CN202721126U - Integrated optical sensor package - Google Patents
Integrated optical sensor package Download PDFInfo
- Publication number
- CN202721126U CN202721126U CN 201220305812 CN201220305812U CN202721126U CN 202721126 U CN202721126 U CN 202721126U CN 201220305812 CN201220305812 CN 201220305812 CN 201220305812 U CN201220305812 U CN 201220305812U CN 202721126 U CN202721126 U CN 202721126U
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- optical sensor
- sensor
- ambient light
- integrated
- type optical
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Abstract
The utility model relates to an integrated optical sensor package. The integrated optical sensor package comprises a package substrate, an ambient light sensor, an approximate light sensor, an image sensor, and a package cover, wherein the package substrate is positioned at the bottom, the ambient light sensor, the approximate light sensor and the image sensor are arranged on the package substrate, and the package cover is mutually sealed with the package substrate. The integrated optical sensor package provided by the utility model can reduce the package volume and reduce the manufacturing cost.
Description
Technical field
The utility model relates to sensor package, especially relates to a kind of the integration environment optical sensor, proximity transducer and image sensor package.
Background technology
In recent years, along with popularizing and the development of 3G of notebook, smart mobile phone etc., ambient light sensor, proximity transducer and imageing sensor have obtained rapid popularization.Ambient light sensor can ambient light brightness, and on this basis, automatically regulate the brightness of display backlight, to reduce the power consumption of product, reach the purpose of green energy conservation and intelligent product.Proximity transducer can detect the user and mobile phone be pressed close in one's ear to begin the action of making a phone call, and this moment is can closing hand phone backlight, reaches energy-conservation and prevents the purpose of misoperation.Imageing sensor in the camera of notebook and the front-facing camera of smart mobile phone can satisfy the demands such as auto heterodyne and video calling.
Proximity transducer need to receive the infrared light that is reflected back, and ambient light sensor need to be avoided the interference of infrared light as far as possible, thereby so that ambient light sensor to the judged result of environmental light brightness relatively near the sensation of human eye, so need co-ordination between proximity transducer and the ambient light sensor.In the existing application, three kinds of optical sensors are device independently normally, increased like this production cost, and the sensor device volume of making is larger.
The utility model content
The technical problems to be solved in the utility model provides a kind of integrated-type optical sensor package, and it is large that this integrated-type optical sensor package can solve existing sensor encapsulation volume, the problem that manufacturing cost is high.
In order to solve the problems of the technologies described above, the technical scheme that the utility model utilizes provides a kind of integrated-type optical sensor package, comprise the base plate for packaging that is positioned at the bottom and be positioned at ambient light sensor above the described base plate for packaging, near optical sensor, imageing sensor and the cap that mutually seals with described base plate for packaging.
Preferably, the integrated-type optical sensor package comprises the infrared transmitter that is positioned at above the described base plate for packaging and is sealed in described cap.Infrared transmitter comprises infrared LED and drive circuit.
Preferably, infrared transmitter, ambient light sensor, have respectively camera lens near the top of optical sensor and imageing sensor.In the preparation process of integrated-type optical sensor package, prepare ambient light sensor at same wafer, near optical sensor and imageing sensor, and adopt respectively the preparation of wafer-level lens manufacturing process above at infrared transmitter, ambient light sensor, near optical sensor and imageing sensor.
Preferably, the camera lens of imageing sensor top has infrared cut-off light filtering films.Preferred, the camera lens of ambient light sensor top has infrared cut-off light filtering films.Infrared cut-off light filtering films can effectively avoid infrared light to the interference of transducer.
Preferably, ambient light sensor, be formed on a slice chip near optical sensor and imageing sensor, namely adopt three-in-one structure.Ambient light sensor, have the change-over circuit that is consisted of by the MOS device near the chip at optical sensor and imageing sensor place, be convenient to the co-ordination between the transducer, and can produce efficient Comprehensive Control scheme.Preferred, infrared transmitter, ambient light sensor, be formed on a slice chip near optical sensor and imageing sensor, namely adopt the structures of four unifications.Wherein, ambient light sensor, can be formed on the same chip near optical sensor and imageing sensor, also can be formed on the different chips.Infrared transmitter and ambient light sensor, can be formed on the same chip near optical sensor and imageing sensor, also can be formed on the different chips.
Preferably, cap is made by the infrared shielding material.
Preferably, cap respectively directly over infrared transmitter, ambient light sensor, near optical sensor and imageing sensor the corresponding position be provided with window.
