CN202730241U - Microetching waste liquor regeneration and recovery system - Google Patents
Microetching waste liquor regeneration and recovery system Download PDFInfo
- Publication number
- CN202730241U CN202730241U CN 201220423429 CN201220423429U CN202730241U CN 202730241 U CN202730241 U CN 202730241U CN 201220423429 CN201220423429 CN 201220423429 CN 201220423429 U CN201220423429 U CN 201220423429U CN 202730241 U CN202730241 U CN 202730241U
- Authority
- CN
- China
- Prior art keywords
- water pump
- vessel
- regenerated liquid
- tank
- waste liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002699 waste material Substances 0.000 title claims abstract description 62
- 238000011084 recovery Methods 0.000 title claims abstract description 22
- 230000008929 regeneration Effects 0.000 title claims abstract description 20
- 238000011069 regeneration method Methods 0.000 title claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 80
- 238000005530 etching Methods 0.000 claims abstract description 61
- 239000007788 liquid Substances 0.000 claims description 129
- 230000001105 regulatory effect Effects 0.000 claims description 37
- 230000001276 controlling effect Effects 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 13
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 229910052802 copper Inorganic materials 0.000 abstract description 11
- 239000010949 copper Substances 0.000 abstract description 11
- 230000007613 environmental effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 7
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 241000500881 Lepisma Species 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005363 electrowinning Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- CABDFQZZWFMZOD-UHFFFAOYSA-N hydrogen peroxide;hydrochloride Chemical group Cl.OO CABDFQZZWFMZOD-UHFFFAOYSA-N 0.000 description 1
- 239000003317 industrial substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000026676 system process Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Images
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
The utility model discloses a microetching waste liquor regeneration and recovery system. The system comprises an etching tank and a waste liquor storage tank communicated with the etching tank, the waste liquor storage tank is connected with a central two-stage system which is communicated with a regeneration liquor adjusting tank, the regeneration liquor adjusting tank is connected with a regeneration liquor storage tank which is communicated with the etching tank, water pumps are arranged between the etching tank and the waste liquor storage tank, between the waste liquor storage tank and the central two-stage system, between the central two-stage system and the regeneration liquor adjusting tank, between the regeneration liquor adjusting tank and the waste liquor storage tank as well as between the waste liquor storage tank and the etching tank and are simultaneously connected with a PLC (programmable logic controller) control system, and the etching tank, the central two-stage system and the regeneration liquor adjusting tank are simultaneously connected with the PLC control system. The recovery system is simple in principle, brings direct economic benefit and is high in copper recovery efficiency, reutilization of microetching liquor is achieved, cost is saved, cylinder changing time of a production line is shortened, production efficiency is improved, environmental protection pressure of factories is relieved, and social image of enterprises is improved.
Description
Technical field
The utility model relates to recovery system, especially relates to micro-etched waste liquid regeneration recovery system, the micro-etched waste liquid that discharges for the treatment of (PCB) printed circuit board factory.
Background technology
The typical process of printed circuit board (pcb) processing adopts " graphic plating method ".Namely then elder generation's (being the visuals of circuit) preplating one deck slicker solder resist layer on the outer Copper Foil part that needs to keep of plate erodes remaining Copper Foil with chemical mode, is called etching.The PCB etching is divided into alkalescence and two kinds of acidity, and one is hydrochloric acid hydrogen peroxide system (acidity); Two is ammonium chloride ammoniacal liquor system (alkalescence).Alkaline etching liquid mainly is applicable to graphic plating metal resist layer, such as plated with gold, nickel, tinsel, the etching of the printed board of tin-nickel alloy and tin, its characteristics are that etch-rate is fast, and lateral erosion is little, molten copper ability is high, etch-rate is controlled easily, and in the printed circuit board production process, etching is a very important technological process, needing to use a large amount of etching solutions, therefore also is an operation that produces the severe contamination source.Traditional governance approach is: specify the company that qualification is arranged to reclaim by environmental administration, adopt simple way, wherein contained copper is processed into copper sulfate, then process slightly discharging.This significant wastage that has not only caused resource is (in every kilolitre alkaline etching liquid except cupric, also have the ammonium chloride more than 240 kilograms, about 30 kilograms the chemical substances such as liquefied ammonia), and waste liquid does not obtain real radical cure, has therefore formed the transfer of source of pollution.
