CN202753511U - Double-faced copper cladding base material structure for light-emitting diode (LED) soft light bar - Google Patents
Double-faced copper cladding base material structure for light-emitting diode (LED) soft light bar Download PDFInfo
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- CN202753511U CN202753511U CN2012203062951U CN201220306295U CN202753511U CN 202753511 U CN202753511 U CN 202753511U CN 2012203062951 U CN2012203062951 U CN 2012203062951U CN 201220306295 U CN201220306295 U CN 201220306295U CN 202753511 U CN202753511 U CN 202753511U
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 239000000463 material Substances 0.000 title abstract description 16
- 238000005253 cladding Methods 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 239000011889 copper foil Substances 0.000 claims abstract description 61
- 239000010410 layer Substances 0.000 claims abstract description 48
- 239000012790 adhesive layer Substances 0.000 claims abstract description 29
- 239000011159 matrix material Substances 0.000 claims description 12
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- 150000002118 epoxides Chemical class 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 3
- 238000010030 laminating Methods 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 description 25
- 239000000853 adhesive Substances 0.000 description 22
- 239000003795 chemical substances by application Substances 0.000 description 12
- 239000000945 filler Substances 0.000 description 12
- 239000002904 solvent Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- 239000002994 raw material Substances 0.000 description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 3
- 229910000410 antimony oxide Inorganic materials 0.000 description 3
- 238000005282 brightening Methods 0.000 description 3
- 230000009172 bursting Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229920003180 amino resin Polymers 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- BBJZIVDFAGBWHH-UHFFFAOYSA-N C=CC.N#CC#N Chemical compound C=CC.N#CC#N BBJZIVDFAGBWHH-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- -1 phenolic aldehyde Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
The utility model relates to the technical field of light-emitting diode (LED) soft light bars, in particular to a double-faced copper cladding base material structure for an LED soft light bar. The LED soft light bar is in the double-faced copper cladding base material structure which is in a three-layer laminating shape structure, and a copper foil layer, a thermosetting adhesive layer and another copper foil layer are arranged on the three-layer laminating shape structure from top to bottom; the copper foil layer, the thermosetting adhesive layer and the another copper foil layer are combined together from top to bottom in an attached mode, on one hand, the performance can meet using requirements for the LED light bar, and on the other hand, the yield is high, production process is simple, and cost is low.
Description
Technical field
The utility model relates to the soft lamp bar of LED technical field, relates in particular to the soft lamp bar double-sided copper-clad matrix structure of a kind of LED.
Background technology
In recent years, the LED long strip shape lamp has been widely applied to various places, and such as the decoration of the brightening of the brightening in the body of wall brightening in incorporated business building, government building, historical building body of wall, public place of entertainment, night scene engineering etc., its related scope is also more and more wider.Along with developing rapidly of LED Lighting Industry, adopt the soft demand of covering copper foil base material to get more and more, particularly view, flexible illumination low-power LED field etc.The two-sided copper foil covered base material that uses at present is the five-layer structure compound with Copper Foil behind Kapton two sided coatings thermosetting shape adhesive, and not only complex manufacturing, yields are low, and cost is higher simultaneously.
Summary of the invention
The purpose of this utility model is to provide the soft lamp bar of a kind of LED double-sided copper-clad matrix structure for the deficiencies in the prior art, and its performance reaches the bar instructions for use of LED lamp and yields is high, and production technology is simple, and cost is lower.
For achieving the above object, the utility model adopts following technical scheme.
The soft lamp bar double-sided copper-clad matrix structure of LED, it is three shape structures layer by layer, is followed successively by copper foil layer, hot setting adhesive layer and copper foil layer from top to bottom; Described copper foil layer, hot setting adhesive layer and copper foil layer fit together from top to down.
Further, described copper foil layer is one or both in electrolytic copper foil or the rolled copper foil.
Further, the thickness specification of described copper foil layer is 1/3oz ~ 2oz.
Further, described hot setting adhesive layer is a kind of in epoxide modified adhesive layer, acrylic acid adhesive layer, the organic-silicon-modified adhesive layer.
Further, the thickness of described copper foil layer is 12um ~ 70um.
Further, the thickness of described hot setting adhesive layer is 10um ~ 100um.
