CN202631897U - Pressing jig and equipment - Google Patents
Pressing jig and equipment Download PDFInfo
- Publication number
- CN202631897U CN202631897U CN 201220314381 CN201220314381U CN202631897U CN 202631897 U CN202631897 U CN 202631897U CN 201220314381 CN201220314381 CN 201220314381 CN 201220314381 U CN201220314381 U CN 201220314381U CN 202631897 U CN202631897 U CN 202631897U
- Authority
- CN
- China
- Prior art keywords
- chip
- tool
- perforate
- stitching
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Liquid Crystal (AREA)
Abstract
The utility model provides a pressing jig and pressing equipment, relates to the field of manufacturing of liquid crystal panels, and aims to reduce stress produced at positions, which are opposite to two ends of a chip, of a substrate and solve the problem that the liquid crystal display panel leaks light in a normally black mode because of the stress. The pressing jig comprises a heat conduction plate body, wherein at least one opening hole is formed in the heat conduction plate body and is opposite to a position where each chip is pressed on the substrate; and therefore, when each chip is required to be pressed on the substrate, the chip is positioned in the corresponding opening hole.
Description
Technical field
The utility model relates to liquid crystal panel and makes the field, relates in particular to a kind of tool for stitching and equipment.
Background technology
In display panels; Chip generally adopts COG (Chip On Glass, chip pressing is at substrate) technology to be fixed on the substrate through ACF (Anisotropic Conductive Film, anisotropy conductiving glue); Its embodiment does; When carrying out COG technology, about the pressure head temperature increase to 180 of press equipment ℃, through chip is exerted pressure chip is pressed on the substrate through anisotropy conductiving glue then.
When carrying out COG technology, the substrate temperature of pressure head, chip and chip below is higher, and the regional area of chip and chip lower substrate is owing to the rising of temperature can expand; The expansion coefficient of chip and substrate is inequality, and after COG technology finished, the anisotropy conductiving glue between chip and the substrate solidified; Chip is arrived with substrate bonded, yet, after pressure head is withdrawn; The temperature of the regional area of chip and substrate also can descend thereupon, causes the cooling of chip and substrate to shrink, because both expansion coefficient are inequality; And solid-state anisotropy conductiving glue bonding is arranged between the two; Therefore cause the chip two ends to produce very big stress with the position of corresponding substrate, this stress can influence the normal demonstration of chip near zone liquid crystal panel, thereby causes display panels to deceive chip place light leak under the pattern often.
The utility model content
The embodiment of the utility model provides a kind of tool for stitching and equipment, can reduce prior art chips two ends and the stress that the position of corresponding substrate produces, the problem of display panels chip place light leak under normal black pattern of avoiding causing thus.
For achieving the above object, the embodiment of the utility model adopts following technical scheme:
On the one hand; The utility model provides a kind of tool for stitching, it is characterized in that, comprises the heat conduction plate body; Be provided with at least one perforate in the said heat conduction plate body; The position of said perforate is corresponding with the present position of chip pressing on substrate, so that when chip need be pressed together on the substrate, said chip was in the said perforate.
The area of the perforate of said heat conduction plate body is greater than the area of said die bottom surface, so that said chip does not contact with said heat conduction plate body.
Be provided with the said perforate of a plurality of equidistant arrangements in the said heat conduction plate body.
The number of said perforate equates with core number on need being pressed together on said substrate, and said perforate and said chip are corresponding one by one.
The shape of said perforate and said chip are complementary.
Said heat conduction plate body is parallel with said substrate.
The thickness of said heat conduction plate body equates with the thickness of said chip.
On the other hand; The utility model also provides a kind of press equipment; Comprise pressure head, also comprise the tool for stitching with above-mentioned arbitrary characteristics, said pressure head bottom surface is greater than the perforate of said tool for stitching; So that when chip need be pressed together on the substrate, said pressure head all contacts with said tool for stitching and chip.
Said tool for stitching is fixed on the bottom surface of said pressure head.
The number of said pressure head is one, and the edge of said tool for stitching does not exceed the edge of said pressure head.
