12
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- 150000002118 epoxides Chemical class 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 description 25
- 239000000853 adhesive Substances 0.000 description 22
- 239000003795 chemical substances by application Substances 0.000 description 12
- 239000000945 filler Substances 0.000 description 12
- 239000002904 solvent Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- 239000002994 raw material Substances 0.000 description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 3
- 229910000410 antimony oxide Inorganic materials 0.000 description 3
- 238000005282 brightening Methods 0.000 description 3
- 230000009172 bursting Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229920003180 amino resin Polymers 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- BBJZIVDFAGBWHH-UHFFFAOYSA-N C=CC.N#CC#N Chemical compound C=CC.N#CC#N BBJZIVDFAGBWHH-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- -1 phenolic aldehyde Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012203062951U CN202753511U (en) | 2012-06-28 | 2012-06-28 | Double-faced copper cladding base material structure for light-emitting diode (LED) soft light bar |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012203062951U CN202753511U (en) | 2012-06-28 | 2012-06-28 | Double-faced copper cladding base material structure for light-emitting diode (LED) soft light bar |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202753511U true CN202753511U (en) | 2013-02-27 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012203062951U Expired - Fee Related CN202753511U (en) | 2012-06-28 | 2012-06-28 | Double-faced copper cladding base material structure for light-emitting diode (LED) soft light bar |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202753511U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102744934A (en) * | 2012-06-28 | 2012-10-24 | 东莞市群跃电子材料科技有限公司 | Double copper-coated surface base material structure for LED flexible strip and manufacturing method thereof |
-
2012
- 2012-06-28 CN CN2012203062951U patent/CN202753511U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102744934A (en) * | 2012-06-28 | 2012-10-24 | 东莞市群跃电子材料科技有限公司 | Double copper-coated surface base material structure for LED flexible strip and manufacturing method thereof |
CN102744934B (en) * | 2012-06-28 | 2016-06-15 | 东莞市群跃电子材料科技有限公司 | Flexible LED lamp bar double-sided copper-clad matrix structure and manufacture method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: WUXI QUNYUE ELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: DONGGUAN QUNYUE ELE-MATERIALS + TECHNOLOGY CO.,LTD. Effective date: 20130828 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 523000 DONGGUAN, GUANGDONG PROVINCE TO: 241103 WUHU, ANHUI PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130828 Address after: Anhui Wuhu Economic Development Zone Wuhu County Zhi Zhen Wan 241103 Anhui Province Patentee after: Wuxi Qunyue Electronics Technology Co., Ltd. Address before: The village of Changping town Guangdong city Dongguan province 523000 Kau large Bay Industrial Zone lirenmeng Dong F Industrial Park, Dongguan city group Yue electronic Mstar Technology Ltd Patentee before: Dongguan Qunyue Ele-materials & Technology Co.,Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: DONGGUAN QUNYUE ELE-MATERIALS + TECHNOLOGY CO.,LTD Free format text: FORMER OWNER: WUXI QUNYUE ELECTRONICS TECHNOLOGY CO., LTD. Effective date: 20141125 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 241103 WUHU, ANHUI PROVINCE TO: 523000 DONGGUAN, GUANGDONG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20141125 Address after: Changping Village town of Kau 523000 Guangdong province Dongguan city by the Bay Industrial Park lirenmeng Industrial Park C building the first floor Patentee after: Dongguan Qunyue Ele-materials & Technology Co.,Ltd. Address before: Anhui Wuhu Economic Development Zone Wuhu County Zhi Zhen Wan 241103 Anhui Province Patentee before: Wuxi Qunyue Electronics Technology Co., Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160808 Address after: 628000 Sichuan province Guangyuan City Office, District No. 266 dam Patentee after: Sichuan Nikko electronic Polytron Technologies Inc Address before: Changping Village town of Kau 523000 Guangdong province Dongguan city by the Bay Industrial Park lirenmeng Industrial Park C building the first floor Patentee before: Dongguan Qunyue Ele-materials & Technology Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130227 Termination date: 20190628 |
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CF01 | Termination of patent right due to non-payment of annual fee |