CN202573078U - Thermal pressure mold capable of being repeatedly used - Google Patents
Thermal pressure mold capable of being repeatedly used Download PDFInfo
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- CN202573078U CN202573078U CN 201220006737 CN201220006737U CN202573078U CN 202573078 U CN202573078 U CN 202573078U CN 201220006737 CN201220006737 CN 201220006737 CN 201220006737 U CN201220006737 U CN 201220006737U CN 202573078 U CN202573078 U CN 202573078U
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Abstract
The utility model discloses a thermal pressure mold capable of being repeatedly used. The thermal pressure mold comprises an outer mold and an inner mold, wherein the outer mold is a cylindrical body with a center hole, the center hole is a cylindrical through hole, the hole is in a square shape or a rectangular shape, and four edge corner parts of the hole are cut into chamfer angles. The appearance of the inner mold is completely identical to the shape of the center hole of the outer mold, the outer wall of the inner mold is in interference fit with the inner wall of the outer mold, the side surface of the inner mold is provided with a center cylindrical through hole in the direction vertical to the center hole of the outer mold, the hole is in a square shape or a rectangular shape, four edge corner parts of the hole need to be cut into chamfer angles, and a sample is in interference fit with the inner surface of the center cylindrical through hole of the inner mold. The thermal pressure mold has the advantages that a mold cavity has larger size, and the uniform deformation is only generated in the specific direction, so the reusability of the mold is ensured.
Description
Technical field
The present invention relates to a kind of thermic pressure mould.
Background technology
The diamond anvil that existing high pressure generating apparatus mainly contains the cubic apparatus that uses on the engineering and top, two sides equipment and is used for laboratory research; The basic principle of these equipment all is through extraneous work done; Make the inner high pressure that produces of die cavity; This principle has determined these equipment can not take into account mold cavity volume and die cavity internal pressure, and pressure was less when promptly mold cavity volume was big, and pressure when big mold cavity volume less.
In order to address this problem; The applicant has proposed a kind of method of utilizing the material principle of expanding with heat and contracting with cold to produce pressure in 2006; Obtained invention patent mandate, the patent No. is ZL 2,006 1 0166214, after the fixed thermic pressure apparatus of assembling filled type thermic pressure apparatus and straight pin has been proposed in 2008 again; All obtained the utility model patent mandate, the patent No. is respectively ZL 2,008 2 0021410.4 and ZL 2,008 2 0021408.7.These patent designs all need mold materials to be done machineds such as boring and turning in the final stage of making, so require the hardness of mold materials can not be too high.Yet the intensity of thermic pressure mould pressure inside and mold materials and hardness are closely related in actual use; In order to improve the die cavity pressure inside as far as possible; Need to improve the intensity and the hardness of mold materials self; Propose a kind ofly can to realize the interference encapsulation from structural design, again the effective scheme of cutting processing.
On the other hand, because thermic pressure apparatus inside can produce the pressure of GPa level, as shown in Figure 1; Even adopt the mold materials of high rigidity; Use the back mould still can deform inevitably, to shown in Figure 4, this can cause two consequences like Fig. 2: 1) sample is difficult to from the thermic pressure mould, take out; In order not influence the stress of sample, often need adopt machinery to cut mould open and take out sample; 2) design of above-mentioned three patents of employing, it all is uneven using the distortion of back mould, even do not dissect mould, the mould after the inhomogeneous deformation can not be reused.
In addition; In order to obtain higher thermic pressure and more effectively to increase the volume of mould inside die cavity; Be necessary to adopt high-intensity mold materials, enlarged cavity is to increase the volume of handling sample, from the design of structure and processing method improvement thermic pressure mould as much as possible; Through controlling the distortion of mould effectively, improve the repeat usage of mould.
Summary of the invention
In order to overcome existing deficiency; The present invention proposes a kind of die design schemes that can produce bigger thermic pressure, and die cavity has bigger volume, through the distortion of control mould; Make its direction generation homogeneous deformation, thereby guarantee the reusability of mould in appointment.
