CN202705533U - Electroplating device for continuous casting crystallizer copper plate - Google Patents
Electroplating device for continuous casting crystallizer copper plate Download PDFInfo
- Publication number
- CN202705533U CN202705533U CN 201220347846 CN201220347846U CN202705533U CN 202705533 U CN202705533 U CN 202705533U CN 201220347846 CN201220347846 CN 201220347846 CN 201220347846 U CN201220347846 U CN 201220347846U CN 202705533 U CN202705533 U CN 202705533U
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- China
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- electroplating
- copper plate
- reduction boxes
- continuous casting
- crystallizer copper
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- Expired - Fee Related
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Abstract
The utility model discloses an electroplating device for a continuous casting crystallizer copper plate. The electroplating device comprises a horizontal electroplating tank, two servo motors, two reduction boxes, two lifting screw rods, two hoisting pallets and two limit control rods, the two servo motors are arranged on two sides of the horizontal electroplating tank respectively, rotation shafts of the two servo motors are connected with input shafts of the two reduction boxes respectively, output shafts of the two reduction boxes are connected with bottom ends of the two lifting screw rods respectively, the two hoisting pallets are arranged at top ends of the two lifting screw rods respectively, and the two limit control rods are arranged on two sides of the horizontal electroplating tank respectively and control the highest position of the two hoisting pallets. Copying plating of the crystallizer copper plate is realized, an electroplating liquid circulation tank and field extension are omitted, electroplating consume materials are saved, electroplating cost is reduced, investment cost of plating device is reduced, and the electroplating device cannot be limited by the field.
Description
Technical field
The utility model relates to a kind of electroplanting device of continuous casting crystallizer copper plate.
Background technology
Usually continuous casting crystallizer copper plate obtains the coating of processing requirement by plating, satisfies the needs of continuous casting process; Copper plate of crystallizer is in manufacturing and repair process, and its electroplating surface consumptive material cobalt and nickel are the main sources of product cost, has reached to repair more than 80% of total cost.For copper plate of crystallizer, its overlay coating is uneven thick, generally on width, the thinner thickness of coating in the width range of distance about 300-400mm suitable for reading, be no more than 1mm, remaining copper coin bottom coating is thicker, and mostly is the trapezoidal coating that thickness increases gradually.Electroplate consumptive material for saving, reduce electroplating cost, development along with the copper plate of crystallizer electroplating technology, a kind of liquid level electro-plating method that falls arises at the historic moment, and according to the copper plate of crystallizer thickness of coating, liquid level descends thereupon in the plating tank, be equipped with corresponding electroplating current, obtain the profiling coating of copper plate of crystallizer, this profiling coating comprises rational process redundancy, saves the purpose of electroplating consumptive material, reducing cost thereby reach.But the liquid level that falls of realizing copper plate of crystallizer is electroplated, and need set up the equipment such as electroplate liquid circulation groove for the Horizontal electric coating bath, and the enlarging of electroplating the place, with plating liquid discharge in the Horizontal electric coating bath to circulation groove, electroplate thereby realize falling liquid level; So increased the cost of investment of equipment, when the place condition did not allow to extend, then the liquid level plating of falling of copper plate of crystallizer was subject to certain restrictions.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of electroplanting device of continuous casting crystallizer copper plate, utilize this electroplanting device to realize the profiling coating of copper plate of crystallizer, need not to set up the enlarging of electroplate liquid circulation groove and place, both save the plating consumptive material, reduced electroplating cost, also reduced the cost of investment of equipment, and not limited by the place.
For solving the problems of the technologies described above, the electroplanting device of the utility model continuous casting crystallizer copper plate comprises the Horizontal electric coating bath, two servomotors, two reduction boxes, two elevating screws, two promote supporting plate and two spacing control levers, described two servomotors are located at respectively described Horizontal electric coating bath both sides, the rotating shaft of described two servomotors connects respectively the input shaft of described two reduction boxes, the output shaft of described two reduction boxes connects respectively the bottom of described two elevating screws, described two promote the top that supporting plate is located at respectively described two elevating screws, and described two spacing control levers are located at respectively described Horizontal electric coating bath both sides and are controlled described two extreme higher positions that promote supporting plate.