Micro-etching solution content of copper ion after etching increases, and peroxide concentrations reduces, and loses etch capabilities.Low (the micro-etched waste liquid copper content is 15-35g/L to this type of micro-etched waste liquid with respect to the etching waste liquor copper content, the etching waste liquor copper content is 150g/L), it is little to recycle value, there is not special company to reclaim, the small-sized PCB enterprise that has is with its direct discharging, severe contamination environment, larger PCB enterprise includes it in waste water system, use conventional methods such as neutralisation, substitution method, directly discharging after disposing, but these class methods can consume a large amount of industrial chemicals such as soda acid, often cause secondary pollution, and are incomplete to the recovery of copper utilization simultaneously, wasted the metallic copper that has in a large number high economic worth, and PCB enterprise has a strong impact on production schedule when changing cylinder, waste of manpower and material resources, and this does not all meet the circular economy industrial policy of resource-conserving.
The utility model content
The purpose of this utility model is to overcome the shortcoming and defect of above-mentioned prior art, micro-etched waste liquid regeneration recovery system is provided, and the principle of this recovery system is easy, has brought direct economic benefit, high to recovery of copper efficient, recycle micro-etching solution, saved cost, reduced production line and changed the cylinder time, improved production efficiency, allow enterprise accomplish that fundamentally cleaner production is pollution-free, reduce factory's environmental protection pressure, promoted the social image of enterprise.
The purpose of this utility model is achieved through the following technical solutions: micro-etched waste liquid regeneration recovery system, the waste liquid hold-up vessel that comprises etching bath and be communicated with etching bath, described waste liquid hold-up vessel is connected with the center two-stage system, the center two-stage system is connected with the regenerated liquid regulating tank, described regenerated liquid regulating tank is connected with the regenerated liquid hold-up vessel, regenerated liquid hold-up vessel and etching bath are communicated with, between described etching bath and the waste liquid hold-up vessel, between waste liquid hold-up vessel and the center two-stage system, between center two-stage system and the regenerated liquid regulating tank, between regenerated liquid regulating tank and the regenerated liquid hold-up vessel, be provided with water pump between regenerated liquid hold-up vessel and the etching bath, described water pump is connected with the PLC Controlling System simultaneously, and etching bath, center two-stage system and regenerated liquid regulating tank are connected with the PLC Controlling System simultaneously.
Further, described water pump comprises water pump one, water pump two, water pump three, water pump four and water pump five, and water pump one, water pump two, water pump three, water pump four and water pump five are connected with the PLC Controlling System simultaneously, water pump one is arranged between etching bath and the waste liquid hold-up vessel, and is communicated with etching bath and waste liquid hold-up vessel respectively; Water pump two is arranged between waste liquid hold-up vessel and the center two-stage system, and is communicated with waste liquid hold-up vessel and center two-stage system respectively; Water pump three is arranged between center two-stage system and the regenerated liquid regulating tank, and is communicated with center two-stage system and regenerated liquid regulating tank respectively; Water pump four is arranged between regenerated liquid regulating tank and the regenerated liquid hold-up vessel, and is communicated with regenerated liquid regulating tank and regenerated liquid hold-up vessel respectively; Water pump five is arranged between regenerated liquid hold-up vessel and the etching bath, and is communicated with regenerated liquid hold-up vessel and etching bath respectively.
Further, described water pump one is connected the top with the bottom of etching bath respectively and is connected with the waste liquid hold-up vessel.
Further, described water pump two is connected the top with the bottom of waste liquid hold-up vessel respectively and is connected with the center two-stage system.
Further, described water pump three is connected the top with the bottom of center two-stage system respectively and is connected with the regenerated liquid regulating tank.
Further, described water pump four is connected the top with the bottom of regenerated liquid regulating tank respectively and is connected with the regenerated liquid hold-up vessel.
Further, described water pump five is connected the bottom with the bottom of regenerated liquid hold-up vessel respectively and is connected with etching bath.
In sum, the beneficial effects of the utility model are: the principle of this recovery system is easy, brought direct economic benefit, high to recovery of copper efficient, recycle micro-etching solution, saved cost, reduced production line and changed the cylinder time, improved production efficiency, allowed enterprise accomplish that fundamentally cleaner production is pollution-free, reduce factory's environmental protection pressure, promoted the social image of enterprise.
Description of drawings
Fig. 1 is synoptic diagram of the present utility model.