The technical solution adopted for the present invention to solve the technical problems is: comprise outer mold and inner mold, outer mold is shaped as the column of a band centre bore, does not limit the outer shape of outer mold, can be cylinder or cuboid; Centre bore is a column through hole, the hole be shaped as square or rectangular, cause the mould cracking too early in order to prevent that stress from concentrating, four edges and corners in hole need cut into chamfering.The profile of inner mold and the center hole shape of outer mold are identical, and inner mold outer wall and outer mold inwall need interference fit; At inner mold lateral vertical center column through hole of direction processing in the outer mold centre bore; The hole be shaped as square or rectangular; Cause the mould cracking too early in order to prevent that stress from concentrating equally; Four edges and corners in hole need cut into chamfering, and when the inner mold central through hole was rectangle, rectangular long limit and short side direction are not special to be limited.
When mould uses, earlier sample is placed in the inner mold centre bore, can make the horizontal jumping-up of sample, to guarantee that sample is interference with the inner surface of inner mold center column through hole and contacts through impressed pressure.Sample is packed into behind the column through hole of inner mold center; Sample expansion radially will receive the restriction of inner mold, and the axial retractable still of sample this moment is packed inner mold in the outer mold centre bore into then; The axial expansion of sample will receive the restriction of outer mold inwall at this moment; Through above-mentioned fit, sample all directions under the situation of being heated that are positioned at whole device heart portion all receive the restriction of mould, and can not free wxpansion.
The formulation of die size depends primarily on the requirement to the die cavity internal pressure, and chamfer dimesion depends on the requirement to preventing that stress from concentrating.In order to prevent owing to die deformation weakens the restriction to sample, can adopt the mode that directly mould inner wall is loaded to carry out finite element modelling according to desired thermic pressure size when formulating size, suitably adjust wall thickness according to the distortion situation of mould.From improving the angle of die cavity internal pressure, the distortion of mould is more little good more.
Controlled and even for the distortion that makes mould, should guarantee following 2 points:
1) outer mold thickness should make distortion concentrate on inner mold greater than the thickness of inner mold;
2) on the direction vertical with the inner mold through hole; The wall thickness that has two groups of inner molds, wherein one group outer surface contacts with the outer mold inwall, and the wall thickness of this group inner mold must equate; And the outer surface of another group is under no restraint after assembling; Require the former wall thickness to make the former become the most yielding weak district of whole device, in other words less than the latter's wall thickness; Behind the inner generation of device thermic pressure, with preferentially elongating this group inner mold side that contacts with the outer mold inwall homogeneous deformation takes place.
The material requirements conduction of outer mold and inner mold, the standard of selecting mold materials for use is that its high temperature hardness is higher than sample, and thermal coefficient of expansion is lower than sample, and the modular ratio sample is high.Strengthening the Technology for Heating Processing of mold materials should formulate according to the situation of selected mold materials.
The processing request of mould and sample:
1) can interference be enclosed in mould inside in order to ensure sample, need interference fit between sample and inner mold, inner mold and the outer mold;
2) can interference be enclosed in mould inside in order to ensure sample; In four sides that processed sample contacts with inner mold, during the inner surface of four sides that inner surface, sample and the inner mold assembly of inner mold centre bore contact with outer mold and outer mold centre bore; All must accomplish the processing of four faces through disposable line cutting of programming or grinding, to guarantee the parallel and vertical relation between these faces.
The invention has the beneficial effects as follows:
Have very big pressure because thermic pressure mould die cavity is inner, so mould can produce distortion inevitably, this distortion comprises strain and plastic deformation; The present invention proposes a kind of new approaches of controlling die deformation, at first is through improving the hardness of mold materials, making it be difficult to deform; Secondly aspect size design, make it be difficult to distortion, on the wall thickness of inner mold, have a mind to make one group of wall thickness to become the most yielding zone of whole device then through the wall thickness that increases outer mold; Distortion is concentrated occur in inner mold; And be homogeneous deformation, and inner at the centre bore of inner mold, even local distortion is uneven; When reusing, also can guarantee the interference fit of sample and inner mold by the jumping-up when loading sample, thereby inner mold can be reused.