Preferably, comprise in the described cap that at least one connects the dividing plate of described base plate for packaging and described cap, described infrared transmitter is positioned at a side of described dividing plate, described ambient light sensor, is positioned at the opposite side of described dividing plate near optical sensor and imageing sensor.Those skilled in the art as can be known, the dividing plate of connection encapsulation substrate and cap can be more than one, can also be required a plurality of, a plurality of dividing plates can be with ambient light sensor, separate respectively near optical sensor and imageing sensor, also can be with ambient light sensor, be spaced from each other with another one near wherein two of optical sensor and imageing sensor.Dividing plate also can be the preparation of infrared shielding material, can effectively with the infrared light shielding, avoid transducer is impacted.
Preferably, ambient light sensor, have the transparent support plate parallel with described base plate for packaging near optical sensor and imageing sensor top, ambient light sensor, near the camera lens of optical sensor and imageing sensor top be positioned at above the described transparent support plate and with described transparent support plate be the connecting hole that integrated or described camera lens is positioned at described transparent support plate.
Preferably, infrared transmitter top has the transparent support plate parallel with described base plate for packaging, described camera lens be positioned at above the described transparent support plate and with described transparent support plate be the connecting hole that integrated or described camera lens is positioned at described transparent support plate.
Preferably, has pad below transparent support plate and the described ambient light sensor, near having cavity between optical sensor and the imageing sensor, described transparent support plate.
Preferably, described cap is transparent.Transparent cap can be prepared by the infrared shielding material, cap with infrared transmitter and near optical sensor directly over the corresponding position be provided with window, cap can be respectively with ambient light sensor and imageing sensor directly over the corresponding position be provided with window, also can with ambient light sensor and imageing sensor directly over the corresponding position do not establish window.Transparent cap also can be non-infrared shielding material preparation, cap can be provided with window in corresponding position with infrared transmitter, ambient light sensor, imageing sensor and directly near optical sensor, also can not have window in corresponding position with infrared transmitter, ambient light sensor, imageing sensor and directly near optical sensor.Cap with infrared transmitter directly over the corresponding position window can so that Infrared effectively send, cap with ambient light sensor and imageing sensor directly over the window of corresponding position can be so that visible light arrives transducer.Cap with near optical sensor directly over the window of corresponding position can be so that near on arriving near optical sensor near the infrared light of optical sensor.
Preferably, cap is Split type structure, the cap that is used for described infrared transmitter be used for described ambient light sensor, minute be arranged near the cap of optical sensor and imageing sensor.Also can be for the cap of described infrared transmitter be used for described ambient light sensor, be one near the cap of optical sensor and imageing sensor.
Preferably, described cap comprises that being positioned at described base plate for packaging encapsulation side wall on every side pushes up with the encapsulation that is positioned at above the described encapsulation side wall.The encapsulation top can be planar top, also can be the top with certain circular arc.
The utility model has the advantage of, with ambient light sensor, be in the same place near optical sensor and image sensor package, reduced the volume of encapsulation, reduce production costs.
Prepare infrared transmitter, ambient light sensor at same chip, near optical sensor and imageing sensor, can get up with the CMOS process compatible, improve integrated level, simplify the technique preparation, save cost.
The manufacturing process of wafer-level lens can reduce technological process in the utility model, raises the efficiency, simultaneously effectively imaging of wafer-level lens.With the integrated supporting bracket of camera lens except can playing the effect of a support camera lens, the pad below can also engage is regulated lens focus.
The infrared shielding material of cap can further with the shielding of the infrared light in infrared transmitter or the environment, be avoided imageing sensor and ambient light sensor are impacted.
Description of drawings
Fig. 1 is the schematic perspective view of the utility model execution mode.
Fig. 2 is the schematic perspective view that removes cap shown in Figure 1.
Fig. 3 is the cutaway view along A-A line among Fig. 1.
Fig. 4 is that the first distressed structure of the utility model execution mode is along the cutaway view of A-A line among Fig. 1.
Fig. 5 is that the second distressed structure of the utility model execution mode is along the cutaway view of A-A line among Fig. 1.
Fig. 6 is that the third distressed structure of the utility model execution mode is along the cutaway view of A-A line among Fig. 1.
Embodiment
Below cooperate accompanying drawing and embodiment of the present utility model, further set forth the technical scheme that the utility model is taked for the attainment of one's purpose.
The utility model provides a kind of integrated-type optical sensor package, comprise the base plate for packaging that is positioned at the bottom and be positioned at ambient light sensor above the described base plate for packaging, near optical sensor, imageing sensor and the cap that mutually seals with described base plate for packaging.
