CN202693620U - Electric coupler and assemblies thereof - Google Patents
Electric coupler and assemblies thereof Download PDFInfo
- Publication number
- CN202693620U CN202693620U CN 201220239367 CN201220239367U CN202693620U CN 202693620 U CN202693620 U CN 202693620U CN 201220239367 CN201220239367 CN 201220239367 CN 201220239367 U CN201220239367 U CN 201220239367U CN 202693620 U CN202693620 U CN 202693620U
- Authority
- CN
- China
- Prior art keywords
- pad
- electric connector
- heat abstractor
- fluting
- receiving space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
An electric coupler is used to electrically connect a wafer module to a printed circuit board, defines containing space containing the wafer module and comprises an electric conduction terminal, a substrate, a sliding plate and a heat dissipation device fixed on the substrate. The electric conduction terminal comprises a contacting part and a welding part. The substrate is provided with a first supporting plate. The sliding plate is provided with a second supporting plate used to support the wafer module. The first supporting plate and the second supporting plate are arrayed from top to bottom and are provided with terminal containing grooves in one-to-one correspondence. The electric conduction terminal penetrates through the first supporting plate and the second supporting plate. A position of the sliding plate, where the electric conduction terminal is not arranged, is provided with a through groove communicated from top to bottom. The heat dissipation device is exposed in the containing space through a slot. Thus, heat dissipation of the wafer module can be achieved on the premise that detection is not influenced.
Description
[technical field]
The utility model relates to a kind of electric connector and assembly thereof, relates in particular to a kind of electric connector for the testing wafer module and assembly thereof.
[background technology]
The known socket that the processor wafer is tested, the snap close piece that generally comprises pedestal, is assembled in the upper cover body on the pedestal and driven by upper cover body, conducting terminal is contained in the pedestal.Upper cover body relatively pedestal moves up and down, when pressing upper cover body, upper cover body pressing lock fastener, snap close piece is in open mode, can be loaded on the processor wafer this electric connector this moment, and traditional test jack does not have radiating requirements, and along with the increase of chip storage amount, the end pin is more, and the demand that wafer is dispelled the heat then can be higher.
So, be necessary to design a kind of electric connector to overcome aforementioned deficiency.
[utility model content]
Technical problem to be solved in the utility model provides a kind of electric connector and assembly thereof, and it can improve the radiating effect of wafer.
For solving the problems of the technologies described above, a kind of technical scheme of the present utility model is: a kind of electric connector, be used for being electrically connected the wafer module to printed circuit board (PCB), it has defined the receiving space that holds the wafer module, comprise conducting terminal, pedestal, sliding panel and be fixed in the heat abstractor of pedestal, conducting terminal comprises contact site and weld part, pedestal is provided with the first back up pad, sliding panel then is provided with the second back up pad of supporting wafers module, first, self arranges and is provided with one to one terminal containing slot the second back up pad, conducting terminal runs through above-mentioned first, the second back up pad, sliding panel is not arranging the conducting terminal place and is being provided with the groove of up/down perforation, and heat abstractor is exposed in the receiving space via this fluting.
Another kind of technical scheme is: a kind of electric coupler component, it comprises electric connector and wafer module, electric connector has defined the receiving space of accommodating the wafer module, this electric connector has back up pad and the heat abstractor of conducting terminal, supporting wafers module, conducting terminal has the contact site that protrudes into receiving space and touch with the wafer dies winding, the receiving space bottom is provided with the fluting that is communicated with receiving space, and heat abstractor is contained in the fluting.
Compared with prior art, the utility model electric connector and assembly thereof have following effect: can under the prerequisite that does not affect test, realize the heat radiation of wafer module like this.
[description of drawings]
Fig. 1 is the stereographic map of the utility model electric connector.
Fig. 2 is the exploded view of Fig. 1.
Fig. 3 is the assembly drawing of pedestal, sliding part.
Fig. 4 is that Fig. 1 is along the cut-open view of A-A line.
[embodiment]
Please refer to Fig. 1, the utility model electric coupler component 500 comprises wafer module 300 and is used for the electric connector 100 of testing wafer module.
As shown in Figure 2, electric connector 100 comprises pedestal 10, is mounted on the actuator 20, the sliding part 30 with actuator motion, latching system 50 and the heat abstractor 60 of snap close wafer module of pedestal.
Sliding part 30 structure that also is square, its four jiaos places are equipped with the latch part 31 of outstanding its bottom surface, and latch part 31 is immobilizated in the conduit 13, to realize the fixing of sliding part 30 and pedestal 10.The second back up pad 34 of sliding part is provided with the second fluting the 341 and second terminal groove 342 that overlaps with the first fluting 121, first end pilot trench 122 respectively.The second back up pad 34 surrounds the receiving space 301 that holds wafer module 300 with end to end sidewall 32, and it has defined upwards and the opening 302 that supplies wafer dies to be assembled into.This receiving space is communicated with above-mentioned two flutings and terminal groove.Wafer module 300 is positioned in the receiving space 301, the bottom surface of the second back up pad 34 supporting wafers modules.The weld part 43 that some conducting terminals 40 (only illustrate one of them) have the fixed part 41 that remains in first, second back up pad, the contact site 42 that protrudes from the second back up pad and protrude from base bottom surface, fixed part connects contact site and weld part.