Three kinds of thermic pressure apparatus that new mould structure simplicity of design, mold cavity volume propose than before are big, because the main line that adopts cuts or grinding; Can use outer mold in the material behind the heat treatment reinforcement; Give full play to the restriction of high rigidity mold materials, improve thermic pressure mould die cavity pressure inside, when adopting line cutting mode processing mold endoporus the sample thermal expansion; Do not receive the restriction of size in the longitudinal direction of grinding endoporus; Be more suitable for handling long sample, under the prerequisite that guarantees assembly precision, can increase mold cavity volume effectively.And it is concentrated that the structural design of scheme has avoided mould to produce obvious stress in the part; Material therefor is cheap; And the main contact-making surface of a whole set of mould is the plane; Sample takes out easily, realizes more easily assembling and disassembling, and new die is applicable to the influence of laboratory research high pressure to material microstructure and macro property.
Below in conjunction with accompanying drawing and embodiment the present invention is further specified.
Description of drawings
Fig. 1 is the Molecular Dynamics Calculation curve of plus load and fine aluminium volume compressibility relation;
Fig. 2 is the distortion situation of device under the effect of 500MPa pressure of producing pressure by using temperature caused expansion and contraction, and Fig. 2 (a) is the device sketch map, and Fig. 2 (b) is the outer mold deformation result of finite element modelling;
Fig. 3 is the distortion situation of straight pin under the effect of 500MPa pressure in the fixed thermic pressure apparatus of straight pin; Fig. 3 (a) is the fixed thermic pressure apparatus of straight pin, only shows the sectional view of the stressed back finite element analysis of the half time straight pin that contacts with sample among Fig. 3 (b);
Fig. 4 is the distortion situation of left and right sides filling block under the effect of 500MPa pressure in the assembling filled type thermic pressure apparatus; Fig. 4 (a) is the sketch map of assembling filled type thermic pressure apparatus, the left and right sides filling block that Fig. 4 (b) demonstration contacts with sample and the finite element modelling result of outer mold;
Fig. 5 is a kind of shaped design sketch map of reusable thermic pressure mould;
Fig. 6 is the inner mold and the translucent overlapping comparison diagram of sample sets zoarium before and after experiment of reusable thermic pressure mould; Fig. 6 (a) is sample and the scintigram of inner mold assembly before and after experiment that adopts translucent method stack; Its left side alignment; Fig. 6 (b) is the partial enlarged drawing of A frame among Fig. 6 (a), and Fig. 6 (c) is the partial enlarged drawing of B frame among Fig. 6 (a);
Fig. 7 is a kind of size design figure of new departure, and Fig. 7 (a) is the inner mold front view, and Fig. 7 (b) is the inner mold vertical view, and Fig. 7 (c) is the outer mold front view, and Fig. 7 (d) is the outer mold vertical view;
Fig. 8 is the distortion situation of new departure at 500MPa pressure effect bed die, and Fig. 8 (a) is the original state figure of stressed preceding inner mold, and Fig. 8 (b) is the finite element modelling result of stressed back inner mold.
The specific embodiment
Can not too high this deficiency to the used mold materials intensity of present thermic pressure mould and hardness; The present invention proposes a kind of new design of reusable thermic pressure mould, adopt outer mold in the material behind heat treatment reinforcement, improve thermic pressure mould pressure inside value; With line cutting or grinding mode; Realize the processing of mould, because wire-electrode cutting and processing method does not receive the restriction of the strength of materials and hardness, making high hardness material make inside and outside mould becomes possibility; Through improving the intensity and the hardness of mold materials, be expected at the bigger pressure of the inner generation of thermic pressure mould.
The present invention guarantees the controllability of die deformation from design; On purpose make a direction the most yielding; And guarantee that this distortion is uniformly, make distortion all concentrate on this direction, enlarge the inner volume of die cavity on this basis through the size of regulating and control mould.Design can be guaranteed the mould repeated use, mainly is applicable to the influence of research pressure environment to material microstructure and macro property.