The utility model beneficial effect is: the soft lamp bar double-sided copper-clad matrix structure of LED described in the utility model, only need hot setting adhesive is coated on the copper-clad surface and with another side Copper Foil direct combination, its performance can reach the bar instructions for use of LED lamp and yields is high, production technology is simple, and cost is lower.
Description of drawings
Accompanying drawing 1 is structural representation of the present utility model.
Number in the figure comprises: copper foil layer-----1; Hot setting adhesive layer-----2.
The specific embodiment
Below in conjunction with drawings and embodiments the utility model is further described.
Embodiment one, as shown in Figure 1, the soft lamp bar double-sided copper-clad matrix structure of LED described in the utility model, it is three shape structures layer by layer, is followed successively by copper foil layer 1, hot setting adhesive layer 2 and copper foil layer 1 from top to bottom; Described copper foil layer 1, hot setting adhesive layer 2 and copper foil layer 1 fit together from top to down.Further, described copper foil layer 1 is one or both in electrolytic copper foil or the rolled copper foil, and for example two-layer copper foil layer 1 is electrolytic copper foil or rolled copper foil, and perhaps wherein one deck copper foil layer 1 is electrolytic copper foil, and another layer copper foil layer 1 is rolled copper foil.Further, the thickness specification of described copper foil layer 1 is 1/3oz ~ 2oz.Further, described hot setting adhesive layer 2 is a kind of in epoxide modified adhesive layer, acrylic acid adhesive layer, the organic-silicon-modified adhesive layer, has the advantage that pliability is good, tensile strength is large, adhesive property is excellent.Further, the thickness of described copper foil layer 1 is 12um ~ 70um, can satisfy the user demand of the soft lamp bar of LED, is preferably 25um or 35 um.Further, the thickness of described hot setting adhesive layer 2 is 10um ~ 100um, satisfies the user demand of the soft lamp bar of LED, is preferably 30um～50 um.
This directly being coated on carried out the soft copper foil base material that covers of compound three-decker on the Copper Foil, its performance satisfies the user demand of the soft lamp bar of LED, has excellent performance in heat resistance, peel strength, insulation impedance, pliability etc.This double-sided copper-clad foil material principal character adopts the bonding two-sided Copper Foil of one deck pliability adhesive layer good, that tensile strength is large, adhesive property is excellent, replace the Kapton and the two-layer adhesive layer that use in the traditional handicraft, only need a coated and molded, simplify technique and significantly reduced raw material and production cost, therefore, have performance and reach the bar instructions for use of LED lamp and yields height, production technology is simple, lower-cost advantage.
Above-mentioned LED is soft, and the lamp bar with the double-sided copper-clad production method for base material is: first at the epoxide modified adhesive of copper foil surface coating one deck, acrylic acid adhesive or organic-silicon-modified adhesive, then after coater oven forms the semi-solid preparation glued membrane, carry out pressing with another Copper Foil, form at last upper to the lower three soft lamp bar double-sided copper-clad base materials of LED of shape structure layer by layer that are followed successively by copper foil layer 1, hot setting adhesive layer 2 and copper foil layer 1.Further, described copper foil layer 1 is one or both in electrolytic copper foil or the rolled copper foil, and the thickness specification of copper foil layer 1 is 1/3oz ~ 2oz.Further, the thickness of described copper foil layer 1 is 12um ~ 70um.Further, the thickness of described hot setting adhesive layer 2 is 10um ~ 100um.
Described epoxide modified adhesive is prepared from by the raw material of following mass ratio: epoxy resin (20%～40%): filler (10%～25%): flexibilizer (10%～20%): curing agent (2%～5%): promoter (0.5%～1.0%): solvent (20%～50%); Wherein, described epoxy resin is one or more the mixture in Bisphenol F type, bisphenol A-type, the phenolic aldehyde epoxy; Described filler is one or more the mixture in aluminium hydroxide, silica, aluminium oxide, carborundum, boron nitride, the antimony oxide; Described flexibilizer is one or more the mixture in nitrile rubber, butadiene-styrene rubber, the ACM; Described curing agent is a kind of in diamino diphenyl sulfone, diamino-diphenyl ether, the dicyandiamide or two kinds mixture wherein; Described promoter is one or more the mixture among 2MI, 2PI, the 2E4MZ; Solvent is two kinds or above mixture in toluene, butanone, acetone, the EGME.The epoxide modified adhesive that this proportioning is made can guarantee to be laminated with the copper foil material peel strength and reach more than the 1.5kgf/cm, and the adhesive after the curing has good pliability, percentage elongation reaches more than 100%, heat resistance reaches the pb-free solder requirement, and not plate bursting of 288 ℃ of * 30sec is without layering foaming phenomenon.Preferably, described epoxide modified adhesive is prepared from by the raw material of following mass ratio: epoxy resin 30%: filler 20%: flexibilizer 15%: curing agent 4%: promoter 1.0%: solvent 30%.Another is preferred, and described epoxide modified adhesive is prepared from by the raw material of following mass ratio: epoxy resin 25%: filler 15%: flexibilizer 15%: curing agent 4%: promoter 1.0%: solvent 40%.