A kind of tool for stitching and equipment that the utility model embodiment provides; Through being provided with the heat conduction plate body of at least one perforate; The position of each perforate is corresponding with chip pressing present position on substrate respectively, makes that the pressure head of press equipment is exerted pressure to tool for stitching and chip simultaneously when carrying out COG technology; Chip is pressed on the substrate through anisotropy conductiving glue, and substrate can whole thermally equivalent.Through this scheme; Because the low-temperature region in the prior art beyond the local heating zone also is heated; Also can inwardly shrink during cooling; Therefore compensated the deformation to in-draw that local heating's regions contract is produced, thereby reduced prior art chips two ends and the stress that the position of corresponding substrate produces, the display panels of avoiding causing is thus often being deceived the problem of chip place light leak under the pattern.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiment of the utility model, for those of ordinary skills; Under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the board structure synoptic diagram behind the placement chip of the utility model embodiment;
Fig. 2 is the tool for stitching structural representation one of the utility model embodiment;
Fig. 3 is the tool for stitching structural representation two of the utility model embodiment;
Fig. 4 is the tool for stitching structural representation three of the utility model embodiment;
Fig. 5 is the part-structure synoptic diagram of the press equipment of the utility model embodiment.
Embodiment
To combine the accompanying drawing among the utility model embodiment below, the technical scheme among the utility model embodiment is carried out clear, intactly description, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
As shown in Figure 1, the edge of substrate 1 is provided with a plurality of chips 2, and COG technology promptly is that chip 2 is pressed together on the substrate 1 through anisotropy conductiving glue 3.
A kind of tool for stitching 4 that the utility model embodiment provides, in conjunction with like Fig. 1, shown in 2, tool for stitching 4 comprises:
Heat conduction plate body 40 is provided with at least one perforate 41 in the heat conduction plate body 40, the position of perforate 41 is corresponding with the present position that chip 2 is pressed together on the substrate 1 respectively, and when chip 2 need be pressed together on 1 last time of substrate, chip 2 is in the perforate 41.
Further, can be at the inboard coated with thermally conductive silica gel of perforate 41, promptly heat conductive silica gel is between chip 2 and the tool for stitching 4, so that the heat of chip 2 and tool for stitching 4 can conduct each other, thereby guarantees that both temperature are identical.
Exemplary, as shown in Figure 3, can be provided with the perforate 41 of a plurality of equidistant arrangements in the heat conduction plate body 40.
Preferably, as shown in Figure 4, the number of perforate 41 equates with chip 2 numbers on need being pressed together on substrate 1, and perforate 41 is corresponding one by one with chip 2.
What need replenish is that the number of the perforate 41 that the utility model embodiment proposed is at least one, promptly can be merely one, and then let all chips 2 be in simultaneously in the perforate 41; Also can be a plurality of, and the number of perforate 41 and chip 2 numbers be unequal, and then let a plurality of chips 2 be in simultaneously in the same perforate 41; Can also be a plurality of, and the number of perforate 41 equates with chip 2 numbers, and then make that chip 2 is corresponding one by one and be in the perforate 41, all should be within the protection domain of the utility model.
In conjunction with Fig. 1, shown in 4, exemplary, the area of the perforate 41 of heat conduction plate body 40 is greater than the area of chip 2 bottom surfaces, so that chip 2 does not contact with heat conduction plate body 40, to avoid when carrying out COG technology, because chip 2 expanded by heating are stuck in the situation in the perforate 41.
Preferably, the space between tool for stitching 4 and the chip 2 can be suitable with the swell increment of chip 2, fracture when avoiding chip 2 to expand.
Need to prove that the bottom surface of chip is meant along the ram movement direction of press equipment and observes the projected area of chip on substrate here.
Exemplary, the shape of perforate 41 can be complementary with chip 2.Since along with the LCD deviser to the overcritical and producer of display panels edge area control to cost of products; Chip is towards multiway number and narrow long type; Therefore the shape of the perforate of the tool for stitching that provides of the utility model need adapt to the variation of chip form, and certainly, the shape of perforate is not limited in this; It need be followed the variation of chip form and change; But its purpose all is when carrying out COG technology, makes chip be in the perforate, so also should be within the protection domain of the utility model.