In embodiment of the present utility model, the integrated-type optical sensor package comprises the infrared transmitter that is positioned at above the described base plate for packaging and is sealed in described cap.Infrared transmitter comprises infrared LED and drive circuit in addition.
Further, infrared transmitter, ambient light sensor, have respectively camera lens near the top of optical sensor and imageing sensor.In the preparation process of integrated-type optical sensor package, prepare ambient light sensor at same wafer, near optical sensor and imageing sensor, and adopt respectively the preparation of wafer-level lens manufacturing process above at infrared transmitter, ambient light sensor, near optical sensor and imageing sensor.
In addition, the camera lens of imageing sensor top has infrared cut-off light filtering films.The camera lens of ambient light sensor top has infrared cut-off light filtering films.
In first embodiment of the present utility model, ambient light sensor, be formed on a slice chip near optical sensor and imageing sensor.Ambient light sensor, have the change-over circuit that is consisted of by the MOS device near the chip at optical sensor and imageing sensor place, be convenient to the co-ordination between the transducer, and can produce efficient Comprehensive Control scheme.
In second embodiment of the present utility model, infrared transmitter, ambient light sensor, be formed on a slice chip near optical sensor and imageing sensor.Those skilled in the art ambient light sensor, can be formed on the same chip near optical sensor and imageing sensor as can be known, also can be formed on the different chips.Infrared transmitter and ambient light sensor, can be formed on the same chip near optical sensor and imageing sensor, also can be formed on the different chips.
Cap is made by the infrared shielding material.
In the above-described embodiment, cap respectively directly over infrared transmitter, ambient light sensor, near optical sensor and imageing sensor the corresponding position be provided with window.
Comprise in the described cap that at least one connects the dividing plate of described base plate for packaging and described cap, described infrared transmitter is positioned at a side of described dividing plate, described ambient light sensor, is positioned at the opposite side of described dividing plate near optical sensor and imageing sensor.Those skilled in the art as can be known, the dividing plate of connection encapsulation substrate and cap can be more than one, can also be required a plurality of, a plurality of dividing plates can be with ambient light sensor, separate respectively near optical sensor and imageing sensor, also can be with ambient light sensor, be spaced from each other with another one near wherein two of optical sensor and imageing sensor.Dividing plate also can be the preparation of infrared shielding material, can effectively with the infrared light shielding, avoid transducer is impacted.
Infrared transmitter, ambient light sensor, have the transparent support plate parallel with described base plate for packaging near optical sensor and imageing sensor top, infrared transmitter, ambient light sensor, near the camera lens of optical sensor and imageing sensor top be positioned at above the described transparent support plate and with described transparent support plate be the connecting hole that integrated or described camera lens is positioned at described transparent support plate.
Transparent support plate and described infrared transmitter, ambient light sensor, near having cavity between optical sensor and the imageing sensor, have pad below the described transparent support plate.
In embodiment of the present utility model, described cap is transparent.Those skilled in the art as can be known, transparent cap can be prepared by the infrared shielding material, cap with infrared transmitter and near optical sensor directly over the corresponding position be provided with window, cap can be respectively with ambient light sensor and imageing sensor directly over the corresponding position be provided with window, also can with ambient light sensor and imageing sensor directly over the corresponding position do not establish window.Transparent cap also can be non-infrared shielding material preparation, cap can be provided with window in corresponding position with infrared transmitter, ambient light sensor, imageing sensor and directly near optical sensor, also can not have window in corresponding position with infrared transmitter, ambient light sensor, imageing sensor and directly near optical sensor.
Cap is Split type structure, the cap that is used for described infrared transmitter be used for described ambient light sensor, minute be arranged near the cap of optical sensor and imageing sensor.Also can be for the cap of described infrared transmitter be used for described ambient light sensor, be one near the cap of optical sensor and imageing sensor.
Wherein said cap comprises that being positioned at described base plate for packaging encapsulation side wall on every side pushes up with the encapsulation that is positioned at above the described encapsulation side wall.The encapsulation top can be planar top, also can be the top with certain circular arc.
The below does in more detail explanation to specific embodiment of the utility model respectively by reference to the accompanying drawings.
