CN202633251U - Annealing boat for wafer and annealing device for wafer - Google Patents
Annealing boat for wafer and annealing device for wafer Download PDFInfo
- Publication number
- CN202633251U CN202633251U CN 201220185498 CN201220185498U CN202633251U CN 202633251 U CN202633251 U CN 202633251U CN 201220185498 CN201220185498 CN 201220185498 CN 201220185498 U CN201220185498 U CN 201220185498U CN 202633251 U CN202633251 U CN 202633251U
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- Prior art keywords
- wafer
- boat
- annealing
- sidewall
- circular arc
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides an annealing boat for a wafer and an annealing device for a wafer. The annealing boat comprises a pedestal and a circular arc-shaped sidewall arranged at the surface of the pedestal. A plurality of horizontal grooves are arranged on the sidewall in parallel; and at least three projections are arranged at the inner wall of each groove. According to the utility model, the advantages are as follows: heat treatment of the wafer in a horizontal mode on a horizontal furnace can be realized. When the annealing boat is placed at one end of a paddle, the wafer is not inclined even under the circumstances of the warping difference occurrence of the paddle, so that the side surface of the wafer is not damaged. Moreover, the side of the wafer does not bear the weight of the wafer, thereby effectively reducing the occurrences of phenomena of edge breakage and a gap occurrence and the like.
Description
Technical field
The utility model is to reinforce boat, the particularly a kind of annealing boat and annealing device of being used for wafer that can reduce wafer surface damage in annealing process about a kind of wafer.
Background technology
Need wafer be placed on the special support in the annealing reinforcement process of wafer, usually this strengthening frame is referred to as " boat " in the industry.
Be that a kind of typical case adopts the annealing device structural representation of reinforcing boat in the prior art shown in the accompanying drawing 1A, comprise oar 11, boat 12 and wafer 13.Oar 11 horizontal positioned, an end are fixed on the guide rail (not shown) that can move forward and backward, and the unsettled boiler tube (not shown) that can free in and out of the other end is heat-treated.Boat 12 is positioned over the free end of oar 11, and has U type draw-in groove.Wafer 13 is vertically put into the U type draw-in groove of boat 12.Be along the boat 12 of direction shown in the accompanying drawing 1A arrow and the position relational view of wafer 13 shown in the accompanying drawing 1B, can find out that from accompanying drawing 1B the weight of wafer 13 only depends on several contact point supports of wafer 13 and boat 12.
The shortcoming of prior art is: wafer 13 is vertically placed, and with the weight that the contact point of boat 12 bears silicon chip, in the pyroprocess, wafer 13 sides have damage; If in oxygen atmosphere, anneal, wafer 13 and boat 12 contact portions, in high-temperature oxidation process, the oxygen that touches is less, and oxide layer is inevitable thinner, and subsequent corrosion technology can be amplified this difference, causes the side bright spot; Wafer 13 weight cause oar 11 that elastic deformation takes place; Many oars of load free end descends, and the few free end of load rises, and wafer 13 can be not vertical fully; Lean forward; Layback, inclination can cause between the draw-in groove of wafer 13 edges and boat 12 and produce stress, and the high temperature edge of wafer 13 at present can produce and collapses the limit.
The utility model content
The utility model technical problem to be solved is, a kind of annealing boat and annealing device that is used for wafer is provided, can reduce wafer cracked, collapse phenomenons such as limit and breach, improve the quality of device side.
In order to address the above problem; The utility model provides a kind of annealing boat and annealing device that is used for wafer; A kind of annealing boat that is used for wafer; Comprise a pedestal and a circular arc sidewall that is arranged on base-plates surface, be arranged with a plurality of horizontal grooves on the said sidewall in parallel, said groove inwall is provided with at least three projection.
As optional technical scheme, the circular arc angle of said circular arc sidewall is 180 degree.
As optional technical scheme, the area on the top of said projection is 1mm.
The utility model further provides a kind of annealing device that is used for wafer; Comprise oar and boat; Said boat is arranged at an end of oar; Said boat comprises a pedestal and a circular arc sidewall that is arranged on base-plates surface, is arranged with a plurality of horizontal grooves on the said sidewall in parallel, and said groove inwall is provided with at least three projection.
As optional technical scheme, the circular arc angle of said circular arc sidewall is 180 degree.
As optional technical scheme, the area on the top of said projection is 1mm.
The advantage of the utility model is; Realized on horizontal chamber furnace (oven), letting wafer level heat-treat, boat is when being positioned over an end of oar, even oar generation warpage difference; Can not cause the inclination of wafer yet; Can not cause damage, and the wafer side also no longer bears weight own, effectively reduce and collapse phenomenons such as limit and breach the wafer side.
Description of drawings
Be that a kind of typical case adopts the annealing device structural representation of reinforcing boat in the prior art shown in the accompanying drawing 1A.
Be along the boat of direction shown in the accompanying drawing 1A arrow and the position relational view of wafer shown in the accompanying drawing 1B.