Exemplary, heat conduction plate body 40 can be parallel with substrate 1, so that the pressure head of press equipment can be fitted good with heat conduction plate body 40.
Further, the thickness of heat conduction plate body 40 equates with the thickness of chip 2, so that the pressure head of press equipment can contact with chip 2.
A kind of tool for stitching that the utility model embodiment provides; Through being provided with the heat conduction plate body of at least one perforate; The position of each perforate is corresponding with chip pressing present position on substrate respectively, makes that the pressure head of press equipment is exerted pressure to tool for stitching and chip simultaneously when chip need be pressed together on the substrate; Chip is pressed on the substrate through anisotropy conductiving glue, and substrate can whole thermally equivalent.Through this scheme; Because the low-temperature region in the prior art beyond the local heating zone also is heated; Also can inwardly shrink during cooling; Therefore compensated the deformation to in-draw that local heating's regions contract is produced, thereby reduced prior art chips two ends and the stress that the position of corresponding substrate produces, the display panels of avoiding causing is thus often being deceived the problem of chip place light leak under the pattern.
The utility model embodiment provides a kind of press equipment; As shown in Figure 5; Comprise pressure head 5, and have the described tool for stitching 4 of the foregoing description, pressure head 5 bottom surfaces are greater than the perforate of tool for stitching 4; So that need be pressed together on 1 last time of substrate when chip 2, pressure head 5 all contacts with tool for stitching 4 and chip 2.
Further, tool for stitching 4 is fixed on the bottom surface of pressure head 5.
Below, be example with Fig. 5, to having used the press equipment behind the tool for stitching that the utility model embodiment provided, the process of COG technology is introduced:
Before carrying out COG technology, carry out chip and attach, promptly between chip 2 and substrate 1, apply anisotropy conductiving glue 3, at this moment, anisotropy conductiving glue 3 is a colloidal liquid; When COG technology; About pressure head 5 temperature increase to 180 of press equipment ℃; And moving downward (direction of arrow among Fig. 5), the tool for stitching 4 to pressure head 5 contacts with substrate 1, owing to be provided with at least one perforate 41 in the heat conduction plate body 40 of tool for stitching 4; And the position of each perforate 41 is corresponding with the present position that chip 2 is pressed together on the substrate 1 respectively; So the time each chip 2 be in respectively in the perforate 41, then, pressure head 5 presses to chip 2 on the substrate 1 through anisotropy conductiving glue 3 through chip 2 is exerted pressure.Since tool for stitching 4, substrate 1 whole thermally equivalent, and promptly the low-temperature region beyond the local heating zone also is heated in the prior art; So, when pressure head 5 leaves, during substrate 1 cooling; Low-temperature region also can inwardly shrink; Therefore compensated the deformation to in-draw that local heating's regions contract is produced, thereby reduced prior art chips 2 two ends and the stress that the position of corresponding substrate 1 produces, the display panels of avoiding causing is thus often being deceived the problem of chip 2 place's light leaks under the pattern.
Preferably, the number of pressure head 5 is one, and the edge of tool for stitching 4 does not exceed the edge of pressure head 5, and the area of pressure head 5 bottom surfaces need on the substrate 1 to equal the area in adhering chip 2 zones.And then; Tool for stitching not only can be directly installed on the pressure head of press equipment, and only needs a pressure head pressing process can accomplish the equidirectional process of all chip pressings on substrate that go up, and has simplified processing step greatly; Shorten the process time, improve the manufacturing efficient of display panels.Here the bottom surface of tool for stitching also is meant along the ram movement direction of press equipment and observes the projected area of tool for stitching on substrate.
Need to prove; Propose in the foregoing description, tool for stitching is installed on the pressure head of press equipment, understandable; Can also when making the pressure head of press equipment, directly pressure head be cast into the pressure head with tool for stitching characteristic, so also should be within the protection domain of the embodiment of the invention.