Described acrylic acid adhesive is prepared from by the raw material of following mass ratio: acrylic resin (30%～70%): filler (5%～15%): curing agent (10%～40%): solvent (20%～45%); Wherein, described acrylic resin is two kinds or above mixture in butyl methacrylate, methyl acrylate, acrylic acid, propylene cyanogen, the ethyl acrylate; Described filler is one or more the mixture in aluminium hydroxide, silica, aluminium oxide, carborundum, boron nitride, the antimony oxide; Described curing agent is a kind of in phenolic resins, epoxy resin, amino resins, the polyurethane or two kinds mixture wherein; Described solvent is a kind of in toluene, dimethylbenzene, ethyl acetate, the butyl acetate; The acrylic acid adhesive that this proportioning is made can guarantee to be laminated with the copper foil material peel strength and reach more than the 1.5kgf/cm, and the adhesive after the curing has good pliability, percentage elongation reaches more than 100%, heat resistance reaches the pb-free solder requirement, and not plate bursting of 288 ℃ of * 30sec is without layering foaming phenomenon.Preferably, described acrylic acid adhesive is prepared from by the raw material of following mass ratio: acrylic resin 30%: filler 15%: curing agent 20%: solvent 35%.Another is preferred, and described acrylic acid adhesive is prepared from by the raw material of following mass ratio: acrylic resin 35%: filler 10%: curing agent 20%: solvent 35%.
Described organic-silicon-modified adhesive is prepared from by the raw material of following mass ratio: organic-silicon-modified resin (30%～70%): filler (15%～30%): curing agent (10%～30%): solvent (20%～45%); Wherein, described filler is one or more the mixture in aluminium hydroxide, silica, aluminium oxide, carborundum, boron nitride, the antimony oxide; Described curing agent is a kind of in amino resins, the isocyanates or two kinds mixture wherein; Described solvent is a kind of in toluene, dimethylbenzene, n-butanol, EGME, butyl acetate, the ethyl acetate.The organic-silicon-modified adhesive that this proportioning is made.Can guarantee to be laminated with the copper foil material peel strength and reach more than the 1.5kgf/cm, the adhesive after the curing has good pliability, and percentage elongation reaches more than 100%, and heat resistance reaches the pb-free solder requirement, and not plate bursting of 288 ℃ of * 30sec is without layering foaming phenomenon.Preferably, described organic-silicon-modified adhesive is prepared from by the raw material of following mass ratio: organic-silicon-modified resin 40%: filler 20%: curing agent 15%: solvent 25%.Another is preferred, and described organic-silicon-modified adhesive is prepared from by the raw material of following mass ratio: organic-silicon-modified resin 40%: filler 25%: curing agent 15%: solvent 20%.
By the soft copper foil base material that covers of three-decker that this manufacture method is made, its performance satisfies the user demand of the soft lamp bar of LED, has excellent performance in heat resistance, peel strength, insulation impedance, pliability etc.This double-sided copper-clad foil material principal character adopts one deck pliability good, tensile strength is large, the bonding two-sided Copper Foil of adhesive layer that adhesive property is excellent, replace the Kapton and the two-layer adhesive layer that use in the traditional handicraft, only need a coated and molded, simplify technique and significantly reduced raw material and production cost, compare with prior art and technique, the soft lamp bar of this LED is with double-sided copper-clad production method for base material production technology more simple (the two-sided copper foil base material that covers of tradition needs at macromolecule membrane coating secondary hot setting adhesive), and cost is lower behind the replacement Kapton, exploration and application demand and the yields that can be suitable for the soft lamp bar of LED are high, significantly reduce LED lamp bar production cost.