Entire die of the present invention is made up of outer mold and inner mold two parts, and is as shown in Figure 5, and wherein, outer mold is shaped as the column of a band centre bore, does not limit the outer shape of outer mold, can be cylinder or cuboid; Centre bore is a column through hole, and the shape in hole can be square or rectangular, causes the mould cracking too early in order to prevent that stress from concentrating, and four sharp corners in hole need cut into chamfering.The profile of inner mold and the center hole shape of outer mold are identical, and inner mold outer wall and outer mold inwall need interference fit; At inner mold lateral vertical center column through hole of direction processing in the outer mold centre bore; The shape in hole can be square or rectangular; Cause the mould cracking too early in order to prevent that stress from concentrating equally; Four sharp corners in hole need cut into chamfering, and when the inner mold central through hole was rectangle, rectangular long limit and short side direction are not special to be limited.
When mould uses, earlier sample is placed in the inner mold centre bore, can make the horizontal jumping-up of sample, to guarantee that sample is interference with the inner mold inner surface and contacts through impressed pressure.Sample is packed into behind the inner mold centre bore; Sample expansion radially will receive the restriction of inner mold, and the axial retractable still of sample this moment is packed inner mold in the outer mold centre bore into then; The axial expansion of sample will receive the restriction of outer mold inwall at this moment; Through above-mentioned fit, sample all directions under the situation of being heated that are positioned at whole device heart portion all receive the restriction of mould, and can not free wxpansion.
The formulation of die size depends primarily on the requirement to the die cavity internal pressure, and chamfer dimesion depends on the requirement to preventing that stress from concentrating.In order to prevent owing to die deformation weakens the restriction to sample, can adopt the mode that directly mould inner wall is loaded to carry out finite element modelling according to desired thermic pressure size when formulating size, suitably adjust wall thickness according to the distortion situation of mould.From improving the angle of die cavity internal pressure, the distortion of mould is more little good more.
Controlled and even for the distortion that makes mould, should guarantee following 2 points:
1) outer mold thickness should make distortion concentrate on inner mold greater than the thickness of inner mold;
2) as shown in Figure 5, on the direction vertical, there is the wall thickness of two groups of inner molds with the inner mold through hole; Wherein one group outer surface contacts with the outer mold inwall; Wall thickness of this group inner mold must equate that and the outer surface of another group is under no restraint after assembling, require the former wall thickness must be less than the latter's wall thickness; Make the former become the most yielding weak district of whole device; In other words, behind the inner generation of device thermic pressure, with preferentially elongating this group inner mold side that contacts with the outer mold inwall homogeneous deformation takes place.
Mold materials requires conduction, and the standard of selecting mold materials for use is that its high temperature hardness is higher than sample, and thermal coefficient of expansion is lower than sample, and the modular ratio sample is high.Strengthening the Technology for Heating Processing of mold materials should formulate according to the situation of selected mold materials.
The processing request of mould and sample:
1) can interference be enclosed in mould inside in order to ensure sample, need interference fit between sample and inner mold, inner mold and the outer mold;
2) can interference be enclosed in mould inside in order to ensure sample; In four sides that processed sample contacts with inner mold, during the inner surface of four sides that inner surface, sample and the inner mold assembly of inner mold centre bore contact with outer mold and outer mold centre bore; All must accomplish the processing of four faces through the disposable line cutting of programming, to guarantee the parallel and vertical relation between these faces.
Fig. 1 is the Molecular Dynamics Calculation curve of plus load and fine aluminium volume compressibility relation, and arrow is represented when the fine aluminium volumetric expansion is limited fully, with the pressure that needs 4GPa.
Fig. 2 is the distortion situation of the device (patent No. ZL 2,006 1 0166214) of producing pressure by using temperature caused expansion and contraction after stressed, and Fig. 2 (a) is the device sketch map, wherein the 1-inner mold; The 2-sample, 3-outer mold, Fig. 2 (b) they are the outer mold deformation result of finite element modelling; Under 500 MPa pressure effects; Tangible plastic deformation has taken place in outer mold, and the distortion be uneven arc, the outside maximum displacement of outer mold inwall is 0.18mm.