A kind of press equipment that the utility model embodiment provides; Comprise at least one pressure head and tool for stitching, this tool for stitching is through being provided with the heat conduction plate body of at least one perforate, and the position of each perforate is corresponding with chip pressing present position on substrate respectively; Chip makes when need be pressed together on the substrate; The pressure head of press equipment is exerted pressure to tool for stitching and chip simultaneously, and chip is pressed on the substrate through anisotropy conductiving glue, and substrate can whole thermally equivalent.
Through this scheme; Because the low-temperature region in the prior art beyond the local heating zone also is heated; Also can inwardly shrink during cooling; Therefore compensated the deformation to in-draw that local heating's regions contract is produced, thereby reduced prior art chips two ends and the stress that the position of corresponding substrate produces, the display panels of avoiding causing is thus often being deceived the problem of chip place light leak under the pattern.
The above; Be merely the embodiment of the utility model; But the protection domain of the utility model is not limited thereto; Any technician who is familiar with the present technique field can expect changing or replacement in the technical scope that the utility model discloses easily, all should be encompassed within the protection domain of the utility model.Therefore, the protection domain of the utility model should be as the criterion with the protection domain of said claim.
Claims (12)
1. a tool for stitching is characterized in that, comprises the heat conduction plate body; Be provided with at least one perforate in the said heat conduction plate body; The position of said perforate is corresponding with the present position of chip pressing on substrate, so that when chip need be pressed together on the substrate, said chip was in the said perforate.
2. tool for stitching according to claim 1 is characterized in that, the area of the perforate of said heat conduction plate body is greater than the area of said die bottom surface, so that said chip does not contact with said heat conduction plate body.
3. tool for stitching according to claim 1 and 2 is characterized in that, is provided with the said perforate of a plurality of equidistant arrangements in the said heat conduction plate body.
4. tool for stitching according to claim 3 is characterized in that, the number of said perforate equates with core number on need being pressed together on said substrate, and said perforate and said chip are corresponding one by one.
5. tool for stitching according to claim 3 is characterized in that, the number of said perforate is unequal with the core number that need be pressed together on the said substrate, so that a plurality of said chip is in the same said perforate.
6. tool for stitching according to claim 1 and 2 is characterized in that, the shape of said perforate and said chip are complementary.
7. tool for stitching according to claim 1 and 2 is characterized in that the inboard of said perforate is coated with heat conductive silica gel.
8. tool for stitching according to claim 1 and 2 is characterized in that, said heat conduction plate body is parallel with said substrate.
9. tool for stitching according to claim 1 and 2 is characterized in that, the thickness of said heat conduction plate body equates with the thickness of said chip.
10. a press equipment is characterized in that, comprises at least one pressure head; And like the described tool for stitching of claim 1-7; Said pressure head bottom surface is greater than the perforate of said tool for stitching, so that when chip need be pressed together on the substrate, said pressure head all contacts with said tool for stitching and chip.
11. press equipment according to claim 10 is characterized in that, said tool for stitching is fixed on the bottom surface of said pressure head.
12., it is characterized in that the number of said pressure head is one according to claim 10 or 11 described press equipments, the edge of said tool for stitching does not exceed the edge of said pressure head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220314381 CN202631897U (en) | 2012-06-28 | 2012-06-28 | Pressing jig and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220314381 CN202631897U (en) | 2012-06-28 | 2012-06-28 | Pressing jig and equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202631897U true CN202631897U (en) | 2012-12-26 |
Family