Fig. 1 is the schematic perspective view of first execution mode of the utility model.Fig. 2 is the schematic perspective view that removes cap shown in Figure 1.To shown in Figure 2, integrated-type optical sensor package 100 comprises the base plate for packaging 111 that is positioned at the bottom such as Fig. 1, is positioned at the cap 116 above the base plate for packaging 111, and cap 116 seals mutually with described base plate for packaging 111.Cap 116 comprises that being positioned at base plate for packaging 111 encapsulation side wall 116F on every side pushes up 116T with the encapsulation that is positioned at above the encapsulation side wall 116F.Ambient light sensor 112, not shown near optical sensor 113, imageing sensor 114 and infrared transmitter 115() top has respectively ambient light sensor camera lens 112L, near optical sensor camera lens 113L, imageing sensor camera lens 114L and infrared transmitter camera lens 115L.As shown in Figure 1, on the 116T of encapsulation top with ambient light sensor camera lens 112L, near optical sensor camera lens 113L, imageing sensor camera lens 114L and infrared transmitter camera lens 115L directly over corresponding position have respectively ambient light sensor window 112W, near optical sensor window 113W, imageing sensor window 114W and infrared transmitter window 115W.Imageing sensor camera lens 114L has the infrared cut-off light filtering films (not shown), and ambient light sensor camera lens 112L has the infrared cut-off light filtering films (not shown).
Fig. 3 is the cutaway view along A-A line among Fig. 1.As shown in Figure 3, ambient light sensor 112, be formed on a slice chip 130 near optical sensor 113 and imageing sensor 114.Cap 116 and base plate for packaging 111 are made by the infrared shielding material.Comprise in the cap 116 that one connects described base plate for packaging 111 and the dividing plate 131 that encapsulates top 116T, described infrared transmitter 115 is positioned at a side of dividing plate 131, ambient light sensor 112, is positioned at the opposite side of dividing plate 131 near optical sensor 113 and imageing sensor 114.Ambient light sensor 112, have the transparent support plate 132S parallel with base plate for packaging 111 near optical sensor 113 and imageing sensor 114 tops, infrared transmitter 115 tops have the transparent support plate 133S parallel with base plate for packaging 111.Ambient light sensor camera lens 112L, near optical sensor camera lens 113L and imageing sensor camera lens 114L be positioned at above the transparent support plate 132S and with transparent support plate 132S be integrated.Infrared transmitter camera lens 115L be positioned at above the transparent support plate 133S and with transparent support plate 133S be integrated.Transparent support plate 132S and ambient light sensor 112, near having cavity 134C between optical sensor 113 and the imageing sensor 114, have cavity 135C between transparent support plate 133S and the infrared transmitter 115.Both sides have pad 136P below the transparent support plate 132S, and both sides have pad 137P below the transparent support plate 133S.In the present embodiment, both sides have pad below transparent support plate 132S and the 133S, embodiment according to reality, can there be pad below the supporting bracket yet, also can have a plurality of pads below supporting bracket, pad can be to be positioned at both sides below the transparent support plate, also can be to be positioned at around the transparent support plate lower outside, can also be the outside annulus that is positioned at below the transparent support plate, pad can be the transparent material preparation.
Fig. 4 is that the first distressed structure of first execution mode of the utility model is along the cutaway view of A-A line among Fig. 1.As shown in Figure 4, be that with the difference of first execution mode cap 116 is transparent, there is not pad below the transparent support plate, therefore transparent support plate 132S and ambient light sensor 112, near not having cavity between optical sensor 113 and the imageing sensor 114, and do not have cavity between transparent support plate 133S and the infrared transmitter 115.
Fig. 5 is that the second distressed structure of first execution mode of the utility model is along the cutaway view of A-A line among Fig. 1.As shown in Figure 5, be with the difference of first execution mode, the cap 116R that is used for infrared transmitter 115 be used for ambient light sensor 112, be arranged near optical sensor 113 and imageing sensor 114 cap 116S minute.And encapsulating side wall 116F and being positioned at the encapsulation top 116T that encapsulates above the side wall 116F on four sides is Split type structure, and encapsulation is pushed up 116T and encapsulated side wall 116F and fits tightly.
Fig. 6 is that the third distressed structure of the utility model execution mode is along the cutaway view of A-A line among Fig. 1.As shown in Figure 6, be with the difference of first execution mode, infrared transmitter 115, ambient light sensor 112, be formed on a slice chip 130 near optical sensor 113 and imageing sensor 114.Ambient light sensor camera lens 112L, near optical sensor camera lens 113L, imageing sensor camera lens 114L and infrared transmitter camera lens 115L be positioned at same transparent support plate 1323S upper and with transparent support plate 1323S be integrated.
Above-described embodiment is for illustrative principle of the present utility model and effect thereof, but the utility model is not limited to above-mentioned execution mode.Any personnel that are familiar with technique all can under spirit of the present utility model and category, in the claim protection range, make amendment to above-described embodiment.So protection range of the present utility model, should be listed such as claims of the present utility model.