Mark and corresponding component title in the accompanying drawing: 1-etching bath; 2-water pump one; 3-waste liquid hold-up vessel; 4-water pump two; 5-center two-stage system; 6-water pump three; 7-regenerated liquid regulating tank; 8-PLC Controlling System; 9-water pump four; 10-regenerated liquid hold-up vessel; 11-water pump five; 12-pipeline.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but embodiment of the present utility model is not limited only to this.
Embodiment:
As shown in Figure 1, micro-etched waste liquid regeneration recovery system, comprise etching bath 1 and the waste liquid hold-up vessel 3 that is communicated with etching bath 1, described waste liquid hold-up vessel 3 is connected with center two-stage system 5, center two-stage system 5 is connected with regenerated liquid regulating tank 7, described regenerated liquid regulating tank 7 is connected with regenerated liquid hold-up vessel 10, regenerated liquid hold-up vessel 10 and etching bath 1 are communicated with, between described etching bath 1 and the waste liquid hold-up vessel 3, between waste liquid hold-up vessel 3 and the center two-stage system 5, between center two-stage system 5 and the regenerated liquid regulating tank 7, between regenerated liquid regulating tank 7 and the regenerated liquid hold-up vessel 10, be provided with water pump between regenerated liquid hold-up vessel 10 and the etching bath 1, described water pump is connected with PLC Controlling System 8 simultaneously, and etching bath 1, center two-stage system 5 and regenerated liquid regulating tank 7 are connected with PLC Controlling System 8 simultaneously.Utilize PLC control, the reaction times is fast, controls easier.
Described water pump comprises water pump 1, water pump 24, water pump 36, water pump 49 and water pump 5 11, and water pump 1, water pump 24, water pump 36, water pump 49 and water pump 5 11 are connected with PLC Controlling System 8 simultaneously, water pump 1 is arranged between etching bath 1 and the waste liquid hold-up vessel 3, and is communicated with etching bath 1 and waste liquid hold-up vessel 3 respectively; Water pump 24 is arranged between waste liquid hold-up vessel 3 and the center two-stage system 5, and is communicated with waste liquid hold-up vessel 3 and center two-stage system 5 respectively; Water pump 36 is arranged between center two-stage system 5 and the regenerated liquid regulating tank 7, and is communicated with center two-stage system 5 and regenerated liquid regulating tank 7 respectively; Water pump 49 is arranged between regenerated liquid regulating tank 7 and the regenerated liquid hold-up vessel 10, and is communicated with regenerated liquid regulating tank 7 and regenerated liquid hold-up vessel 10 respectively; Water pump 5 11 is arranged between regenerated liquid hold-up vessel 10 and the etching bath 1, and is communicated with regenerated liquid hold-up vessel 10 and etching bath 1 respectively.
Described water pump 1 is connected with the top of being connected with the waste liquid hold-up vessel in the bottom of etching bath 1 respectively; Described water pump 24 is connected with the top of being connected with the center two-stage system in the bottom of waste liquid hold-up vessel 3 respectively; Described water pump 36 is connected with the top of being connected with the regenerated liquid regulating tank in the bottom of center two-stage system 5 respectively.The top that is arranged on equipment is the conveniently interference of pressure when adding, and being arranged on the bottom is to utilize action of gravitation the liquid in the equipment can be emitted fully.
Described water pump 49 is connected with the top of being connected with the regenerated liquid hold-up vessel in the bottom of regenerated liquid regulating tank 7 respectively.The convenient regenerated liquid that regulates in the regenerated liquid regulating tank 7 is drawn in the regenerated liquid hold-up vessel 10 stores, be provided with pharmacy jar on the regenerated liquid regulating tank 7, after adding the loss medicament in the micro etching solution after the electrolysis, adjust to suitable concentration and content, arrive the etchant concentration of need of production.
Described water pump 5 11 is connected with the bottom of being connected with etching bath in the bottom of regenerated liquid hold-up vessel 10 respectively.Conveniently the regenerated liquid in the regenerated liquid hold-up vessel 10 is drawn in the etching bath 1.