It shown in the accompanying drawing 2A structure cutaway view of the said annealing boat of this embodiment.
Accompanying drawing 2B is the vertical view of accompanying drawing 2A along the direction of arrow.
Embodiment
Next combine accompanying drawing to introduce the said a kind of annealing boat of wafer and the embodiment of annealing device of being used for of the utility model in detail.
Be the structure cutaway view of the said annealing boat of this embodiment shown in the accompanying drawing 2A, comprise boat 22 and wafer 23.Accompanying drawing 2B is the vertical view of accompanying drawing 2A along the direction of arrow.In this execution mode, said wafer 23 is a monocrystalline silicon wafer crystal.The end that this device can be placed on oar forms complete annealing device, and the sketch map between this device and the oar please refer to shown in the accompanying drawing 1A.
Shown in accompanying drawing 2A and accompanying drawing 2B; Said boat 22 comprises a pedestal 221 and a circular arc sidewall 222 that is arranged on pedestal 221 surfaces; Be arranged with a plurality of horizontal grooves 223 on the said sidewall 222 in parallel, said groove 223 inwalls are provided with at least three projections 224,225 and 226.
In this embodiment, the circular arc angle of said circular arc sidewall is 180 degree, and assurance wafer 23 can either be put into the space of crowding around to by sidewall 222 smoothly, can form the support of fullests again to wafer 23.The area on the top of said projection is 1mm; Be slightly less than and follow-up device side carried out the size (edge chamfer consumes edge silicon greater than 1.1mm) of the silicon materials that edge chamfer technology consumed, can guarantee that like this damage that high annealing causes can remove through follow-up attenuate and edge chamfer fully.
Obviously, such boat 22 has realized on horizontal chamber furnace (oven), letting wafer level heat-treat.Boat 22 is when being positioned over an end of oar, even oar generation warpage difference can not cause the inclination of wafer 23 yet, can not cause damage to wafer 23 sides, and wafer 23 sides also no longer bear weight own, effectively reduces and collapses phenomenons such as limit and breach.
In sum; Though the utility model discloses as above with preferred embodiment; Right its is not in order to limit the utility model, to have common knowledge the knowledgeable in the technical field under the utility model, in spirit that does not break away from the utility model and scope; When can doing various changes and retouching, so the protection range of the utility model is as the criterion when looking the claim person of defining that claims apply for.
Claims (6)
1. an annealing boat that is used for wafer is characterized in that, comprises a pedestal and a circular arc sidewall that is arranged on base-plates surface, is arranged with a plurality of horizontal grooves on the said sidewall in parallel, and said groove inwall is provided with at least three projection.
2. the annealing boat that is used for wafer according to claim 1 is characterized in that, the circular arc angle of said circular arc sidewall is 180 degree.
3. the annealing boat that is used for wafer according to claim 1 is characterized in that the area on the top of said projection is 1mm.
4. annealing device that is used for wafer; Comprise oar and boat; Said boat is arranged at an end of oar, it is characterized in that, said boat comprises a pedestal and a circular arc sidewall that is arranged on base-plates surface; Be arranged with a plurality of horizontal grooves on the said sidewall in parallel, said groove inwall is provided with at least three projection.
5. the annealing device that is used for wafer according to claim 4 is characterized in that, the circular arc angle of said circular arc sidewall is 180 degree.
6. the annealing device that is used for wafer according to claim 4 is characterized in that, the area on the top of said projection is 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220185498 CN202633251U (en) | 2012-04-27 | 2012-04-27 | Annealing boat for wafer and annealing device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220185498 CN202633251U (en) | 2012-04-27 | 2012-04-27 | Annealing boat for wafer and annealing device for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202633251U true CN202633251U (en) | 2012-12-26 |
Family
ID=47386409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220185498 Expired - Lifetime CN202633251U (en) | 2012-04-27 | 2012-04-27 | Annealing boat for wafer and annealing device for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202633251U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112391615A (en) * | 2019-10-23 | 2021-02-23 | 深圳市拉普拉斯能源技术有限公司 | Boat transportation structure based on double paddles |
| CN117238816A (en) * | 2023-11-15 | 2023-12-15 | 季华恒一(佛山)半导体科技有限公司 | Laser annealing system and method for silicon carbide wafer |
-
2012
- 2012-04-27 CN CN 201220185498 patent/CN202633251U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112391615A (en) * | 2019-10-23 | 2021-02-23 | 深圳市拉普拉斯能源技术有限公司 | Boat transportation structure based on double paddles |
| CN117238816A (en) * | 2023-11-15 | 2023-12-15 | 季华恒一(佛山)半导体科技有限公司 | Laser annealing system and method for silicon carbide wafer |
| CN117238816B (en) * | 2023-11-15 | 2024-03-01 | 季华恒一(佛山)半导体科技有限公司 | Laser annealing system and method for silicon carbide wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121226 |