Fig. 3 is the situation of straight pin distortion in the fixed thermic pressure apparatus of straight pin (patent No. ZL 2,008 2 0021408.7), and Fig. 3 (a) is the fixed thermic pressure apparatus of straight pin, wherein 1-centre bore; The 2-mould, 3-straight pin, 4-sample; The sectional view that only shows the half time straight pin that contacts with sample among Fig. 3 (b); Wherein be the contact area of straight pin and sample in the centre position at top, under the effect of 500MPa pressure, tangible plastic deformation has taken place in the contact area of straight pin; And distortion is uneven arc, and the measured value of maximum displacement and 0.04mm matches.
Fig. 4 is the situation of filling block distortion in the left and right sides in the assembling filled type thermic pressure apparatus (patent No. ZL 2,008 2 0021410.4), and Fig. 4 (a) is the sketch map of assembling filled type thermic pressure apparatus, wherein 1-outer mold; Filling block in the middle of the 2-; 3-left and right sides filling block, 4-sample, the left and right sides filling block that Fig. 4 (b) demonstration contacts with sample and the finite element modelling result of outer mold; Under 500 MPa pressure effects; Plastic deformation has taken place in left and right sides filling block, and distortion is uneven arc, and outwards maximum displacement reaches 0.08mm.
Fig. 5 is a kind of shaped design sketch map of reusable thermic pressure mould.
Fig. 6 is inner mold and the translucent overlapping comparison diagram of sample sets zoarium before and after experiment; Image is the scintigram of 2400dpi resolution ratio; Fig. 6 is sample and the scintigram of inner mold assembly before and after experiment that adopts translucent method stack a); Fig. 6 b) be a) partial enlarged drawing of middle A frame of figure, Fig. 6 c) be a) partial enlarged drawing of middle B frame of figure.As can be seen from Figure 6 with direction that outer mold contacts on the outline of inner mold do not have perceptible distortion; And moving of about 0.30mm taken place in the inner surface of right side inner mold (i.e. A position among the figure) significantly among Fig. 6; At the free outer surface of inner mold (i.e. figure in B position) extremely small moving (< 0.10mm) is arranged also; Should be noted that; This distortion is to concentrate on free that direction of inner mold, does not therefore influence the interference fit of inside and outside mould contact surface when reusing.
Fig. 7 is a kind of size design figure of new departure, and Fig. 7 (a) is the inner mold front view, and Fig. 7 (b) is the inner mold vertical view, and Fig. 7 (c) is the outer mold front view, and Fig. 7 (d) is the outer mold vertical view.
Fig. 8 is the situation of new departure in the distortion of 500MPa pressure effect bed die, and Fig. 8 (a) is the original state figure of stressed preceding inner mold, and Fig. 8 (b) is the finite element modelling result of stressed back inner mold; Figure can find out about contrast; Stressed back inner mold does not have perceptible plastic deformation at width, and under the effect of 500MPa pressure, inner mold on the short transverse plastic deformation has taken place in the drawings; And plastic deformation is uniformly, becomes 141.76mm by original 140.00mm.
Select the 42CrMo steel for use, bore central through hole in its annealed state, then to its quenching and tempering; Improve the intensity and the hardness of material, concrete technology is to be heated to 850 ° of C insulation 30min, and oil quenching is to room temperature; Be heated to 540 ° of C insulation 90min again, water-cooled adopts wire-electrode cutting and processing method to be processed into the inside and outside mould of thermic pressure apparatus to room temperature at last; Concrete size is as shown in Figure 7, and inner mold thickness is the zone that the wall of 28mm will become preferential distortion among the figure.Finite element analysis shows: when load reaches 500MPa in the cavity; Thickness is that the wall of 28mm is evenly stretched; As shown in Figure 8; As can be seen from Figure 8 inner mold up and down the inner surface up and down in two free end faces and the cavity still keep straightened condition, the inner mold height between two free end faces up and down becomes 141.76mm by initial 140.00mm.