Principle of work: the useless pipeline that connects by liquid water pump 1 of the microetch of producing in factory's etching bath 1 is transported to waste liquid hold-up vessel 3 and stores, after the waste liquid that stores reaches certain volume, be drawn into by water pump 24 and carry out electrolysis in the center two-stage system 5, cupric ion in the waste liquid is discharged center two-stage system 5 after by electrowinning, the treatment solution that obtains in the center two-stage system 5 is drawn into by water pump 36 and carries out chemicals addition control in the regenerated liquid regulating tank 7, reaching regenerated liquid recycling water pump 49 after the concentration of micro-etching solution is drawn in the regenerated liquid hold-up vessel 10 and stores, volume according to etching bath 1 internal solution utilizes water pump 5 11 to extract, so that the production of system can continue, operational process all is to finish under the control of PLC Controlling System 8.
Copper loss electricity of every product is less than 4000 degree, and current consumption is lower than traditional electrolysis mode, has saved production cost, and the ability that this system processes micro-etched waste liquid per month is 10 tons to 50 tons, and efficient is high.
Take aforesaid way, just can realize preferably the utility model.
Claims (7)
1. micro-etched waste liquid regeneration recovery system, it is characterized in that: comprise etching bath (1) and the waste liquid hold-up vessel (3) that is communicated with etching bath (1), described waste liquid hold-up vessel (3) is connected with center two-stage system (5), center two-stage system (5) is connected with regenerated liquid regulating tank (7), described regenerated liquid regulating tank (7) is connected with regenerated liquid hold-up vessel (10), regenerated liquid hold-up vessel (10) and etching bath (1) are communicated with, between described etching bath (1) and the waste liquid hold-up vessel (3), between waste liquid hold-up vessel (3) and the center two-stage system (5), between center two-stage system (5) and the regenerated liquid regulating tank (7), between regenerated liquid regulating tank (7) and the regenerated liquid hold-up vessel (10), be provided with water pump between regenerated liquid hold-up vessel (10) and the etching bath (1), described water pump is connected with PLC Controlling System (8) simultaneously, and etching bath (1), center two-stage system (5) and regenerated liquid regulating tank (7) are connected with PLC Controlling System (8) simultaneously.
2. micro-etched waste liquid according to claim 1 regeneration recovery system, it is characterized in that: described water pump comprises water pump one (2), water pump two (4), water pump three (6), water pump four (9) and water pump five (11), and water pump one (2), water pump two (4), water pump three (6), water pump four (9) and water pump five (11) are connected with PLC Controlling System (8) simultaneously, water pump one (2) is arranged between etching bath (1) and the waste liquid hold-up vessel (3), and is communicated with etching bath (1) and waste liquid hold-up vessel (3) respectively; Water pump two (4) is arranged between waste liquid hold-up vessel (3) and the center two-stage system (5), and is communicated with waste liquid hold-up vessel (3) and center two-stage system (5) respectively; Water pump three (6) is arranged between center two-stage system (5) and the regenerated liquid regulating tank (7), and is communicated with center two-stage system (5) and regenerated liquid regulating tank (7) respectively; Water pump four (9) is arranged between regenerated liquid regulating tank (7) and the regenerated liquid hold-up vessel (10), and is communicated with regenerated liquid regulating tank (7) and regenerated liquid hold-up vessel (10) respectively; Water pump five (11) is arranged between regenerated liquid hold-up vessel (10) and the etching bath (1), and is communicated with regenerated liquid hold-up vessel (10) and etching bath (1) respectively.
3. micro-etched waste liquid according to claim 2 regeneration recovery system, it is characterized in that: described water pump one (2) is connected 3 with the bottom of etching bath (1) with the waste liquid hold-up vessel respectively) the top be connected.
4. micro-etched waste liquid according to claim 2 regeneration recovery system, it is characterized in that: described water pump two (4) is connected 5 with the bottom of waste liquid hold-up vessel (3) with the center two-stage system respectively) the top be connected.
5. micro-etched waste liquid according to claim 2 regeneration recovery system, it is characterized in that: described water pump three (6) is connected 7 with the bottom of center two-stage system (5) with the regenerated liquid regulating tank respectively) the top be connected.
6. micro-etched waste liquid according to claim 2 regeneration recovery system, it is characterized in that: described water pump four (9) is connected 10 with the bottom of regenerated liquid regulating tank (7) with the regenerated liquid hold-up vessel respectively) the top be connected.