The above only is preferred embodiments of the present utility model, so all equivalences of doing according to the described structure of the utility model patent claim, feature and principle change or modify, is included in the utility model patent claim.
Claims (6)
1.LED soft lamp bar double-sided copper-clad matrix structure is characterized in that: it is three shape structures layer by layer, is followed successively by copper foil layer, hot setting adhesive layer and copper foil layer from top to bottom; Described copper foil layer, hot setting adhesive layer and copper foil layer fit together from top to down.
2. the soft lamp bar double-sided copper-clad matrix structure of LED according to claim 1, it is characterized in that: described copper foil layer is one or both in electrolytic copper foil or the rolled copper foil.
3. the soft lamp bar double-sided copper-clad matrix structure of LED according to claim 2, it is characterized in that: the thickness specification of described copper foil layer is 1/3oz ~ 2oz.
4. the soft lamp bar double-sided copper-clad matrix structure of LED according to claim 2 is characterized in that: described hot setting adhesive layer is a kind of in epoxide modified adhesive layer, acrylic acid adhesive layer, the organic-silicon-modified adhesive layer.
5. the soft lamp bar double-sided copper-clad matrix structure of LED according to claim 4, it is characterized in that: the thickness of described copper foil layer is 12um ~ 70um.
6. the soft lamp bar double-sided copper-clad matrix structure of described LED according to claim 5, it is characterized in that: the thickness of described hot setting adhesive layer is 10um ~ 100um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203062951U CN202753511U (en) | 2012-06-28 | 2012-06-28 | Double-faced copper cladding base material structure for light-emitting diode (LED) soft light bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203062951U CN202753511U (en) | 2012-06-28 | 2012-06-28 | Double-faced copper cladding base material structure for light-emitting diode (LED) soft light bar |
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| Publication Number | Publication Date |
|---|---|
| CN202753511U true CN202753511U (en) | 2013-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012203062951U Expired - Fee Related CN202753511U (en) | 2012-06-28 | 2012-06-28 | Double-faced copper cladding base material structure for light-emitting diode (LED) soft light bar |
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| Country | Link |
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| CN (1) | CN202753511U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102744934A (en) * | 2012-06-28 | 2012-10-24 | 东莞市群跃电子材料科技有限公司 | Double copper-coated surface base material structure for LED flexible strip and manufacturing method thereof |
-
2012
- 2012-06-28 CN CN2012203062951U patent/CN202753511U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102744934A (en) * | 2012-06-28 | 2012-10-24 | 东莞市群跃电子材料科技有限公司 | Double copper-coated surface base material structure for LED flexible strip and manufacturing method thereof |
| CN102744934B (en) * | 2012-06-28 | 2016-06-15 | 东莞市群跃电子材料科技有限公司 | Flexible LED lamp bar double-sided copper-clad matrix structure and manufacture method |
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| Date | Code | Title | Description |
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Owner name: WUXI QUNYUE ELECTRONICS TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: DONGGUAN QUNYUE ELE-MATERIALS + TECHNOLOGY CO.,LTD. Effective date: 20130828 |
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Owner name: DONGGUAN QUNYUE ELE-MATERIALS + TECHNOLOGY CO.,LTD Free format text: FORMER OWNER: WUXI QUNYUE ELECTRONICS TECHNOLOGY CO., LTD. Effective date: 20141125 |
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Effective date of registration: 20141125 Address after: Changping Village town of Kau 523000 Guangdong province Dongguan city by the Bay Industrial Park lirenmeng Industrial Park C building the first floor Patentee after: Dongguan Qunyue Ele-materials & Technology Co.,Ltd. Address before: Anhui Wuhu Economic Development Zone Wuhu County Zhi Zhen Wan 241103 Anhui Province Patentee before: Wuxi Qunyue Electronics Technology Co., Ltd. |
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Effective date of registration: 20160808 Address after: 628000 Sichuan province Guangyuan City Office, District No. 266 dam Patentee after: Sichuan Nikko electronic Polytron Technologies Inc Address before: Changping Village town of Kau 523000 Guangdong province Dongguan city by the Bay Industrial Park lirenmeng Industrial Park C building the first floor Patentee before: Dongguan Qunyue Ele-materials & Technology Co.,Ltd. |
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