ID=47385084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220314381 Expired - Lifetime CN202631897U (en) | 2012-06-28 | 2012-06-28 | Pressing jig and equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202631897U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104772738A (en) * | 2015-04-24 | 2015-07-15 | 合肥京东方光电科技有限公司 | Pressing tool |
| CN107283989A (en) * | 2017-06-28 | 2017-10-24 | 武汉华星光电半导体显示技术有限公司 | Press fit device and the method for pressing colloid on a display panel |
| CN107479228A (en) * | 2017-09-11 | 2017-12-15 | 京东方科技集团股份有限公司 | The preparation method of display module and display module |
| CN111081566A (en) * | 2018-10-18 | 2020-04-28 | 株洲中车时代电气股份有限公司 | Pressure-assisted silver sintering device for power semiconductor chip |
| CN112721209A (en) * | 2020-12-15 | 2021-04-30 | 业成科技（成都）有限公司 | Film bonding's clamp plate tool, pressfitting structure and film bonding device |
-
2012
- 2012-06-28 CN CN 201220314381 patent/CN202631897U/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104772738A (en) * | 2015-04-24 | 2015-07-15 | 合肥京东方光电科技有限公司 | Pressing tool |
| CN104772738B (en) * | 2015-04-24 | 2016-08-10 | 合肥京东方光电科技有限公司 | Tool for stitching |
| US10195809B2 (en) | 2015-04-24 | 2019-02-05 | Boe Technology Group Co., Ltd. | Press-fit device |
| CN107283989A (en) * | 2017-06-28 | 2017-10-24 | 武汉华星光电半导体显示技术有限公司 | Press fit device and the method for pressing colloid on a display panel |
| CN107479228A (en) * | 2017-09-11 | 2017-12-15 | 京东方科技集团股份有限公司 | The preparation method of display module and display module |
| CN111081566A (en) * | 2018-10-18 | 2020-04-28 | 株洲中车时代电气股份有限公司 | Pressure-assisted silver sintering device for power semiconductor chip |
| CN111081566B (en) * | 2018-10-18 | 2021-07-13 | 株洲中车时代半导体有限公司 | Pressure-assisted silver sintering device for power semiconductor chip |
| CN112721209A (en) * | 2020-12-15 | 2021-04-30 | 业成科技（成都）有限公司 | Film bonding's clamp plate tool, pressfitting structure and film bonding device |
| CN112721209B (en) * | 2020-12-15 | 2022-09-20 | 业成科技（成都）有限公司 | Film bonding's clamp plate tool, pressfitting structure and film bonding device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202631897U (en) | Pressing jig and equipment | |
| CN102294825B (en) | Method and device for bonding metal shell and plastic component | |
| CN104889931B (en) | A kind of electronic equipment provision for disengagement and method for dismounting | |
| US11928294B2 (en) | Bonding method of touch-control display panel, touch-control display panel and electronic device | |
| CN203863557U (en) | Pressure-maintaining clamp | |
| CN101780699A (en) | Microstructure forming device and method and light guide plate thereof | |
| CN203496312U (en) | Novel sealing hot pressure head device | |
| CN104166255B (en) | Assembling method of driving chip of liquid crystal display module | |
| CN106079818A (en) | A kind of local shallow-layer heating optical cement applying method and device thereof | |
| CN109699131B (en) | Method for manufacturing multilayer substrate | |
| JP5897428B2 (en) | Input device and manufacturing method thereof | |
| CN101666929B (en) | Press fit device | |
| KR101679953B1 (en) | FOG Bonding device and methode the same | |
| CN211238171U (en) | Ball mounting jig for chip | |
| CN104701223A (en) | Chip lamination device | |
| CN106042594B (en) | The full laminating apparatus of multi cylinder and method | |
| CN204077000U (en) | A kind of ACF module heat pressing utensil | |
| CN104507256B (en) | The pressing tool and method of a kind of special-shaped steel disc of flexible PCB | |
| CN101118330A (en) | Connection method of display screen and drive partial common one layer aeolotropism conductive film | |
| KR101458710B1 (en) | Ic chip bonding apparatus and method | |
| CN112238646B (en) | Hot-pressing and cold-pressing combined integrated mechanism | |
| CN109075087A (en) | Pressurizing device and pressure method | |
| CN209257650U (en) | A kind of touch-control display module joint tool | |
| CN207483608U (en) | A kind of 3D glass heats bender and its heat pressing forming device | |
| CN207364732U (en) | A kind of cushion block, lamp bar, backlight module and display |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY Effective date: 20150716 Owner name: JINGDONGFANG SCIENCE AND TECHNOLOGY GROUP CO., LTD Free format text: FORMER OWNER: BEIJING BOE PHOTOELECTRICITY SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150716 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150716 Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No. Patentee after: BOE TECHNOLOGY GROUP Co.,Ltd. Patentee after: BEIJING BOE OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 100176 Beijing city Daxing District economic and Technological Development Zone of Beijing Road No. 8 Patentee before: BEIJING BOE OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121226 |