7. micro-etched waste liquid according to claim 2 regeneration recovery system, it is characterized in that: described water pump five (11) is connected 1 with the bottom of regenerated liquid hold-up vessel (10) with etching bath respectively) the bottom be connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220423429 CN202730241U (en) | 2012-08-24 | 2012-08-24 | Microetching waste liquor regeneration and recovery system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220423429 CN202730241U (en) | 2012-08-24 | 2012-08-24 | Microetching waste liquor regeneration and recovery system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202730241U true CN202730241U (en) | 2013-02-13 |
Family
ID=47655958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220423429 Expired - Fee Related CN202730241U (en) | 2012-08-24 | 2012-08-24 | Microetching waste liquor regeneration and recovery system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202730241U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103628068A (en) * | 2012-08-24 | 2014-03-12 | 成都虹华环保科技有限公司 | Microetching waste liquor regeneration and recovery system |
| CN104261689A (en) * | 2014-08-25 | 2015-01-07 | 江苏亨通光电股份有限公司 | An accuracy control device of an etching technology in optical fiber preform production |
-
2012
- 2012-08-24 CN CN 201220423429 patent/CN202730241U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103628068A (en) * | 2012-08-24 | 2014-03-12 | 成都虹华环保科技有限公司 | Microetching waste liquor regeneration and recovery system |
| CN104261689A (en) * | 2014-08-25 | 2015-01-07 | 江苏亨通光电股份有限公司 | An accuracy control device of an etching technology in optical fiber preform production |
| CN104261689B (en) * | 2014-08-25 | 2016-08-31 | 江苏亨通光导新材料有限公司 | The precise control device of etching technique in the production of a kind of preform |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204417598U (en) | A kind of cupric micro-etched waste liquid recycling device | |
| CN104630825A (en) | Device and process for electrolytically extracting copper in acidic etching liquid | |
| CN202359203U (en) | Micro-etching fluid regeneration recovery system | |
| CN204982052U (en) | Zero release acid etching waste liquid recycle and regeneration system | |
| CN102618873B (en) | Ammonia washing water circulation system and method of PCB (Printed Circuit Board) etching line | |
| CN105239072A (en) | Electroplating hanger deplating solution and deplating method thereof | |
| CN103628068A (en) | Microetching waste liquor regeneration and recovery system | |
| CN202492580U (en) | Acid etching liquid recycling device of PCB (Printed Circuit Board) | |
| CN111621788A (en) | Method for recovering copper from alkaline etching waste liquid | |
| CN103265094A (en) | Method for recycling nitric acid and copper from waste water generated in production of printed circuit board | |
| CN102560499A (en) | Device for recycling printed circuit board acidic etching solution | |
| CN202730241U (en) | Microetching waste liquor regeneration and recovery system | |
| CN204151415U (en) | A kind of regenerating alkaline etching liquid circulating production line | |
| CN101024546A (en) | Copper etching liquid regeneration circulation method and apparatus | |
| CN101285195A (en) | Indirect regeneration for waste etching solution and recovery processing system for copper | |
| CN101003394A (en) | System and method for treating waste solution from acidity etching printed circuit board | |
| CN103628064A (en) | Recycling system of acid etching liquid | |
| CN101988199A (en) | Micro-etching solution cyclic regeneration and copper reclamation device | |
| CN204138483U (en) | Pickling nickel waste water reclaims cyclic regeneration device | |
| CN203382824U (en) | Device for recovering refined copper from low-copper-content wastewater | |
| CN202499908U (en) | Alkaline etching liquid regeneration and copper recovery system | |
| CN103436916B (en) | A kind of technique and device reclaiming smart copper from Low copper content wastewater | |
| CN202519336U (en) | Ammonia washing water circulating system for PCB (Printed Circuit Board) etching line | |
| CN205222888U (en) | Lose waste liquid treatment device a little | |
| CN205529064U (en) | Copper device is retrieved in acid etching solution regeneration |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: CHENGDU HONGHUA ENVIRONMENTAL PROTECTION TECHNOLOG Free format text: FORMER NAME: CHENGDU HONGHUA ENVIRONMENTAL PROTECTION SCIENCE AND TECHNOLOGY CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 610000 Chengdu province high tech Zone, West core road, No. 4, No. Patentee after: Chengdu Honghua Environmental Protection Technology Co., Ltd. Address before: 610000 Chengdu province high tech Zone, West core road, No. 4, No. Patentee before: Chengdu Honghua Environmental Protection Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130213 Termination date: 20200824 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |