CN202742548U - Sapphire cutting machine - Google Patents
Sapphire cutting machine Download PDFInfo
- Publication number
- CN202742548U CN202742548U CN 201220394244 CN201220394244U CN202742548U CN 202742548 U CN202742548 U CN 202742548U CN 201220394244 CN201220394244 CN 201220394244 CN 201220394244 U CN201220394244 U CN 201220394244U CN 202742548 U CN202742548 U CN 202742548U
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- workbench
- driven gear
- sapphire
- cutting machine
- driving
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Abstract
The utility model discloses a sapphire cutting machine, which comprises a machine body, a cutting line mechanism and a workbench, wherein the cutting line mechanism is arranged on the upper part of the machine body, the workbench is arranged on the lower part of the cutting line mechanism, a swinging mechanism is arranged under the workbench, the swinging mechanism comprises a servo motor, a driving gear and a driven gear, the driving gear is arranged on a driving shaft of the servo motor, the driven gear is rotatably arranged on the machine body, the upper peripheral surface of the driven gear is fixedly connected with the lower surface of the workbench, and the driving gear is engaged with the driven gear. Through the driving by the driving gear and the driven gear, the swinging angle of the workbench is accurately controlled, so the swinging of the sapphire cutting machine is more accurate, the line scratch on a wafer surface is greatly reduced, the flatness of a sapphire wafer is improved and is smaller than 0.01mm, and the stability is high.
Description
Technical field
The utility model relates to a kind of cutting machine, and particularly a kind of cutting machine of cutting sapphire belongs to the technical field that the sapphire cutting arranges.
Background technology
Sapphire is called again white stone, and it has good thermal conductivity, fabulous electrical characteristic and dielectric property, therefore, is widely used in industry, national defence, scientific research and civil area.Along with the fast development of LED and 3G mobile, sapphire wafer become the consumptive material that multirow is badly in need of.But sapphire is because its hardness is large and fragility is high, and the cutting difficulty is larger.
The inner circle cutting is adopted in traditional sapphire cutting, namely adopts inner circle cutting machine or circle cutting machine that sapphire is cut, and this cutting mode can only cut sheet, and loss is large; Also have and adopt the line cutting that sapphire is cut, but because sapphire hardness is large, cause easily the line of cut distortion, thereby, so that cut quality is relatively poor, and cause the waste of material.
Recently, Chinese patent " CN201120122986.1 " discloses a kind of Special multi-wire cutter for sapphire, this cutting machine comprises body, line of cut mechanism, waves workbench, lifting body, line of cut mechanism is arranged on the top of body, wave workbench and be arranged on the bottom of line of cut mechanism, workbench is waved in the lifting body connection, the lifting body driving is waved workbench and is moved up and down, waving workbench vacillates now to the left, now to the right under the driving of stepper motor, so that the workpiece that waves on the workbench cooperates with line of cut mechanism, finish the sapphire multi-wire saw.The utility model is dynamically adjusted the sapphire cutting angle, so that sapphire material is when cutting, can constantly adjust angle with waving workbench, so that line of cut contacts with material is less, reduce additional friction, simultaneously can greatly improve the line of cut feed speed, solved the slow problem of cutting speed that sapphire causes because of the hardness height, make 2-4 that Speed improving arrives common multi-line cutting machine doubly, but this mechanism directly drives workbench by stepper motor and swings, in the cutting process, motor corrodes easily; In addition, stability and the accuracy of this cutting machine are poor, and the sapphire wafer surface line marker of cutting is many, and the wafer plane degree is relatively poor.
The utility model content
Technical problem to be solved in the utility model provides a kind of sapphire cutting machine, and this cutting machine stable performance, precision height and overload capacity are strong, and is good by the wafer plane degree of the utility model cutting.
In order to solve the problems of the technologies described above, a kind of sapphire cutting machine of the utility model, comprise body, line of cut mechanism, workbench, line of cut mechanism is arranged on the top of body, workbench is arranged on the bottom of line of cut mechanism, be provided with swing mechanism below the described workbench, driving workbench by swing mechanism swings, wherein, described swing mechanism comprises servomotor, driving gear, driven gear, described driving gear is installed on the driving shaft of described servomotor, driven gear is rotating to be arranged on the body, and side face is fixedly connected with the lower surface of described workbench on the described driven gear, main, driven gear is meshed.
Above-mentioned sapphire cutting machine wherein, is respectively equipped with limit switch below the described workbench two ends, and described limit switch is fixedly installed on the described body.
Above-mentioned sapphire cutting machine, wherein, described body is provided with the PLC control system.