Because the electroplanting device of the utility model continuous casting crystallizer copper plate has adopted technique scheme, be that this device comprises the Horizontal electric coating bath, two servomotors, two reduction boxes, two elevating screws, two promote supporting plate and two spacing control levers, two servomotors are located at respectively Horizontal electric coating bath both sides, the rotating shaft of two servomotors connects respectively the input shaft of two reduction boxes, the output shaft of two reduction boxes connects respectively the bottom of two elevating screws, two promote the top that supporting plate is located at respectively two elevating screws, and two spacing control levers are located at respectively Horizontal electric coating bath both sides and are controlled two extreme higher positions that promote supporting plate.This electroplanting device is realized the profiling coating of copper plate of crystallizer, need not to set up the enlarging of electroplate liquid circulation groove and place, has both saved the plating consumptive material, has reduced electroplating cost, has reduced again the cost of investment of equipment, and not limited by the place.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and embodiments:
Fig. 1 is the structural representation of the electroplanting device of the utility model continuous casting crystallizer copper plate.
Embodiment
As shown in Figure 1, the electroplanting device of the utility model continuous casting crystallizer copper plate comprises Horizontal electric coating bath 1, two servomotors 2, two reduction boxes 3, two elevating screws 4, two promote supporting plate 5 and two spacing control levers 6, described two servomotors 2 are located at respectively described Horizontal electric coating bath 1 both sides, the rotating shaft of described two servomotors 2 connects respectively the input shaft of described two reduction boxes 3, the output shaft of described two reduction boxes 3 connects respectively the bottom of described two elevating screws 4, described two promote the top that supporting plate 5 is located at respectively described two elevating screws 4, and described two spacing control levers 6 are located at respectively described Horizontal electric coating bath 1 both sides and are controlled described two extreme higher positions that promote supporting plate 5.
This electroplanting device simulation copper plate of crystallizer the liquid level electro-plating method falls, change and fall liquid level for promoting copper plate of crystallizer, reach the effect same of falling liquid level; During the copper plate of crystallizer electroplating activity, according to thickness of coating, adopt two servomotor operations of two servo-driver synchronization control, two servomotors drive two elevating screws by two reduction boxes and rise or descend, be positioned at two copper plate of crystallizer on the lifting supporting plate in the lifting of Horizontal electric coating bath thereby drive, play and fall the identical effect of liquid level, be equipped with corresponding electroplating current and electroplating time, obtain the profiling coating of copper plate of crystallizer; Two spacing control levers are used for the extreme higher position that crystallization control device copper coin promotes, to guarantee the safety of electroplating activity.For the Horizontal electric coating bath, this device need not to set up and falls the required circulation groove of liquid level, only need in former Horizontal electric coating bath both sides jacking system to be set respectively, the effect that liquid level is electroplated is fallen thereby can reach, save electroplating cost, reduced again equipment investment cost, it is not limited what is more important by or not the place, for former electroplating device transformation provides the foundation, has considerable economic benefit.
Claims (1)
1. the electroplanting device of a continuous casting crystallizer copper plate, comprise the Horizontal electric coating bath, it is characterized in that: also comprise two servomotors, two reduction boxes, two elevating screws, two promote supporting plate and two spacing control levers, described two servomotors are located at respectively described Horizontal electric coating bath both sides, the rotating shaft of described two servomotors connects respectively the input shaft of described two reduction boxes, the output shaft of described two reduction boxes connects respectively the bottom of described two elevating screws, described two promote the top that supporting plate is located at respectively described two elevating screws, and described two spacing control levers are located at respectively described Horizontal electric coating bath both sides and are controlled described two extreme higher positions that promote supporting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220347846 CN202705533U (en) | 2012-07-18 | 2012-07-18 | Electroplating device for continuous casting crystallizer copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220347846 CN202705533U (en) | 2012-07-18 | 2012-07-18 | Electroplating device for continuous casting crystallizer copper plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202705533U true CN202705533U (en) | 2013-01-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220347846 Expired - Fee Related CN202705533U (en) | 2012-07-18 | 2012-07-18 | Electroplating device for continuous casting crystallizer copper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202705533U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104532335A (en) * | 2015-01-16 | 2015-04-22 | 尤荣廷 | Intelligent control system for electroplating of crystallizer copper plate set box |
| CN105420797A (en) * | 2015-11-26 | 2016-03-23 | 扬中市宏飞镀业有限公司 | Novel electroplating bath |
-
2012
- 2012-07-18 CN CN 201220347846 patent/CN202705533U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104532335A (en) * | 2015-01-16 | 2015-04-22 | 尤荣廷 | Intelligent control system for electroplating of crystallizer copper plate set box |
| CN105420797A (en) * | 2015-11-26 | 2016-03-23 | 扬中市宏飞镀业有限公司 | Novel electroplating bath |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130130 Termination date: 20150718 |
|
| EXPY | Termination of patent right or utility model |