Especially with reference to Fig. 3 and Fig. 4, the end face 601 of one heat abstractor 60 is exposed in the receiving space 301, and end face is concordant in the horizontal direction with the upper surface of the second back up pad 34, and is just tactile with the wafer dies winding to guarantee heat abstractor, and don't affects docking of wafer module and conducting terminal.Heat abstractor 60 comprise radiating part 61 and to both sides extended fixed part 62, radiating part is contained in first, second fluting 121,341 just, and end face 601 is contacted with wafer module 300 bottom surface portions.Fixed part is used for heat abstractor is fixed in pedestal 10, and is equipped with screw 621,123 on the first back up pad of fixed part and pedestal, and some bolts 17 are fixed in bolt hole.
Described actuator 20 has square inner chamber 201, is used for accommodating sliding part 30.Relative both sides, actuator 20 bottoms respectively are provided with pair of catches arm 21, are provided with a pair of fixed arm 22 between every pair of lock catch arm.The two opposite side walls 32 of sliding part 30 is provided with pair of notches 33, and fixed arm 22 is positioned at otch 33, then forms the space of rotating for the elasticity device between the fixed arm.Latching system 50 comprise by pressure arm 51, be installed on two countershafts 52 by pressure arm and protrusion, 53 and protection by the protection section 54 of pressure arm front end.One countershaft 52 slidably is assembled in a pair of the first vertical chute 23 that fixed arm 22 is provided with, and 53 of another countershafts are installed in the second chute 15 of the level that conduit 13 inboards are provided with.Two countershafts roll along level and vertical direction respectively, thus the rotation that pressure arm is pressed in realization.
The lock catch arm 21 of actuator also is fixed in the conduit 13 of pedestal.Four corners of pedestal (each conduit 13 next door) then are provided with four circular holes 14, and elastic component 70 lower ends are fixed in the circular hole 14, and the upper end then is resisted against actuator.When electric connector does not use, press on the second back up pad 34 by pressure arm 51; When packing the wafer module into, actuator 20 is pressed down, realize the motion on rotating shaft 52,53 the both direction, press pressure arm 51 and outwards rotate, and make wafer dies be assembled into receiving space 301; After the installation, remove the downforce of actuator 20, elastic force moves upward actuator 20, drives rotating shaft 52,53 motion, presses pressure arm 51 and inwardly moves, and finally presses on the wafer module 300.Simultaneously the bottom surface of wafer module with contact, realize heat sinking function.
Certainly pedestal 10 also can be designed to hollow type (namely not having the second back up pad), as long as the thickness of the first back up pad is suitably increased, can realize that the second back up pad 34 keeps the function of conducting terminal and direct supporting wafers module, heat abstractor then directly is exposed in the receiving space 301 via the second fluting 341 of the second back up pad 34, to contact with wafer module 300.Surface 300 is concordant with surface (the in other words bottom surface of receiving space) on the second back up pad 34 on the heat abstractor at this moment.
Claims (8)
1. electric connector, be used for being electrically connected the wafer module to printed circuit board (PCB), it has defined the receiving space that holds the wafer module, comprise conducting terminal, pedestal, sliding panel and be fixed in the heat abstractor of pedestal, conducting terminal comprises contact site and weld part, pedestal is provided with the first back up pad, sliding panel then is provided with the second back up pad of supporting wafers module, first, self arranges and is provided with one to one terminal containing slot the second back up pad, conducting terminal runs through above-mentioned first, the second back up pad, it is characterized in that: sliding panel is not arranging the conducting terminal place and is being provided with the fluting of up/down perforation, and heat abstractor is exposed in the receiving space via this fluting.
2. electric connector as claimed in claim 1, it is characterized in that: the upper surface of heat abstractor is concordant with the upper surface of the second back up pad.
3. electric connector as claimed in claim 2, it is characterized in that: the fixed part that is fixed in pedestal is extended in described heat abstractor both sides.
4. electric connector as claimed in claim 3, it is characterized in that: described fixed part is provided with some screws, and heat abstractor is bolted in the first back up pad.
5. electric connector as claimed in claim 2, it is characterized in that: described the first back up pad also is provided with fluting, and the fluting of two back up pads is divided into symmetrical two parts with first, second back up pad.
6. electric connector as claimed in claim 5, it is characterized in that: described pedestal is provided with the terminal groove of some fixed terminals, and these terminal grooves are positioned at roughly symmetrical both sides of fluting.
7. electric coupler component, it comprises electric connector and wafer module, electric connector has defined the receiving space of accommodating the wafer module, this electric connector comprises back up pad and the heat abstractor of conducting terminal, supporting wafers module, conducting terminal has the contact site that protrudes into receiving space and touch with the wafer dies winding, it is characterized in that: the receiving space bottom is provided with the fluting that is communicated with receiving space, and heat abstractor is contained in the fluting.
8. electric coupler component as claimed in claim 7, it is characterized in that: the end face of heat abstractor is concordant with the bottom surface of receiving space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220239367 CN202693620U (en) | 2012-05-25 | 2012-05-25 | Electric coupler and assemblies thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220239367 CN202693620U (en) | 2012-05-25 | 2012-05-25 | Electric coupler and assemblies thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202693620U true CN202693620U (en) | 2013-01-23 |
Family
ID=47549221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220239367 Expired - Fee Related CN202693620U (en) | 2012-05-25 | 2012-05-25 | Electric coupler and assemblies thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202693620U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10651596B1 (en) | 2017-09-25 | 2020-05-12 | Foxconn Interconnect Technology Limited | Roller mechanism for burn-in socket |
-
2012
- 2012-05-25 CN CN 201220239367 patent/CN202693620U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10651596B1 (en) | 2017-09-25 | 2020-05-12 | Foxconn Interconnect Technology Limited | Roller mechanism for burn-in socket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20140525 |