Drive driving shaft by servomotor during the utility model work and do positive and negative rotation, driving shaft carries out transmission by the engagement of driving and driven gear to workbench, thereby realize the positive and negative rotation of workbench, owing to carry out transmission by driving and driven gear, can control more accurately the pendulum angle of workbench, thereby, make swing of the present utility model more accurate, greatly reduced the stria of wafer surface, improved the flatness of sapphire wafer, make the flatness of wafer less than 0.01mm, and good stability of the present utility model; In addition, owing to be respectively equipped with limit switch below the workbench two ends, when workbench reaches the limit of the position, can workbench be returned by triggering limit switch, avoid the damage of cutting machine, thereby, prolonged service life of the present utility model, further improved stability of the present utility model; Again because described body is provided with the PLC control system, can adjust the angle that workbench swings by the PLC control system, guarantee that the contact-making surface of line of cut and sapphire bar is minimum, reduce extra frictional force, greatly improve the cutting speed of this cutting machine, guaranteed the cut quality of wafer.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is right view of the present utility model.
Fig. 3 is the structural representation of swing mechanism in the utility model.
The specific embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
As shown in the figure, in order to solve the problems of the technologies described above, a kind of sapphire cutting machine of the utility model, comprise body 1, line of cut mechanism 2, workbench 3, line of cut mechanism 2 is arranged on the top of body 1, workbench 3 is arranged on the bottom of line of cut mechanism 2, be provided with swing mechanism 4 below the described workbench 2, driving workbench 2 by swing mechanism 4 swings, described swing mechanism 4 comprises servomotor 41, driving gear 42, driven gear 43, described driving gear 42 is installed on the driving shaft 411 of described servomotor 41, driven gear 43 is by axle or other modes are rotating is arranged on the body 1, side face is fixedly connected with the lower surface of described workbench 2 on the described driven gear 43, driven gear 43 is generally the arc gear wheel of semicircle, main, driven gear 42,43 are meshed, during transmission, driving gear 42 drives driven gear 43 by the engagement with driven gear 43 and rotates.Drive driving shaft 411 by servomotor 41 during work and do positive and negative rotation, driving shaft 411 carries out transmission by driving and driven gear 42,43 engagement to workbench 2, thereby realize the positive and negative swing of workbench 2, owing to carry out transmission by driving and driven gear 42,43, can control more accurately the pendulum angle of workbench 2, thereby, make swing of the present utility model more accurate, greatly reduce the stria of wafer surface, improved the flatness of sapphire wafer.
Swing in order to ensure workbench, be respectively equipped with limit switch 5 below workbench 2 two ends, described limit switch 5 is fixedly installed on the described body 1, when workbench 2 reaches the limit of the position, can by trigger limit switch 5 just workbench 2 return, avoid the damage of cutting machine, thereby, prolong service life of the present utility model, further improved stability of the present utility model.
For make things convenient for use can, body 1 is provided with PLC control system 6, by the PLC control system angle that workbench swings is adjusted, the contact-making surface of guaranteeing line of cut and sapphire bar is minimum, reduce extra frictional force, greatly improve the cutting speed of this cutting machine, guaranteed the cut quality of wafer.
Claims (3)
1. sapphire cutting machine, comprise body, line of cut mechanism, workbench, line of cut mechanism is arranged on the top of body, workbench is arranged on the bottom of line of cut mechanism, be provided with swing mechanism below the described workbench, driving workbench by swing mechanism swings, it is characterized in that, described swing mechanism comprises servomotor, driving gear, driven gear, described driving gear is installed on the driving shaft of described servomotor, driven gear is rotating to be arranged on the body, side face is fixedly connected with the lower surface of described workbench on the described driven gear, and is main, driven gear is meshed.
2. sapphire cutting machine as claimed in claim 1 is characterized in that, is respectively equipped with limit switch below the described workbench two ends, and described limit switch is fixedly installed on the described body.
3. sapphire cutting machine as claimed in claim 1 or 2 is characterized in that, described body is provided with the PLC control system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220394244 CN202742548U (en) | 2012-08-09 | 2012-08-09 | Sapphire cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220394244 CN202742548U (en) | 2012-08-09 | 2012-08-09 | Sapphire cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202742548U true CN202742548U (en) | 2013-02-20 |
Family
ID=47701994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220394244 Expired - Fee Related CN202742548U (en) | 2012-08-09 | 2012-08-09 | Sapphire cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202742548U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102806610A (en) * | 2012-08-09 | 2012-12-05 | 镇江翔龙蓝晶科技有限公司 | Cutting machine for sapphire |
| CN104118070A (en) * | 2014-08-05 | 2014-10-29 | 湖南奥泰克科技有限公司 | Dual-swinging cutting device for sapphires |
| CN104647622A (en) * | 2015-02-11 | 2015-05-27 | 苏州硅峰太阳能科技有限公司 | Oscillating efficient multi-thread squarer for silicon ingot |
-
2012
- 2012-08-09 CN CN 201220394244 patent/CN202742548U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102806610A (en) * | 2012-08-09 | 2012-12-05 | 镇江翔龙蓝晶科技有限公司 | Cutting machine for sapphire |
| CN104118070A (en) * | 2014-08-05 | 2014-10-29 | 湖南奥泰克科技有限公司 | Dual-swinging cutting device for sapphires |
| CN104647622A (en) * | 2015-02-11 | 2015-05-27 | 苏州硅峰太阳能科技有限公司 | Oscillating efficient multi-thread squarer for silicon ingot |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130220 Termination date: 20140809 |
|
| EXPY | Termination of patent right or utility model |