Claims (13)
1. integrated-type optical sensor package is characterized in that: described integrated-type optical sensor package comprise the base plate for packaging that is positioned at the bottom and be positioned at ambient light sensor above the described base plate for packaging, near optical sensor, imageing sensor and the cap that mutually seals with described base plate for packaging.
2. integrated-type optical sensor package according to claim 1, it is characterized in that: described integrated-type optical sensor package comprises the infrared transmitter that is positioned at above the described base plate for packaging and is sealed in described cap.
3. integrated-type optical sensor package according to claim 1 and 2 is characterized in that: described infrared transmitter, ambient light sensor, have respectively camera lens near the top of optical sensor, imageing sensor.
4. integrated-type optical sensor package according to claim 3 is characterized in that: the camera lens of described imageing sensor top has infrared cut-off light filtering films.
5. integrated-type optical sensor package according to claim 3 is characterized in that: the camera lens of described ambient light sensor top has infrared cut-off light filtering films.
6. integrated-type optical sensor package according to claim 3 is characterized in that: described ambient light sensor, be formed on a slice chip near optical sensor and imageing sensor.
7. integrated-type optical sensor package according to claim 3 is characterized in that: described infrared transmitter, ambient light sensor, be formed on a slice chip near optical sensor and imageing sensor.
8. integrated-type optical sensor package according to claim 1, it is characterized in that: described cap is made by the infrared shielding material.
9. integrated-type optical sensor package according to claim 3 is characterized in that: described cap respectively directly over described infrared transmitter, ambient light sensor, near optical sensor, imageing sensor the corresponding position be provided with window.
10. integrated-type optical sensor package according to claim 2, it is characterized in that: described cap comprises the vertical dividing plate that links to each other of at least one and described base plate for packaging, described infrared transmitter is positioned at a side of described dividing plate, described ambient light sensor, is positioned at the opposite side of described dividing plate near optical sensor and imageing sensor.
11. integrated-type optical sensor package according to claim 2 is characterized in that: described infrared transmitter, ambient light sensor, have the transparent support plate parallel with described base plate for packaging near optical sensor with the imageing sensor top;
Described camera lens be positioned at above the described transparent support plate and with described transparent support plate be the connecting hole that integrated or described camera lens is positioned at described transparent support plate.
12. integrated-type optical sensor package according to claim 11 is characterized in that: have pad below described transparent support plate and the described ambient light sensor, near having cavity between optical sensor and the imageing sensor, described transparent support plate.
13. integrated-type optical sensor package according to claim 1 is characterized in that: described cap is transparent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220305812 CN202721126U (en) | 2012-06-27 | 2012-06-27 | Integrated optical sensor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220305812 CN202721126U (en) | 2012-06-27 | 2012-06-27 | Integrated optical sensor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202721126U true CN202721126U (en) | 2013-02-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220305812 Expired - Lifetime CN202721126U (en) | 2012-06-27 | 2012-06-27 | Integrated optical sensor package |
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| Country | Link |
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| CN (1) | CN202721126U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103515371A (en) * | 2012-06-27 | 2014-01-15 | 格科微电子（上海）有限公司 | Integrated optical sensor package |
| CN105917642A (en) * | 2013-12-12 | 2016-08-31 | 康诺特电子有限公司 | Image capturing device with an image sensor and a thermal infrared sensor as well as motor vehicle with an image capturing device |
| CN109099942A (en) * | 2018-07-11 | 2018-12-28 | 厦门中莘光电科技有限公司 | A kind of photoelectricity modulus conversion chip of integrated silicon-based photodetector |
-
2012
- 2012-06-27 CN CN 201220305812 patent/CN202721126U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103515371A (en) * | 2012-06-27 | 2014-01-15 | 格科微电子（上海）有限公司 | Integrated optical sensor package |
| CN103515371B (en) * | 2012-06-27 | 2016-09-21 | 格科微电子（上海）有限公司 | Integrated-type optical sensor package |
| CN105917642A (en) * | 2013-12-12 | 2016-08-31 | 康诺特电子有限公司 | Image capturing device with an image sensor and a thermal infrared sensor as well as motor vehicle with an image capturing device |
| CN105917642B (en) * | 2013-12-12 | 2018-11-02 | 康诺特电子有限公司 | Image capture apparatus with imaging sensor and thermal infrared sensor and the motor vehicles with image capture apparatus |
| CN109099942A (en) * | 2018-07-11 | 2018-12-28 | 厦门中莘光电科技有限公司 | A kind of photoelectricity modulus conversion chip of integrated silicon-based photodetector |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130206 |
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| CX01 | Expiry of patent term |