Fig. 2 to Fig. 4 is the distortion situation of former thermic pressure apparatus after stressed, and when load in the cavity was 500MPa, tangible inhomogeneous deformation had all taken place these devices, influences the assembly precision in the follow-up use, therefore can't reuse.
Through relatively finding out significantly, with former thermic pressure apparatus contrast, the design that this patent proposes can guarantee the uniformity of inner mold distortion effectively, can reuse thereby guarantee it.
Claims (5)
1. a reusable thermic pressure mould comprises outer mold and inner mold, it is characterized in that: outer mold is the column of a band centre bore, and centre bore is a column through hole, the hole be shaped as square or rectangular, four edges and corners in hole cut into chamfering; The profile of inner mold and the center hole shape of outer mold are identical; Inner mold outer wall and outer mold inwall interference fit; At inner mold lateral vertical center column through hole of direction processing in the outer mold centre bore; The hole be shaped as square or rectangular, four edges and corners in hole need cut into chamfering, sample contacts with the inner surface interference of inner mold center column through hole.
2. reusable thermic pressure mould according to claim 1 is characterized in that: described outer mold thickness is greater than the thickness of inner mold.
3. reusable thermic pressure mould according to claim 1; It is characterized in that: on the vertical direction of described inner mold through hole; The wall thickness of the one group of inner mold that contacts with the outer mold inwall equates, and wall thickness is less than the wall thickness of the one group of inner mold that does not contact with the outer mold inwall.
4. reusable thermic pressure mould according to claim 1 is characterized in that: described outer mold and inner mold material conduction, and its high temperature hardness is higher than sample, and thermal coefficient of expansion is lower than sample, and the modular ratio sample is high.
5. reusable thermic pressure mould according to claim 1 is characterized in that: four sides that four sides that described sample contacts with inner mold, the inner surface of inner mold centre bore, sample and inner mold assembly contact with outer mold and the inner surface of outer mold centre bore all must be through disposable line cutting or grinding completion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220006737 CN202573078U (en) | 2012-01-08 | 2012-01-08 | Thermal pressure mold capable of being repeatedly used |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220006737 CN202573078U (en) | 2012-01-08 | 2012-01-08 | Thermal pressure mold capable of being repeatedly used |
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| CN202573078U true CN202573078U (en) | 2012-12-05 |
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| CN 201220006737 Expired - Lifetime CN202573078U (en) | 2012-01-08 | 2012-01-08 | Thermal pressure mold capable of being repeatedly used |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102529145A (en) * | 2012-01-08 | 2012-07-04 | 西北工业大学 | Reusable thermal pressure mould |
| CN104827551A (en) * | 2015-05-27 | 2015-08-12 | 中国一冶集团有限公司 | Heating furnace stand column diking inner mold easy to assemble and disassemble and operation method thereof |
| CN106457725A (en) * | 2014-03-25 | 2017-02-22 | 住友电工烧结合金株式会社 | Stepped die |
-
2012
- 2012-01-08 CN CN 201220006737 patent/CN202573078U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102529145A (en) * | 2012-01-08 | 2012-07-04 | 西北工业大学 | Reusable thermal pressure mould |
| CN106457725A (en) * | 2014-03-25 | 2017-02-22 | 住友电工烧结合金株式会社 | Stepped die |
| CN106457725B (en) * | 2014-03-25 | 2018-08-28 | 住友电工烧结合金株式会社 | Stairstepping mold |
| CN104827551A (en) * | 2015-05-27 | 2015-08-12 | 中国一冶集团有限公司 | Heating furnace stand column diking inner mold easy to assemble and disassemble and operation method thereof |
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Effective date of registration: 20210507 Address after: 264400 Shandong Weihai Nanhai New District Binhai Road North, Longhai Road East Patentee after: Weihai Blue Valley Material Analysis Research Institute Co.,Ltd. Address before: 710072 No. 127 Youyi West Road, Shaanxi, Xi'an Patentee before: Northwestern Polytechnical University |
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| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121205 |
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| CX01 | Expiry of patent term |